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Dual-channel
In the fields of digital electronics and computer hardware, multi-channel memory architecture is a technology that increases the data transfer rate between the DRAM memory and the memory controller by adding more channels of communication between them. Theoretically, this multiplies the data rate by exactly the number of channels present. Dual-channel memory employs two channels. The technique goes back as far as the 1960s having been used in IBM System/360 Model 91 and in CDC 6600. Modern high-end desktop and workstation processors such as the AMD Ryzen Threadripper series and the Intel List of Intel Core i9 processors, Core i9 Extreme Edition lineup support quad-channel memory. Server processors from the AMD Epyc series and the Intel Xeon platforms give support to memory bandwidth starting from quad-channel module layout to up to 12-channel layout. In March 2010, AMD released Socket G34 and Magny-Cours Opteron 6100 series processors with support for quad-channel memory. In 200 ...
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List Of Intel Core I9 Processors
The following is a list of Intel Core processors. This includes Intel's original Core (Solo/Duo) mobile series based on the Enhanced Pentium M microarchitecture, as well as its Core 2- (Solo/Duo/Quad/Extreme), Core i3-, Core i5-, Core i7-, Core i9-, Core M- (m3/m5/m7/m9), Core 3-, Core 5-, and Core 7- Core 9-, branded processors. Desktop processors Core 2 "Allendale" (65 nm, 800 MT/s) *All models support: '' MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2)'' * Die size: 111 mm2 * Steppings: L2, M0, G0 Note: The M0 and G0 Steppings have better optimizations to lower idle power consumption from 12W to 8W. Note: The E4700 uses G0 Stepping which makes it a Conroe CPU. "Conroe" (65 nm, 1066 MT/s) *All models support: '' MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit impleme ...
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Core I7
Intel Core is a line of multi-core (with the exception of Core Solo and Core 2 Solo) central processing units (CPUs) for midrange, embedded, workstation, high-end and enthusiast computer markets marketed by Intel Corporation. These processors displaced the existing mid- to high-end Pentium processors at the time of their introduction, moving the Pentium to the entry level. Identical or more capable versions of Core processors are also sold as Xeon processors for the server and workstation markets. Core was launched in January 2006 as a mobile-only series, consisting of single- and dual-core models. It was then succeeded later in July by the Core 2 series, which included both desktop and mobile processors with up to four cores, and introduced 64-bit support. Since 2008, Intel began introducing the Core i3, Core i5, Core i7 and Core i9 lineup of processors, succeeding Core 2. A new naming scheme debuted in 2023, consisting of Core 3, Core 5, and Core 7 for mainstream processors ...
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Xeon
Xeon (; ) is a brand of x86 microprocessors designed, manufactured, and marketed by Intel, targeted at the non-consumer workstation, server, and embedded markets. It was introduced in June 1998. Xeon processors are based on the same architecture as regular desktop-grade CPUs, but have advanced features such as support for error correction code (ECC) memory, higher core counts, more PCI Express lanes, support for larger amounts of RAM, larger cache memory and extra provision for enterprise-grade reliability, availability and serviceability (RAS) features responsible for handling hardware exceptions through the Machine Check Architecture (MCA). They are often capable of safely continuing execution where a normal processor cannot due to these extra RAS features, depending on the type and severity of the machine-check exception (MCE). Some also support multi-socket systems with two, four, or eight sockets through use of the Ultra Path Interconnect (UPI) bus, which replaced ...
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Digital Electronics
Digital electronics is a field of electronics involving the study of digital signals and the engineering of devices that use or produce them. It deals with the relationship between Binary number, binary inputs and outputs by passing electrical signals through Logic gate, logical gates, Resistor, resistors, Capacitor, capacitors, Amplifier, amplifiers, and other Electronic component, electrical components. The field of digital electronics is in contrast to analog electronics which work primarily with analog signals (signals with varying degrees of intensity as opposed to on/off two state binary signals). Despite the name, digital electronics designs include important analog design considerations. Large assemblies of logic gates, used to represent more complex ideas, are often packaged into integrated circuits. Complex devices may have simple electronic representations of Boolean logic#Digital electronic circuit design, Boolean logic functions. History The binary number system was ...
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Double Data Rate
In computing, double data rate (DDR) describes a computer bus that transfers data on both the rising and falling edges of the clock signal and hence doubles the memory bandwidth by transferring data twice per clock cycle. This is also known as double pumped, dual-pumped, and double transition. The term toggle mode is used in the context of NAND flash memory. Overview The simplest way to design a clocked electronic circuit is to make it perform one transfer per full cycle (rise and fall) of a clock signal. This, however, requires that the clock signal changes twice per transfer, while the data lines change at most once per transfer. When operating at a high bandwidth, signal integrity limitations constrain the clock frequency. By using both edges of the clock, the data signals operate with the same limiting frequency, thereby doubling the data transmission rate. This technique has been used for microprocessor front-side busses, Ultra-3 SCSI, expansion buses ( AGP, PCI ...
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Interleaved Memory
In computing, interleaved memory is a design which compensates for the relatively slow speed of dynamic random-access memory (DRAM) or core memory, by spreading memory addresses evenly across memory banks. That way, contiguous memory reads and writes use each memory bank in turn, resulting in higher memory throughput due to reduced waiting for memory banks to become ready for the operations. It is different from multi-channel memory architectures, primarily as interleaved memory does not add more channels between the main memory and the memory controller. However, channel interleaving is also possible, for example in freescale i.MX6 processors, which allow interleaving to be done between two channels. Overview With interleaved memory, memory addresses are allocated to each memory bank in turn. For example, in an interleaved system with two memory banks (assuming word-addressable memory), if logical address 32 belongs to bank 0, then logical address 33 would belong to ban ...
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Intel P55
The Intel P55 is the first desktop chipset from Intel based on the PCH chipset design. The P55 Express chipset uses the LGA 1156 socket. Compatible CPUs include the first generation Core i series i3, i5, and i7 processor line along with a Pentium G6950. Like any PCH chipset, the P55 uses a Direct Media Interface connection. Features * The chipset does not support onboard graphics. * 6 SATA 3 Gbit/s ports * 8 PCI-Express 2.0 lanes (bandwidth limited to 2.5 GT/s same as PCIe 1.0, normal PCIe 2.0 has 5 GT/s bandwidth) * 14 USB 2.0 ports * Integrated LAN 10/100/1000 * SMBus 2.0 * Integrated clock chip buffer * Intel HD Audio * Intel AC'97 Technology * Intel Rapid Storage Technology See also *List of Intel chipsets *Intel 5 Series Intel 5 Series is a computing architecture introduced in 2008 that improves the efficiency and balances the use of communication channels in the motherboard. The architecture consists primarily of a central processing unit (CPU) (connec ...
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LGA 1156
LGA 1156 (land grid array 1156), also known as Socket H or H1, is an Intel desktop CPU socket. The last processors supporting the LGA 1156 ceased production in 2011. It was succeeded by the mutually incompatible socket LGA 1155. LGA 1156, along with LGA 1366, were designed to replace LGA 775. Whereas LGA 775 processors connect to a northbridge using the Front Side Bus, LGA 1156 processors integrate the features traditionally located on a northbridge within the processor itself. The LGA 1156 socket allows the following connections to be made from the processor to the rest of the system: * PCI-Express 2.0 ×16 for communication with a graphics card. Some processors allow this connection to be divided into two ×8 lanes to connect two graphics cards. Some motherboard manufacturers use Nvidia's NF200 chip to allow even more graphics cards to be used. * DMI for communication with the Platform Controller Hub (PCH). This consists of a PCI-Express 2.0 ×4 connection. * FDI for ...
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DDR3
Double Data Rate 3 Synchronous Dynamic Random-Access Memory (DDR3 SDRAM) is a type of synchronous dynamic random-access memory (SDRAM) with a high Bandwidth (computing), bandwidth ("double data rate") interface, and has been in use since 2007. It is the higher-speed successor to DDR SDRAM, DDR and DDR2 SDRAM, DDR2 and predecessor to DDR4 SDRAM, DDR4 synchronous dynamic random-access memory (SDRAM) chips. DDR3 SDRAM is neither Forward compatibility, forward nor Backward compatibility, backward compatible with any earlier type of random-access memory (RAM) because of different signaling voltages, timings, and other factors. DDR3 is a DRAM interface specification. The actual DRAM arrays that store the data are similar to earlier types, with similar performance. The primary benefit of DDR3 SDRAM over its immediate predecessor DDR2 SDRAM, is its ability to transfer data at twice the rate (eight times the speed of its internal memory arrays), enabling higher bandwidth or peak data ra ...
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JBOD
The most widespread standard for configuring multiple hard disk drives is RAID (redundant array of inexpensive/independent disks), which comes in a number of standard configurations and non-standard configurations. Non-RAID drive architectures also exist, and are referred to by acronyms with tongue-in-cheek similarity to RAID: * JBOD (just a bunch of disks): described multiple hard disk drives operated as individual independent hard disk drives. * SPAN or BIG: A method of combining the free space on multiple hard disk drives from "JBoD" to create a spanned volume. Such a concatenation is sometimes also called BIG/SPAN. A SPAN or BIG is generally a spanned volume only, as it often contains mismatched types and sizes of hard disk drives. * MAID (massive array of idle drives): an architecture using hundreds to thousands of hard disk drives for providing nearline storage of data, primarily designed for write once, read occasionally (WORO) applications, in which increased storage dens ...
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RAID 0
In computer storage, the standard RAID levels comprise a basic set of RAID ("redundant array of independent disks" or "redundant array of inexpensive disks") configurations that employ the techniques of striping, mirroring, or parity to create large reliable data stores from multiple general-purpose computer hard disk drives (HDDs). The most common types are RAID 0 (striping), RAID 1 (mirroring) and its variants, RAID 5 (distributed parity), and RAID 6 (dual parity). Multiple RAID levels can also be combined or '' nested'', for instance RAID 10 (striping of mirrors) or RAID 01 (mirroring stripe sets). RAID levels and their associated data formats are standardized by the Storage Networking Industry Association (SNIA) in the Common RAID Disk Drive Format (DDF) standard. The numerical values only serve as identifiers and do not signify performance, reliability, generation, hierarchy, or any other metric. While most RAID levels can provide good protection ...
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