Timeline of MOSFET demonstrations
PMOS and NMOS
CMOS (single-gate)
Multi-gate MOSFET (MuGFET)
Other types of MOSFET
Commercial products using micro-scale MOSFETs
Products featuring 20 μm manufacturing process
* RCA's CD4000 series ofProducts featuring 10 μm manufacturing process
* Intel 4004, the first single-chipProducts featuring 8 μm manufacturing process
* Intel 1103, an early dynamic random-access memory (DRAM) chip launched in 1970. * MOS Technology 6502 1 MHz CPU launched in 1975.Products featuring 6 μm manufacturing process
* Toshiba TLCS-12, aProducts featuring 3 μm manufacturing process
* Intel 8085 CPU launched in 1976. * Intel 8086 CPU launched in 1978. * Intel 8088 CPU launched in 1979. * Motorola 68000 8 MHz CPU launched in 1979 (3.5 μm).Products featuring 1.5 μm manufacturing process
* NEC's 64 kb SRAM memory chip in 1981. * Intel 80286 CPU launched in 1982. * The Amiga Advanced Graphics Architecture (initially sold in 1992) included chips such as Alice that were manufactured using a 1.5 μm CMOS process.Products featuring 1 μm manufacturing process
* NTT's DRAM memory chips, including its 64 kb chip in 1979 and 256kb chip in 1980. * NEC's 1 Mb DRAM memory chip in 1984. * Intel 80386 CPU launched in 1985.Products featuring 800 nm manufacturing process
* NTT's 1Mb DRAM memory chip in 1984. * NEC and Toshiba used this process for their 4Mb DRAM memory chips in 1986. * Hitachi, IBM, Matsushita and Mitsubishi Electric used this process for their 4Mb DRAM memory chips in 1987. * Toshiba's 4Mb EPROM memory chip in 1987. * Hitachi, Mitsubishi and Toshiba used this process for their 1Mb SRAM memory chips in 1987. * Intel 486 CPU launched in 1989. * microSPARC I launched in 1992. * First Intel P5 Pentium CPUs at 60 MHz and 66 MHz launched in 1993.Products featuring 600 nm manufacturing process
* Mitsubishi Electric, Toshiba and NEC introduced 16Mb DRAM memory chips manufactured with a 600nm process in 1989. * NEC's 16Mb EPROM memory chip in 1990. * Mitsubishi's 16Mb flash memory chip in 1991. * Intel 80486DX4 CPU launched in 1994. * IBM/ Motorola PowerPC 601, the first PowerPC chip, was produced in 0.6 μm. * Intel Pentium CPUs at 75 MHz, 90 MHz and 100 MHz.Products featuring 350 nm manufacturing process
*Products featuring 250 nm manufacturing process
* Hitachi's 16Mb SRAM memory chip in 1993. * Hitachi and NEC introduced 256Mb DRAM memory chips manufactured with this process in 1993, followed by Matsushita, Mitsubishi Electric and Oki in 1994. * NEC's 1 Gb DRAM memory chip in 1995. * Hitachi's 128Mb NAND flash memory chip in 1996. * DEC Alpha 21264A, which was made commercially available in 1999. * AMD K6-2 ''Chomper'' and ''Chomper Extended''. Chomper was released on May 28, 1998. * AMD K6-III "Sharptooth" used 250 nm. * Mobile Pentium MMX '' Tillamook'', released in August 1997. * Pentium II '' Deschutes''. * Dreamcast console's Hitachi SH-4 CPU and PowerVR2 GPU, released in 1998. * Pentium III '' Katmai''. * Initial PlayStation 2's Emotion Engine CPU.Processors using 180 nm manufacturing technology
* Intel Coppermine E- October 1999 * Sony PlayStation 2 console's Emotion Engine and Graphics Synthesizer – March 2000 * ATI Radeon R100 and RV100 Radeon 7000 – 2000 * AMD Athlon Thunderbird – June 2000 * Intel Celeron (Willamette) – May 2002 * Motorola PowerPC 7445 and 7455 (Apollo 6) – January 2002Processors using 130 nm manufacturing technology
* Fujitsu SPARC64 V – 2001 * Gekko by IBM andCommercial products using nano-scale MOSFETs
Chips using 90 nm manufacturing technology
* Sony–Toshiba Emotion Engine+ PlayStation 2 technical specifications, Graphics Synthesizer ( PlayStation 2) – 2003 * IBM PowerPC G5 970FX – 2004 * Elpida Memory's 90 nm DDR2 SDRAM process – 2005 * IBM PowerPC G5 970MP – 2005 * IBM PowerPC G5 970GX – 2005 * IBM Waternoose Xbox 360 Processor – 2005 * IBM–Sony–Toshiba Cell processor – 2005 * Intel Pentium 4 Prescott – 2004-02 * Intel Celeron D Prescott-256 – 2004-05 * Intel Pentium M Dothan – 2004-05 * Intel Celeron M Dothan-1024 – 2004-08 * Intel Xeon Nocona, Irwindale, Cranford, Potomac, Paxville – 2004-06 * Intel Pentium D Smithfield – 2005-05 * AMD Athlon 64 Winchester, Venice, San Diego, Orleans – 2004-10 * AMD Athlon 64 X2 Manchester, Toledo, Windsor – 2005-05 * AMD Sempron Palermo and Manila – 2004-08 * AMD Turion 64 Lancaster and Richmond – 2005-03 * AMD Turion 64 X2 Taylor and Trinidad – 2006-05 * AMD Opteron Venus, Troy, and Athens – 2005-08 * AMD Dual-core Opteron Denmark, Italy, Egypt, Santa Ana, and Santa Rosa * VIA C7 – 2005-05 * Loongson (Godson) 2Е STLS2E02 – 2007-04 * Loongson (Godson) 2F STLS2F02 – 2008-07 * MCST-4R – 2010-12 * Elbrus-2C+ – 2011-11Processors using 65 nm manufacturing technology
* Sony–Toshiba EE+ GS ( PStwo) – 2005 * Intel Pentium 4 (Cedar Mill) – 2006-01-16 * Intel Pentium D 900-series – 2006-01-16 * Intel Celeron D (Cedar Mill cores) – 2006-05-28 * Intel Core – 2006-01-05 * Intel Core 2 – 2006-07-27 * Intel Xeon ( Sossaman) – 2006-03-14 * AMD Athlon 64 series (starting from Lima) – 2007-02-20 * AMD Turion 64 X2 series (starting from Tyler) – 2007-05-07 * AMD Phenom series * IBM's Cell Processor – PlayStation 3 – 2007-11-17 * IBM's z10 * Microsoft Xbox 360 "Falcon" CPU – 2007–09 * Microsoft Xbox 360 "Opus" CPU – 2008 * Microsoft Xbox 360 "Jasper" CPU – 2008–10 * Microsoft Xbox 360 "Jasper" GPU – 2008–10 * Sun UltraSPARC T2 – 2007–10 * AMD Turion Ultra – 2008-06 * TI OMAP 3 Family – 2008-02 * VIA Nano – 2008-05 * Loongson – 2009 * NVIDIA GeForce 8800GT GPU – 2007Processors using 45 nm technology
* Matsushita released the 45 nm Uniphier in 2007. * Wolfdale, Yorkfield, Yorkfield XE and Penryn are Intel cores sold under the Core 2 brand. * Intel Core i7 series processors, i5 750 ( Lynnfield and Clarksfield) * Pentium Dual-Core Wolfdale-3M are current Intel mainstream dual core sold under the Pentium brand. * Diamondville, Pineview are current Intel cores with hyper-threading sold under the Intel Atom brand. * AMD Deneb ( Phenom II) and Shanghai ( Opteron) Quad-Core Processors, Regor ( Athlon II) dual core processorChips using 32 nm technology
* Toshiba produced commercial 32 Gb NAND flash memory chips with the 32nm process in 2009. * Intel Core i3 and i5 processors, released in January 2010 * Intel 6-core processor, codenamed Gulftown * Intel i7-970, was released in late July 2010, priced at approximately US$900 * AMD FX Series processors, codenamed Zambezi and based on AMD's Bulldozer architecture, were released in October 2011. The technology used a 32 nm SOI process, two CPU cores per module, and up to four modules, ranging from a quad-core design costing approximately US$130 to a $280 eight-core design. * Ambarella Inc. announced the availability of the A7L system-on-a-chip circuit for digital still cameras, providing 1080p60 high-definition video capabilities in September 2011Chips using 24–28 nm technology
* SK Hynix announced that it could produce a 26 nm flash chip with 64 Gb capacity; Intel Corp. and Micron Technology had by then already developed the technology themselves. Announced in 2010. * Toshiba announced that it was shipping 24 nm flash memory NAND devices on August 31, 2010. *In 2016 MCST's 28 nm processor Elbrus-8S went for serial production.Chips using 22 nm technology
* Intel Core i7 and Intel Core i5 processors based on Intel's Ivy Bridge 22 nm technology for series 7 chip-sets went on sale worldwide on April 23, 2012.Chips using 20 nm technology
* Samsung Electronics began mass production of 64 Gb NAND flash memory chips using a 20 nm process in 2010. * Nvidia Tegra X1 ( Nintendo Switch and Nvidia Shield TV)Chips using 16 nm technology
* TSMC first began 16nm FinFET chip production in 2013. * Nvidia Tegra X1+ (later Nintendo Switch and Nvidia Shield TV models)Chips using 14 nm technology
* Intel Core i7 and Intel Core i5 processors based on Intel's Broadwell 14 nm technology was launched in January 2015. * AMD Ryzen processors based on AMD's Zen or Zen+ architectures and which uses 14 nm FinFET technology.Chips using 10 nm technology
* Samsung announced that it had begun mass production of multi-level cell (MLC) flash memory chips using a 10nm process in 2013. On 17 October 2016, Samsung Electronics announced mass production of SoC chips at 10 nm. * TSMC began commercial production of 10 nm chips in early 2016, before moving onto mass production in early 2017. * Samsung began shipping Galaxy S8 smartphone in April 2017 using the company's 10 nm processor. *Chips using 7 nm technology
* TSMC began risk production of 256 Mbit SRAM memory chips using a 7 nm process in April 2017. * Samsung and TSMC began mass production of 7 nm devices in 2018.TSMC ramping up 7nm chip productionChips using 5 nm technology
* Samsung began production of 5 nm chips (5LPE) in late 2018. * TSMC began production of 5 nm chips (CLN5FF) in April 2019.Chips using 3 nm technology
* TSMC have announced plans to release 3nm devices during 2021–2022. * Samsung Electronics have begun risk production of 3 nm GAAFET transistors in June 2022. *See also
* Foundry model * MOSFET * Semiconductor device fabrication * Transistor countReferences
{{DEFAULTSORT:List of semiconductor scale examples International Technology Roadmap for Semiconductors lithography nodes MOSFETs