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Compliant Bonding
Compliant bonding is used to connect gold wires to electrical components such as integrated circuit "chips". It was invented by Alexander Coucoulas in the 1960s.Alexander Coucoula"Bonding With A Compliant Medium" . October 13, 1970. Filed July 6, 1967. The bond is formed well below the melting point of the mating gold surfaces and is therefore referred to as a solid-state type bond. The compliant bond is formed by transmitting heat and pressure to the bond region through a relatively thick indentable or ''compliant medium'', generally an aluminum tape (Figure 1).Coucoulas, A. (1970) “Compliant Bonding” Proceedings 1970 IEEE 20th Electronic Components Conference, pp. 380–89. :File:CompliantBondingPublic_1-10.pdf, PDFPDF2/ref> Comparison with other solid state bond methods Solid-state or pressure bonds form permanent bonds between a gold wire and a gold metal surface by bringing their mating surfaces in intimate contact at about 300 °C which is well below their respe ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Solid State Bonding A Wire To A Metallized Surface
Solid is one of the four fundamental states of matter (the others being liquid, gas, and plasma). The molecules in a solid are closely packed together and contain the least amount of kinetic energy. A solid is characterized by structural rigidity and resistance to a force applied to the surface. Unlike a liquid, a solid object does not flow to take on the shape of its container, nor does it expand to fill the entire available volume like a gas. The atoms in a solid are bound to each other, either in a regular geometric lattice (crystalline solids, which include metals and ordinary ice), or irregularly (an amorphous solid such as common window glass). Solids cannot be compressed with little pressure whereas gases can be compressed with little pressure because the molecules in a gas are loosely packed. The branch of physics that deals with solids is called solid-state physics, and is the main branch of condensed matter physics (which also includes liquids). Materials sc ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Integrated Circuit
An integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, usually silicon. Transistor count, Large numbers of tiny MOSFETs (metal–oxide–semiconductor field-effect transistors) integrate into a small chip. This results in circuits that are orders of magnitude smaller, faster, and less expensive than those constructed of discrete electronic components. The IC's mass production capability, reliability, and building-block approach to integrated circuit design has ensured the rapid adoption of standardized ICs in place of designs using discrete transistors. ICs are now used in virtually all electronic equipment and have revolutionized the world of electronics. Computers, mobile phones and other home appliances are now inextricable parts of the structure of modern societies, made possible by the small size and low cost of ICs such as mode ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Alexander Coucoulas
Alexander Coucoulas is an American inventor, research engineer, and author. He was named "father of thermosonic bonding" by George Harman, the world's foremost authority on wire bonding, where he referenced Coucoulas's leading edge publications in his book, ''Wire Bonding In Microelectronics.Coucoulas, A., Trans. Metallurgical Society of AIME, "Ultrasonic Welding of Aluminum Leads to Tantalum Thin Films", 1966, pp. 587–589. abstract https://sites.google.com/site/coucoulasthermosonicbondaltaCoucoulas, A., "Hot Work Ultrasonic Bonding – A Method Of Facilitating Metal Flow By Restoration Processes", Proc. 20th IEEE Electronic Components Conf. Washington, D.C., May 1970, pp. 549–556.https://sites.google.com/site/hotworkultrasonicbonding A thermosonic bond is formed using a set of parameters which include ultrasonic, thermal and mechanical (force) energies. Thermosonic bonding is widely used to electrically connect silicon integrated circuit microprocessor chipsT.R. Reid, "The Chip ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Thermocompression Bonding
Thermocompression bonding describes a wafer bonding technique and is also referred to as diffusion bonding, pressure joining, thermocompression welding or solid-state welding. Two metals, e.g. gold- gold (Au), are brought into atomic contact applying force and heat simultaneously. The diffusion requires atomic contact between the surfaces due to the atomic motion. The atoms migrate from one crystal lattice to the other one based on crystal lattice vibration. This atomic interaction sticks the interface together. The diffusion process is described by the following three processes: * surface diffusion * grain boundary diffusion * bulk diffusion This method enables internal structure protecting device packages and direct electrical interconnect structures without additional steps beside the surface mounting process. Overview The most established materials for thermocompression bonding are copper (Cu), gold (Au) and aluminium (Al) because of their high diffusion rates. In additi ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Thermosonic Bonding
Thermosonic bonding is widely used to wire bond silicon integrated circuits into computers. Alexander Coucoulas was named "Father of Thermosonic Bonding" by George Harman, the world's foremost authority on wire bonding, where he referenced Coucoulas's leading edge publications in his book, ''Wire Bonding In Microelectronics''.Coucoulas, A., Trans. Metallurgical Society Of AIME, "Ultrasonic Welding of Aluminum Leads to Tantalum Thin Films", 1966, pp. 587–589. abstract https://sites.google.com/site/coucoulasthermosonicbondaltaCoucoulas, A., "Hot Work Ultrasonic Bonding – A Method Of Facilitating Metal Flow By Restoration Processes", Proc. 20th IEEE Electronic Components Conf. Washington, D.C., May 1970, pp. 549–556.https://sites.google.com/site/hotworkultrasonicbonding Owing to the well proven reliability of thermosonic bonds, it is extensively used to connect the central processing units (CPUs), which are encapsulated silicon integrated circuits that serve as the "brains" of to ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Compliant Bonding Gold Wires0001
Compliance can mean: Healthcare * Compliance (medicine), a patient's (or doctor's) adherence to a recommended course of treatment * Compliance (physiology), the tendency of a hollow organ to resist recoil toward its original dimensions (this is a specific usage of the mechanical meaning) ** Pulmonary compliance (or lung compliance), change in lung volume for applied or dynamic pressure * Compliance (psychology), responding favorably to a request offered by others Other uses * ''Compliance'' (film), released in 2012 * ''Compliance'' (song), single from the 2022 studio album by the English rock band Muse * Compliance, in mechanical science, is the inverse of stiffness * Compliant mechanism, a flexible mechanism * Environmental compliance, conforming to environmental laws, regulations, standards and other requirements * Regulatory compliance In general, compliance means conforming to a rule, such as a specification, policy, standard or law. Compliance has traditionally been ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Beam Lead Technology
Beam lead technology is a method of fabricating a semiconductor device. Its original application was to high-frequency silicon switching transistors and high-speed integrated circuits. It eliminated the labor-intensive wire-bonding process used for integrated circuits at the time and allowed automated assembly of semiconductor chips onto larger substrates to produce hybrid integrated circuits. History In the early 1960s, M.P. LepselterPresentation at Electron Devices Meeting, October 29, 1964, Washington, D.C. developed the techniques for fabricating a structure consisting of electroforming an array of thick, self-supporting gold patterns on a thin film Ti- Pt Au base, hence the name "beams", deposited on the surface of a silicon wafer. The excess semiconductor from under the beams was removed, thereby separating the individual devices and leaving them with self-supporting beam leads or internal chiplets cantilevered beyond the semiconductor. The contacts served as electri ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Packaging (microfabrication)
In electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the block of semiconductor material is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a " package", supports the electrical contacts which connect the device to a circuit board. In the integrated circuit industry, the process is often referred to as packaging. Other names include semiconductor device assembly, assembly, encapsulation or sealing. The packaging stage is followed by testing of the integrated circuit. The term is sometimes confused with electronic packaging, which is the mounting and interconnecting of integrated circuits (and other components) onto printed-circuit boards. Design considerations Electrical The current-carrying traces that run out of the die, through the package, and into the printed circuit board (PCB) have very different electrical properties compared to on-chip signa ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Integrated Circuits
An integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, usually silicon. Transistor count, Large numbers of tiny MOSFETs (metal–oxide–semiconductor field-effect transistors) integrate into a small chip. This results in circuits that are orders of magnitude smaller, faster, and less expensive than those constructed of discrete electronic components. The IC's mass production capability, reliability, and building-block approach to integrated circuit design has ensured the rapid adoption of standardized ICs in place of designs using discrete transistors. ICs are now used in virtually all electronic equipment and have revolutionized the world of electronics. Computers, mobile phones and other home appliances are now inextricable parts of the structure of modern societies, made possible by the small size and low cost of ICs such as mode ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
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