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LGA 2066
LGA 2066, also called ''Socket R4'', is a CPU socket by Intel that debuted with Skylake-X and Kaby Lake-X processors in June 2017. It replaces Intel's LGA 2011-3 (R3) in the performance, high-end desktop and Workstation platforms (based on the X299 "Basin Falls" and C422 chipsets), while LGA 3647 (Socket P) replaces LGA 2011-3 (R3) in the server platforms based on Skylake-SP (Xeon "Purley"). Compatible processors High-End Desktop (HEDT) All of these CPUs require the Intel X299 chipset to work. So, the C422 chipset is strictly limited to work with workstation processors only. Kaby Lake-X Kaby Lake-X processors were discontinued in May 2018. Starting October 2019, BIOS In computing, BIOS (, ; Basic Input/Output System, also known as the System BIOS, ROM BIOS, BIOS ROM or PC BIOS) is a type of firmware used to provide runtime services for operating systems and programs and to perform hardware initialization d ... updates for most of the X299-based motherboards removed s ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Flip Chip
Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, is a method for interconnecting dies such as semiconductor devices, IC chips, integrated passive devices and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads. The technique was developed by General Electric's Light Military Electronics Department, Utica, New York. The solder bumps are deposited on the chip pads on the top side of the wafer during the final wafer processing step. In order to mount the chip to external circuitry (e.g., a circuit board or another chip or wafer), it is flipped over so that its top side faces down, and aligned so that its pads align with matching pads on the external circuit, and then the solder is reflowed to complete the interconnect. This is in contrast to wire bonding, in which the chip is mounted upright and fine wires are welded onto the chip pads and lead frame contacts to interconne ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Kaby Lake
Kaby Lake is Intel's codename for its seventh generation Core microprocessor family announced on August 30, 2016. Like the preceding Skylake, Kaby Lake is produced using a 14 nanometer manufacturing process technology. Breaking with Intel's previous " tick–tock" manufacturing and design model, Kaby Lake represents the optimized step of the newer process–architecture–optimization model. Kaby Lake began shipping to manufacturers and OEMs in the second quarter of 2016, with its desktop chips officially launched in January 2017. In August 2017, Intel announced Kaby Lake Refresh ( Kaby Lake R) marketed as the 8th generation mobile CPUs, breaking the long cycle where architectures matched the corresponding generations of CPUs and meanwhile also supporting Windows 11. Skylake was anticipated to be succeeded by the 10 nanometer Cannon Lake, but it was announced in July 2015 that Cannon Lake had been delayed until the second half of 2017. In the meantime, Intel released a fou ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Trusted Execution Technology
Intel Trusted Execution Technology (Intel TXT, formerly known as LaGrande Technology) is a computer hardware technology of which the primary goals are: * Attestation of the authenticity of a platform and its operating system. * Assuring that an authentic operating system starts in a trusted environment, which can then be considered trusted. * Provision of a trusted operating system with additional security capabilities not available to an unproven one. Intel TXT uses a Trusted Platform Module (TPM) and cryptographic techniques to provide measurements of software and platform components so that system software as well as local and remote management applications may use those measurements to make trust decisions. It complements Intel Management Engine. This technology is based on an industry initiative by the Trusted Computing Group (TCG) to promote safer computing. It defends against software-based attacks aimed at stealing sensitive information by corrupting system or BIOS code ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Cascade Lake (microarchitecture)
Cascade Lake is an Intel codename for a 14 nm server, workstation and enthusiast processor generation, launched in April 2019. In Intel's process–architecture–optimization model, Cascade Lake is an optimization of Skylake. Intel states that this will be their first generation to support 3D XPoint 3D XPoint (pronounced ''three-D cross point'') was a discontinued non-volatile memory (NVM) technology developed jointly by Intel and Micron Technology. It was announced in July 2015 and was available on the open market under the brand name Opt ...-based memory modules. It also features Deep Learning Boost (DPL) instructions and mitigations for Meltdown and Spectre. Intel officially launched new Xeon Scalable SKUs on February 24, 2020. Variants *Server: Cascade Lake-SP, Cascade Lake-AP *Workstation: Cascade Lake-W *Enthusiast: Cascade Lake-X List of Cascade Lake processors Cascade Lake-X (Enthusiast) Cascade Lake-AP (Advanced Performance) Cascade Lake-AP is branded a ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Skylake (microarchitecture)
Skylake is Intel's codename for its sixth generation Core microprocessor family that was launched on August 5, 2015, succeeding the Broadwell microarchitecture. Skylake is a microarchitecture redesign using the same 14 nm manufacturing process technology as its predecessor, serving as a tock in Intel's tick–tock manufacturing and design model. According to Intel, the redesign brings greater CPU and GPU performance and reduced power consumption. Skylake CPUs share their microarchitecture with Kaby Lake, Coffee Lake, Whiskey Lake, and Comet Lake CPUs. Skylake is the last Intel platform on which Windows earlier than Windows 10 are officially supported by Microsoft, although enthusiast-created modifications are available that disabled the Windows Update check and allowed Windows 8.1 and earlier to continue to receive Windows Updates on this and later platforms. Some of the processors based on the Skylake microarchitecture are marketed as sixth-generation Core. ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Turbo Boost
Intel Turbo Boost is Intel's trade name for central processing units' (CPUs') dynamic frequency scaling feature that automatically raises certain versions of its operating frequency when demanding tasks are running, thus enabling a higher resulting performance. The frequency is accelerated when the operating system requests the highest performance state of the processor. Processor performance states are defined by the Advanced Configuration and Power Interface (ACPI) specification, an open standard supported by all major operating systems; no additional software or drivers are required to support the technology. The design concept behind Turbo Boost is commonly referred to as "dynamic overclocking". When the workload on the processor calls for faster performance, the processor's clock will try to increase the operating frequency in regular increments as required to meet demand. The increased clock rate is limited by the processor's power, current, and thermal limits, the num ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
BIOS
In computing, BIOS (, ; Basic Input/Output System, also known as the System BIOS, ROM BIOS, BIOS ROM or PC BIOS) is a type of firmware used to provide runtime services for operating systems and programs and to perform hardware initialization during the booting process (power-on startup). The firmware comes pre-installed on the computer's motherboard. The name originates from the Basic Input/Output System used in the CP/M operating system in 1975. The BIOS firmware was originally proprietary to the IBM PC; it was reverse engineered by some companies (such as Phoenix Technologies) looking to create compatible systems. The interface of that original system serves as a ''de facto'' standard. The BIOS in older PCs initializes and tests the system hardware components ( power-on self-test or POST for short), and loads a boot loader from a mass storage device which then initializes a kernel. In the era of DOS, the BIOS provided BIOS interrupt calls for the keyboard, display, st ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
LGA 3647
LGA 3647 is an Intel microprocessor compatible socket Socket may refer to: Mechanics * Socket wrench, a type of wrench that uses separate, removable sockets to fit different sizes of nuts and bolts * Socket head screw, a screw (or bolt) with a cylindrical head containing a socket into which the hexag ... used by Xeon Phi x200 ("Knights Landing"), Xeon Phi 72x5 ("Knights Mill"), Skylake-SP, Cascade Lake-SP, and Cascade Lake-W microprocessors. The socket supports a 6-channel memory controller, non-volatile 3D XPoint memory DIMMs, Intel Ultra Path Interconnect (UPI), as a replacement for Quick Path Interconnect (QPI), and 100G Omni-Path interconnect and also has a new mounting mechanism which does not use a lever to secure it in place but the CPU cooler's pressure and its screws to secure it in place. Variants There are two sub-versions of this socket with differences also in the ILM ( Independent Loading Mechanism, pitch of center screws changed slightly and a more vi ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Intel X299
Intel X299, List of Intel codenames, codenamed "Basin Falls", is a Platform Controller Hub (PCH) designed and manufactured by Intel, targeted at the high-end desktop (HEDT) or enthusiast segment of the Intel product lineup. The X299 chipset supports the Skylake-X, Intel Core X-series Central processing unit, processors, which are codenamed Skylake (microarchitecture), Skylake-X, Kaby Lake, Kaby Lake-X and Cascade Lake (microarchitecture), Cascade Lake-X. All supported processors use the LGA 2066 CPU socket, socket. The X299 chipset was released in June 2017, with the Intel Core i9, Intel Core i9-7900X. See also * List of Intel chipsets Features The X299 chipset uses the new Direct Media Interface (DMI) 3.0. 24 PCI Express, PCI Express 3.0 lanes are provided by the chipset, a sizable increase from the Intel X99, X99 chipset's 8 PCI-e 2.0 lanes. Many features from the X99 chipset are carried over to the X299 chipset. These include: * M.2 * USB 3.0 and 2.0 support * Flexible I ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Skylake-X
Skylake is List of Intel codenames, Intel's codename for its sixth generation Intel Core, Core microprocessor family that was launched on August 5, 2015, succeeding the Broadwell (microarchitecture), Broadwell microarchitecture. Skylake is a microarchitecture redesign using the same 14 nanometer, 14 nm Semiconductor device fabrication, manufacturing process technology as its predecessor, serving as a tock in Intel's Tick–tock model, tick–tock manufacturing and design model. According to Intel, the redesign brings greater CPU and GPU performance and reduced power consumption. Skylake CPUs share their microarchitecture with Kaby Lake, Coffee Lake, Whiskey Lake (microarchitecture), Whiskey Lake, and Comet Lake CPUs. Skylake is the last Intel platform on which Windows earlier than Windows 10 are officially supported by Microsoft, although enthusiast-created modding, modifications are available that disabled the Windows Update check and allowed Windows 8.1 and earlier to cont ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Land Grid Array
The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket (when a socket is used) — as opposed to pins on the integrated circuit, known as a '' pin grid array'' (PGA). An LGA can be electrically connected to a printed circuit board (PCB) either by the use of a socket or by soldering directly to the board. Description The ''land grid array'' is a packaging technology with a grid of contacts, 'lands', on the underside of a package. The contacts are to be connected to a grid of contacts on the PCB. Not all rows and columns of the grid need to be used. The contacts can either be connected by using an LGA socket, or by surface-mount soldering using solder paste. The grid elements found in use can be e.g. circular, triangular or other polygonal shapes and might have even different sizes. Grids might sometimes appear like honey comb patterns. Designs are often optimized for factors like contact likelin ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Intel Corporation
Intel Corporation is an American multinational corporation and technology company headquartered in Santa Clara, California, and incorporated in Delaware. Intel designs, manufactures, and sells computer components such as central processing units (CPUs) and related products for business and consumer markets. It is one of the world's largest semiconductor chip manufacturers by revenue, and ranked in the ''Fortune'' 500 list of the largest United States corporations by revenue for nearly a decade, from 2007 to 2016 fiscal years, until it was removed from the ranking in 2018. In 2020, it was reinstated and ranked 45th, being the 7th-largest technology company in the ranking. It was one of the first companies listed on Nasdaq. Intel supplies microprocessors for most manufacturers of computer systems, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). It also manufactures chipsets, network interface controllers, fl ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
