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Land Grid Array
The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket (when a socket is used) rather than the integrated circuit. An LGA can be electrically connected to a printed circuit board (PCB) either by the use of a socket or by soldering directly to the board. Description The ''land grid array'' is a packaging technology with a grid of contacts, 'lands', on the underside of a package. The contacts are to be connected to a grid of contacts on the PCB. Not all rows and columns of the grid need to be used. The contacts can either be made by using an LGA socket, or by using solder paste. The grid elements found in use can be e.g. circular, triangular or other polygonal shapes and might have even different sizes. Grids might sometimes appear like honey comb patterns. Designs are often optimized for factors like contact likeliness despite tolerances, electrical gap to neighboring contacts and for allowing ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
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R10000
The R10000, code-named "T5", is a RISC microprocessor implementation of the MIPS IV instruction set architecture (ISA) developed by MIPS Technologies, Inc. (MTI), then a division of Silicon Graphics, Inc. (SGI). The chief designers are Chris Rowen and Kenneth C. Yeager. The R10000 microarchitecture is known as ANDES, an abbreviation for Architecture with Non-sequential Dynamic Execution Scheduling. The R10000 largely replaces the R8000 in the high-end and the R4400 elsewhere. MTI was a fabless semiconductor company; the R10000 was fabricated by NEC and Toshiba. Previous fabricators of MIPS microprocessors such as Integrated Device Technology (IDT) and three others did not fabricate the R10000 as it was more expensive to do so than the R4000 and R4400. History The R10000 was introduced in January 1996 at clock frequencies of 175 MHz and 195 MHz. A 150 MHz version was introduced in the O2 product line in 1997, but discontinued shortly after due to customer ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
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Socket TR4
Socket TR4, also known as ''Socket SP3r2'', is a zero insertion force land grid array (LGA) CPU socket designed by AMD supporting its first- and second-generation Zen-based Ryzen Threadripper desktop processors, launched on August 10, 2017 for the high-end desktop and workstation platforms. It was succeeded by Socket sTRX4 for the third generation of Ryzen Threadripper processors. Socket TR4 is AMD's second LGA socket for a consumer product after the short lived Socket 1207 FX. It is physically identical to, but electrically incompatible with both AMD's server Socket SP3, and Socket TR4's successor socket, Socket sTRX4. While Socket SP3 does not require a chipset, instead utilising a system-on-a-chip design, Socket TR4 and its successor require a chipset to provide improved functionality. For Socket TR4, the AMD X399 chipset was developed, which supports a total of 64 PCIe 4.0 lanes for quad SLI/CrossFire configurations. The socket is made by both Foxconn and Lotes. S ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
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LGA 2066
LGA 2066, also called ''Socket R4'', is a CPU socket by Intel that debuted with Skylake-X and Kaby Lake-X processors in June 2017. It replaces Intel's LGA 2011-3 (R3) in the performance, high-end desktop and Workstation platforms (based on the X299 "Basin Falls" and C422 chipsets), while LGA 3647 (Socket P) replaces LGA 2011-3 (R3) in the server platforms based on Skylake-SP (Xeon "Purley"). Compatible processors High-End Desktop (HEDT) All of these CPUs require the Intel X299 chipset to work. So, the C422 chipset is strictly limited to work with workstation processors only. Kaby Lake-X Kaby Lake-X processors were discontinued in May 2018. Starting October 2019, BIOS updates for most of the X299-based motherboards removed support for Kaby Lake-X processors. [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
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Skylake-X
Skylake is the codename used by Intel for a processor microarchitecture that was launched in August 2015 succeeding the Broadwell microarchitecture. Skylake is a microarchitecture redesign using the same 14 nm manufacturing process technology as its predecessor, serving as a tock in Intel's tick–tock manufacturing and design model. According to Intel, the redesign brings greater CPU and GPU performance and reduced power consumption. Skylake CPUs share their microarchitecture with Kaby Lake, Coffee Lake, Cannon Lake, Whiskey Lake, and Comet Lake CPUs. Skylake is the last Intel platform on which Windows earlier than Windows 10 will be officially supported by Microsoft, although enthusiast-created modifications exist that allow Windows 8.1 and earlier to continue to receive Windows Updates on later platforms. Some of the processors based on the Skylake microarchitecture are marketed as 6th-generation Core. Intel officially declared end of life and discontinued Sky ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
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Alder Lake (microprocessor)
Alder Lake is Intel's codename for the 12th generation of Intel Core processors based on a hybrid architecture utilizing Golden Cove performance cores and Gracemont efficient cores. It is fabricated using Intel's Intel 7 process, previously referred to as Intel 10 nm Enhanced SuperFin (10ESF). The 10ESF has a 10%-15% boost in performance over the 10SF used in the mobile Tiger Lake processors. Intel officially announced 12th Gen Intel Core CPUs on October 27, 2021. Intel officially announced 12th Gen Intel Core mobile CPUs and non-K series desktop CPUs on January 4, 2022. Intel officially announced the launch of Alder Lake-P and -U series on February 23, 2022, and Alder Lake-HX series on May 10, 2022. History Fabricated using Intel's Intel 7 process, which was previously referred to as Intel 10 nm Enhanced SuperFin (10ESF), Intel officially announced 12th Gen Intel Core CPUs on October 27, 2021. Intel then officially announced 12th Gen Intel Core mobile CPUs and ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
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LGA 1700
LGA 1700 (Socket V) is a zero insertion force flip-chip land grid array (LGA) socket, compatible with Intel desktop processors Alder Lake and Raptor Lake, which was first released in November 2021. LGA 1700 is designed as a replacement for LGA 1200 (known as ''Socket H5'') and it has 1700 protruding pins to make contact with the pads on the processor. Compared to its predecessor, it has 500 more pins, which required a major change in socket and processor sizes; it is 7.5 mm longer. It is the first major change in Intel's LGA desktop CPU socket size since the introduction of LGA 775 in 2004, especially for consumer-grade CPU sockets. The larger size also required a change in the heatsink fastening holes configuration, making previously used cooling solutions incompatible with LGA 1700 motherboards and CPUs. Heatsink design Since the introduction of Land grid array (LGA)-based sockets in the consumer hardware space in 2004, the thermal solution ''hole pattern'' (the distanc ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
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LGA 775
LGA 775 (land grid array 775), also known as Socket T, is an Intel desktop CPU socket. Unlike PGA CPU sockets, such as its predecessor Socket 478, LGA 775 has no socket holes; instead, it has 775 protruding pins which touch contact points on the underside of the processor (CPU). The socket had an unusually long life span, lasting 7 years until the last processors supporting it ceased production in 2011. The socket was superseded by the LGA 1156 (Socket H) and LGA 1366 (Socket B) sockets. LGA 775 processors (some of the processors listed here might not work on newer Intel based chipsets) * Pentium 4 * Pentium 4 Extreme Edition * Pentium D * Celeron/ Celeron D * Pentium Dual-Core * Pentium Extreme Edition * Core 2 Duo/ Core 2 Quad Heatsink design For LGA 775, the distance between the screw-holes for the heatsink is 72 mm. Such heat-sinks are not interchangeable with heatsinks for sockets that have a distance of 75 mm, such as LGA 1156, LGA 1155, LGA 1150, L ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
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Intel Core 2
Intel Core 2 is the processor family encompassing a range of Intel's consumer 64-bit x86-64 single-, dual-, and quad-core microprocessors based on the Core microarchitecture. The single- and dual-core models are single- die, whereas the quad-core models comprise two dies, each containing two cores, packaged in a multi-chip module. The Core 2 range was the last flagship range of Intel desktop processors to use a front-side bus. The introduction of Core 2 relegated the Pentium brand to the mid-range market, and reunified laptop and desktop CPU lines for marketing purposes under the same product name, which were formerly divided into the Pentium 4, Pentium D, and Pentium M brands. The ''Core 2'' processor line was introduced on July 27, 2006, comprising the ''Duo'' (dual-core) and ''Extreme'' (dual- or quad-core CPUs for enthusiasts), and in 2007, the ''Quad'' (quad-core) and ''Solo'' ( single-core) sub-brands. Intel Core 2 processors with vPro technology (designed for businesses ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
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Pentium D
Pentium D is a range of desktop 64-bit x86-64 processors based on the NetBurst microarchitecture, which is the dual-core variant of the Pentium 4 manufactured by Intel. Each CPU comprised two dies, each containing a single core, residing next to each other on a multi-chip module package. The brand's first processor, codenamed ''Smithfield'' and manufactured on the 90 nm process, was released on May 25, 2005, followed by the 65 nm ''Presler'' nine months later. By 2004, the NetBurst processors reached a clock speed barrier at 3.8 GHz due to a thermal (and power) limit exemplified by the ''Presler's'' 130 watt thermal design power (a higher TDP requires additional cooling that can be prohibitively noisy or expensive). The future belonged to more energy efficient and slower clocked dual-core CPUs on a single die instead of two. However, the Pentium D did not offer significant upgrades in design, still resulting in relatively high power consumption. The final shipment date of ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
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Pentium 4
Pentium 4 is a series of single-core CPUs for desktops, laptops and entry-level servers manufactured by Intel. The processors were shipped from November 20, 2000 until August 8, 2008. The production of Netburst processors was active from 2000 until May 21, 2010. All Pentium 4 CPUs are based on the NetBurst microarchitecture. The Pentium 4 '' Willamette'' (180 nm) introduced SSE2, while the '' Prescott'' (90 nm) introduced SSE3. Later versions introduced Hyper-Threading Technology (HTT). The first Pentium 4-branded processor to implement 64-bit was the ''Prescott'' (90 nm) (February 2004), but this feature was not enabled. Intel subsequently began selling 64-bit Pentium 4s using the ''"E0" revision'' of the Prescotts, being sold on the OEM market as the Pentium 4, model F. The E0 revision also adds eXecute Disable (XD) (Intel's name for the NX bit) to Intel 64. Intel's official launch of Intel 64 (under the name EM64T at that time) in mainstream de ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
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UltraSPARC II
The UltraSPARC II, code-named "Blackbird", is a microprocessor implementation of the SPARC V9 instruction set architecture (ISA) developed by Sun Microsystems. Marc Tremblay was the chief architect. Introduced in 1997, it was further development of the UltraSPARC operating at higher clock frequencies of 250 MHz, eventually reaching 650 MHz. The die contained 5.4 million transistors and had an area of 149 mm. It was fabricated by Texas Instruments in their 0.35 μm process, dissipated 25 W at 205 MHz, and used a 2.5 V power supply. L2 cache capacity was 1 to 4 MB. In 1999, the UltraSPARC II was ported to a 0.25 μm process. This version was code-named "Sapphire-Black". It operated at 360 to 480 MHz, possessed a die area of 126 mm, dissipated 21 W at 400 MHz and the power supply voltage was reduced to 1.9 V. Supported L2 cache capacity was increased to 1 to 8 MB. Derivatives The UltraSPARC II was the basis for four derivatives. ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |