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Small-scale Integration
An integrated circuit (IC), also known as a microchip or simply chip, is a set of electronic circuits, consisting of various electronic components (such as transistors, resistors, and capacitors) and their interconnections. These components are etched onto a small, flat piece ("chip") of semiconductor material, usually silicon. Integrated circuits are used in a wide range of electronic devices, including computers, smartphones, and televisions, to perform various functions such as processing and storing information. They have greatly impacted the field of electronics by enabling device miniaturization and enhanced functionality. Integrated circuits are orders of magnitude smaller, faster, and less expensive than those constructed of discrete components, allowing a large transistor count. The IC's mass production capability, reliability, and building-block approach to integrated circuit design have ensured the rapid adoption of standardized ICs in place of designs using disc ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
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NXP PCF8577C LCD Driver With I²C (Colour Corrected)
NXP Semiconductors N.V. is a Dutch semiconductor manufacturing and design company with headquarters in Eindhoven, Netherlands. It is the third largest European semiconductor company by market capitalization as of 2024. The company employs approximately 34,000 people in more than 30 countries and it reported revenues of $13.3 billion in 2023. The company's origins date back to the 1950s as part of Philips and it became one of the world's largest semiconductor companies by the end of the 20th century. Philips Corporate spin-off, spun off the company in 2006 and it has since operated independently. The company's name is an abbreviation of Next eXPerience. Overview Originally spun off from Philips in 2006, NXP completed its initial public offering, on August 6, 2010, with shares trading on Nasdaq under the ticker symbol "NXPI". On December 23, 2013, NXP Semiconductors was added to the Nasdaq-100 index. In 2021, it was added to the S&P 500 stock index. NXP is the co-inventor of n ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
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Computer Processor
Cryptominer, In computing and computer science, a processor or processing unit is an electrical component (circuit (computer science), digital circuit) that performs operations on an external data source, usually Memory (computing), memory or some other data stream. It typically takes the form of a microprocessor, which can be implemented on a single or a few tightly integrated metal–oxide–semiconductor integrated circuit chips. In the past, processors were constructed using multiple individual vacuum tubes, multiple individual transistors, or multiple integrated circuits. The term is frequently used to refer to the central processing unit (CPU), the main processor in a system. However, it can also refer to other coprocessors, such as a graphics processing unit (GPU). Traditional processors are typically based on silicon; however, researchers have developed experimental processors based on alternative materials such as carbon nanotubes, graphene, diamond, and alloys made of e ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
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Kilby Solid Circuit
Kilby is a village and Civil parishes in England, civil parish in the Blaby (district), Blaby district of Leicestershire, England. Kilby is the easternmost village in the district, and is south east of Leicester. Kilby civil parish includes the former parish of Foston, Leicestershire, Foston and its deserted medieval village. Nearby places are Countesthorpe , Fleckney , Arnesby , Wistow, Leicestershire, Wistow and Kilby Bridge . In 1870–72, John Marius Wilson's ''Imperial Gazetteer of England and Wales'' described Kilby as follows: History Kilby has had the origins of its name possibly traced back to a Scandinavian form of Old English, being translated to 'children's farm/settlement.' Kilby was mentioned in the Domesday book where it was said to have been originally formed around the parish Church of St. Mary Magdalene. In the Domesday book of 1068 Kilby or Cilebi, as it was spelt, resided in a district called 'Guthlaxton Wapentake' under the ownership of Oger the Breton wh ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
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Hybrid Integrated Circuit
A hybrid integrated circuit (HIC), hybrid microcircuit, hybrid circuit or simply hybrid is a miniaturized electronic circuit constructed of individual devices, such as semiconductor devices (e.g. transistors, diodes or Integrated circuits, monolithic ICs) and passive components (e.g. resistors, inductors, transformers, and capacitors), bonded to a substrate or printed circuit board (PCB). A PCB having components on a Printed wiring board (PWB) is not considered a true hybrid circuit according to the definition of MIL-PRF-38534. Overview "Integrated circuit", as the term is currently used, usually refers to a monolithic IC which differs notably from a HIC in that a HIC is fabricated by inter-connecting a number of components on a substrate whereas an IC's (monolithic) components are fabricated in a series of steps entirely on a single wafer which is then diced into chips. Some hybrid circuits may contain monolithic ICs, particularly Multi-chip module (MCM) hybrid circuits. Hyb ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
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Thick-film Technology
Thick-film technology is used to produce electronic devices/modules such as surface mount devices modules, hybrid integrated circuits, heating elements, integrated passive devices and sensors. The main manufacturing technique is screen printing (stenciling), which in addition to use in manufacturing electronic devices can also be used for various graphic reproduction targets. It became one of the key manufacturing/miniaturisation techniques of electronic devices/modules during 1950s. Typical film thickness – manufactured with thick film manufacturing processes for electronic devices – is 0.0001 to 0.1 mm. Thick-film circuits/modules are widely used in the automotive industry, both in sensors, e.g. mixture of fuel/air, pressure sensors, engine and gearbox controls, sensor for releasing airbags, ignitors to airbags; common is that high reliability is required, often extended temperature range also along massive thermocycling of circuits without failure. Other application ar ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
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Thin-film Transistor
A thin-film transistor (TFT) is a special type of field-effect transistor (FET) where the transistor is made by thin film deposition. TFTs are grown on a supporting (but non-conducting) substrate, such as glass. This differs from the conventional bulk metal-oxide-semiconductor field-effect transistor (MOSFET), where the semiconductor material typically ''is'' the substrate, such as a silicon wafer. The traditional application of TFTs is in TFT liquid-crystal displays. Design and manufacture TFTs can be fabricated with a wide variety of semiconductor materials. Because it is naturally abundant and well understood, amorphous or polycrystalline silicon were (and still are) used as the semiconductor layer. However, because of the low mobility of amorphous silicon and the large device-to-device variations found in polycrystalline silicon, other materials have been studied for use in TFTs. These include cadmium selenide, metal oxides such as indium gallium zinc oxide (IGZO) or ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
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Multi-chip Module
A multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or Lead (electronics), "pins") where multiple integrated circuits (ICs or "chips"), semiconductor Die (integrated circuit), dies and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it can be treated as if it were a larger IC. Other terms for MCM packaging include "heterogeneous integration" or "hybrid integrated circuit". The advantage of using MCM packaging is it allows a manufacturer to use multiple components for modularity and/or to improve yields over a conventional monolithic IC approach. A Flip Chip Multi-Chip Module (FCMCM) is a multi-chip module that uses flip chip technology. A FCMCM may have one large die and several smaller dies all on the same module. Overview Multi-chip modules come in a variety of forms depending on the complexity and development philosophies of their designers. These can range from ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
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3D IC
A three-dimensional integrated circuit (3D IC) is a MOS (metal-oxide semiconductor) integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. The 3D IC is one of several 3D integration schemes that exploit the z-direction to achieve electrical performance benefits in microelectronics and nanoelectronics. 3D integrated circuits can be classified by their level of interconnect hierarchy at the global ( package), intermediate (bond pad) and local (transistor) level. In general, 3D integration is a broad term that includes such technologies as 3D wafer-level packaging (3DWLP); 2.5D and 3D interposer-based integration; 3D stacked ICs (3D-SICs); 3D heterogeneous integration; and 3D systems integration; a ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
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JEDEC
The Joint Electron Device Engineering Council (JEDEC) Solid State Technology Association is a consortium of the semiconductor industry headquartered in Arlington County, Virginia, Arlington, United States. It has over 300 members and is focused on standardization of part numbers, defining an electrostatic discharge (ESD) standard, and leadership in the RoHS, lead-free manufacturing transition. The origin of JEDEC traces back to 1944, when Radio Manufacturers Association, RMA (subsequently renamed Electronic Industries Alliance , EIA) and National Electrical Manufacturers Association, NEMA established the Joint Electron Tube Engineering Council (JETEC) to coordinate vacuum tube type list of vacuum tubes, numberings. In 1958, with the advent of semiconductor technology, the joint JETEC-activity of Electronic Industries Association, EIA and NEMA was renamed into Joint Electron Device Engineering Council. NEMA discontinued its involvement in 1979. In the fall of 1999, JEDEC became ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
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Economies Of Scale
In microeconomics, economies of scale are the cost advantages that enterprises obtain due to their scale of operation, and are typically measured by the amount of Productivity, output produced per unit of cost (production cost). A decrease in unit cost, cost per unit of output enables an increase in scale that is, increased production with lowered cost. At the basis of economies of scale, there may be technical, statistical, organizational or related factors to the degree of Market (economics), market control. Economies of scale arise in a variety of organizational and business situations and at various levels, such as a production, plant or an entire enterprise. When average costs start falling as output increases, then economies of scale occur. Some economies of scale, such as capital cost of manufacturing facilities and friction loss of transportation and industrial equipment, have a physical or engineering basis. The economic concept dates back to Adam Smith and the idea o ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
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Photolithography
Photolithography (also known as optical lithography) is a process used in the manufacturing of integrated circuits. It involves using light to transfer a pattern onto a substrate, typically a silicon wafer. The process begins with a photosensitive material, called a photoresist, being applied to the substrate. A photomask that contains the desired pattern is then placed over the photoresist. Light is shone through the photomask, exposing the photoresist in certain areas. The exposed areas undergo a chemical change, making them either soluble or insoluble in a developer solution. After development, the pattern is transferred onto the substrate through etching, chemical vapor deposition, or ion implantation processes. Ultraviolet, Ultraviolet (UV) light is typically used. Photolithography processes can be classified according to the type of light used, including ultraviolet lithography, deep ultraviolet lithography, extreme ultraviolet lithography, extreme ultraviolet lithography ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
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Moore's Law
Moore's law is the observation that the Transistor count, number of transistors in an integrated circuit (IC) doubles about every two years. Moore's law is an observation and Forecasting, projection of a historical trend. Rather than a law of physics, it is an empirical relationship. It is an experience-curve law, a type of law quantifying efficiency gains from experience in production. The observation is named after Gordon Moore, the co-founder of Fairchild Semiconductor and Intel and former CEO of the latter, who in 1965 noted that the number of components per integrated circuit had been exponential growth, doubling every year, and projected this rate of growth would continue for at least another decade. In 1975, looking forward to the next decade, he revised the forecast to doubling every two years, a compound annual growth rate (CAGR) of 41%. Moore's empirical evidence did not directly imply that the historical trend would continue, nevertheless, his prediction has held si ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |