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The JEDEC
JEDEC
Solid State Technology Association is an independent semiconductor engineering trade organization and standardization body. JEDEC
JEDEC
has over 300 members, including some of the world's largest computer companies. Its scope and past activities includes standardization of part numbers, defining an electrostatic discharge (ESD) standard, and leadership in the lead-free manufacturing transition.[1] The origin of JEDEC
JEDEC
traces back to 1944, when RMA (subsequently renamed EIA) and NEMA established the Joint Electron Tube Engineering Council (JETEC) to coordinate vacuum tube type numberings. In 1958, with the advent of semiconductor technology, the joint JETEC-activity of EIA and NEMA was renamed into Joint Electron Device Engineering Council.[1] NEMA discontinued its involvement in 1979. In the fall of 1999, JEDEC
JEDEC
became a separate trade association under the current name, but maintained an EIA alliance, until EIA ceased operations in 2011.

Contents

1 Origins 2 Test methods and product standards 3 Semiconductor
Semiconductor
package drawings 4 Industry standards 5 References 6 External links

Origins[edit]

An early 1950s transistor using the precursor to the EIA/ JEDEC
JEDEC
part numbering system.

The origin of JEDEC
JEDEC
can be traced back to 1944, when the Radio Manufacturers Association (RMA), and the National Electrical Manufacturers Association (NEMA) established the Joint Electron Tube Engineering Council (JETEC) to coordinate vacuum tube type numberings. The expansion of the radio industry caused JETEC
JETEC
to expand its scope to include solid state devices and develop standards for semiconductor devices. Eventually, the joint JETEC
JETEC
activity of EIA and NEMA was renamed into Joint Electron Device Engineering Council (JEDEC) in 1958.[2] [1] NEMA discontinued its involvement in 1979. The early work began as a part numbering system for devices which became popular in the 1960s. The first semiconductor devices, such as the 1N23 silicon point contact diode, were still designated in the old RMA tube designation system, where the "1" stood for "No filament/heater" and the "N" stood for "crystal rectifier". The first RMA digit thus was re-allocated from "heater power" to "p-n junction count" to form the new EIA/ JEDEC
JEDEC
EIA-370 standard; for example, the 1N4001 rectifier diode and 2N2222
2N2222
transistor part numbers came from EIA-370. They are still popular today. In February 1982, JEDEC
JEDEC
issued JESD370B, superseding the original EIA-370 and introducing a new letter symbol "C" that denotes the die version, as opposed to "N", now meaning the packaged version. The Japanese JIS semiconductor designation system employs a similar pattern. JEDEC
JEDEC
later developed a numbering system for integrated circuits, but this did not gain acceptance in the semiconductor industry. The European Pro Electron semiconductor numbering system originated in a similar way from the older Mullard–Philips tube designation. Earlier in the 20th century, the organization was known as JETEC, the Joint Electron Tube Engineering Council, and was responsible for assigning and coordinating RETMA tube designations to electron tubes (also called valves). The type 6L6, still to be found in electric-guitar amplifiers, typically has a type number that was assigned by JETEC. In the fall of 1999, JEDEC
JEDEC
became a separate trade association under the current name, but maintained an EIA alliance. Test methods and product standards[edit] This early work was followed by a number of test methods, JESD22, and product standards. For example, the ESD caution symbol, which is the hand with the line drawn through it, was published by JEDEC
JEDEC
and is used worldwide. JEDEC
JEDEC
also has a dictionary of semiconductor terms. All of JEDEC
JEDEC
standards are free on the Web for downloading after a free registration. JEDEC
JEDEC
has issued widely used standards for device interfaces, such as the JEDEC memory standards for computer memory (RAM), including the DDR SDRAM
DDR SDRAM
standards. Semiconductor
Semiconductor
package drawings[edit] JEDEC
JEDEC
also developed a number of popular package drawings for semiconductors such as TO-3, TO-5, etc. These are on the web under JEP-95. One hot issue is the development of lead-free packages that do not suffer from the tin whiskers problem that reappeared since the recent ban on lead content. JEDEC
JEDEC
is working with iNemi on a joint interest group on lead-free issues. Industry standards[edit] JEDEC's adoption of open industry standards (i.e., standards that permit any and all interested companies to freely manufacture in compliance with adopted standards) serves several vital functions for the advancement of electronic technologies. First and foremost, such standards allow for interoperability between different electrical components. JEDEC
JEDEC
standards do not protect members from normal patent obligations. The designated representatives of JEDEC
JEDEC
member companies are required to disclose patents and patent applications of which they personally are aware (assuming that this information is not considered proprietary). JEDEC
JEDEC
patent policy requires that standards found to contain patents whose owners will not sign a standard JEDEC
JEDEC
patent letter be withdrawn. Thus the penalty for a failure to disclose patents is retraction of the standard. Typically, standards will not be adopted to cover technology that will be subject to patent protection. In rare circumstances, standards covered by a patent may be adopted, but only on the understanding that the patent owner will not enforce such patent rights or, at a minimum, that the patent owner will provide a reasonable and non-discriminatory license to the patented technology.[3] References[edit]

^ a b c https://www.jedec.org/about-jedec/jedec-history ^ " JEDEC
JEDEC
History". jedec.org. JEDEC. Retrieved 1 May 2017.  ^ "§8.2 of the JEDEC
JEDEC
Manual of Organization and Procedure (JM21-M)" (PDF). JEDEC
JEDEC
Solid State Technology Association. July 2002. Archived from the original (PDF) on 2006-03-08. 

External links[edit]

Electronics portal

Official website List of JEDEC
JEDEC
member companies JEP95, the master JEDEC
JEDEC
package list (free registration required)

v t e

Dynamic random-access memory
Dynamic random-access memory
(DRAM)

Asynchronous

FPM RAM EDO RAM

Synchronous

SDRAM Fast Cycle DRAM (FCRAM) RLDRAM DDR SDRAM Mobile DDR
Mobile DDR
(LPDDR) DDR2 SDRAM DDR3 SDRAM DDR4 SDRAM DDR5 SDRAM High Bandwidth Memory

HBM2 HBM3

Hybrid Memory Cube

Graphics

VRAM WRAM MDRAM SGRAM GDDR2 GDDR3 GDDR4 GDDR5 GDDR6

Rambus

RDRAM XDR DRAM XDR2 DRAM

Memory modules

SIMM DIMM SO-DIMM UniDIMM

v t e

Solid-state drives

Key terminology

Encryption ECC Flash file system Flash memory SLC/MLC Flash memory
Flash memory
controller Garbage collection IOPS MB/s Memory wear Open-channel SSD Over-provisioning Read disturb Secure erase Solid-state storage Trim command Wear leveling Write amplification

Flash manufacturers

IM Flash Technologies Micron Samsung SK hynix Partnership between SanDisk
SanDisk
and Toshiba

Controllers

Independent

Greenliant Systems Indilinx (bankrupt, assets sold to Toshiba) JMicron Marvell Phison PMC-Sierra SandForce
SandForce
(now part of Seagate) SMI

Captive

Fusion-io HGST

sTec

Intel Micron Samsung Seagate Toshiba

OCZ

SSD manufacturers

List of solid-state drive manufacturers Intel

Interfaces

Advanced Host Controller Interface (AHCI) Fibre Channel
Fibre Channel
(FC) NVM Express
NVM Express
(NVMe) PCI Express
PCI Express
(PCIe) SATA Express Serial ATA
Serial ATA
(SATA) Serial attached SCSI
Serial attached SCSI
(SAS) Universal Serial Bus (USB)

Configurations

HDD form factors mSATA M.2 PCI Express
PCI Express
expansion card Thunderbolt

Mini DisplayPort USB
USB
Type-C

U.2

Related organizations

INCITS JEDEC
JEDEC
/ JC-42, JC-64.8 ONFI NVMHCI Work Group USB-IF SATA-IO SFF Committee SNIA SSSI T10/SCSI T11/FC T13/A

.