|
Circuit Check
Circuit Check is an American company with about 225 employees and seven direct operations in six countries (the U.S., Canada, Mexico, United Kingdom, China, and Malaysia). Headquartered in Maple Grove, Minnesota, it is one of the largest manufacturers of electronic and mechanical test fixtures in North America, . The company also manufactures Automatic Test Equipment for end-of-line manufacturing test. The company uses either a Microsoft Excel-driven "CCITest" software platform, or the National Instruments LabVIEW software platform. They have a variety of clients in different industries which include: Automotive, Military & Aerospace, Medical, Industrial, and Computer Networking. History Circuit Check was founded in 1978 as a spin-out of a printed circuit board drilling service bureau, "CircuitDrill." The initial product was test fixtures for bed of nails testers. Over the following years, the company developed innovations for in-circuit test and functional test or FCT. On ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Maple Grove, Minnesota
Maple Grove is a suburban city in Hennepin County, Minnesota, United States. The population was 70,253 at the 2020 United States census, 2020 census. making it Minnesota's 11th most populous city. Maple Grove serves as a retail, cultural and medical center in the northwest region of the Minneapolis–Saint Paul metropolitan area. One of the Twin Cities' largest shopping centers, The Shoppes at Arbor Lakes, is in Maple Grove. Maple Grove is also home to the Hindu Temple of Minnesota, the state's largest Hindu temple. History Ho-Chunk, Winnebago were the only inhabitants in the Maple Grove area until 1851, when Louis Gervais arrived and settled. Four years later, city growth included a church, town hall, and many homes. The Pierre Bottineau House was the first wood-frame house built in Maple Grove Township, in 1854. The house has been moved from its original location and is now in the Elm Creek Park Reserve. The city was known for its large stands of maple trees and was a signific ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Bed Of Nails Tester
A bed of nails tester is a traditional electronic test fixture used for in-circuit testing. It has pins inserted into holes in an epoxy phenolic glass cloth laminated sheet (G-10) which are aligned using tooling pins to make contact with test points on a printed circuit board and are also connected to a measuring unit by wires. Named by analogy with a real-world bed of nails, these devices contain an array of small, spring-loaded pogo pins; each pogo pin makes contact with one node in the circuitry of the DUT (device under test). By pressing the DUT down against the bed of nails, reliable contact can be quickly and simultaneously made with hundreds or even thousands of individual test points within the circuitry of the DUT. The hold-down force may be provided manually or by means of a vacuum or a mechanical presser, thus pulling the DUT downwards onto the nails. Devices that have been tested on a bed of nails tester may show evidence of this after the process: small dimples (fro ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
American Brands
Fortune Brands was a holding company founded in 1969 as American Brands, renamed in 1997 and split apart in 2011. The corporate headquarters was in Deerfield, Illinois, in the United States. The company had diversified product lines. It announced on December 8, 2010, that it would focus on its liquor business, and spin off or sell other parts of the company including home furnishings, hardware and golf products.Fortune Brands Announces Intent to Separate Company's Three Businesses , ''The Wall Street Journal'', December 8, 2010. The company sold its Titleist and FootJoy product lines to [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Solder
Solder (; North American English, NA: ) is a fusible alloy, fusible metal alloy used to create a permanent bond between metal workpieces. Solder is melted in order to wet the parts of the joint, where it adheres to and connects the pieces after cooling. Metals or alloys suitable for use as solder should have a lower melting point than the pieces to be joined. The solder should also be resistant to oxidative and corrosive effects that would degrade the joint over time. Solder used in making electrical connections also needs to have favorable electrical characteristics. Soft solder typically has a melting point range of , and is commonly used in electronics, plumbing, and sheet metal work. Alloys that melt between are the most commonly used. Soldering performed using alloys with a melting point above is called "hard soldering", "silver soldering", or brazing. In specific proportions, some alloys are eutectic — that is, the alloy's melting point is the lowest possible for a ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Ball Grid Array
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The traces connecting the package's leads to the wires or balls which connect the die to package are also on average shorter than with a perimeter-only type, leading to better performance at high speeds. Soldering of BGA devices requires precise control and is usually done by automated processes such as in computer-controlled automatic reflow ovens. Description The BGA is descended from the pin grid array (PGA), which is a package with one face covered (or partly covered) with pins in a grid pattern which, in operation, conduct electrical signals between the integrated circuit and the printed circuit board (PCB) ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Pogo Pin
A pogo pin or spring-loaded pin is a type of electrical connector mechanism with spring plungers that is used in many modern electronic applications and in the electronics testing industry. They are used for their improved durability over other electrical contacts, and the resilience of their electrical connection to mechanical shock and vibration. The name ''pogo pin'' comes from the pin's resemblance to a pogo stickthe integrated helical spring in the pin applies a constant normal force against the back of the mating receptacle or contact plate, counteracting any unwanted movement which might otherwise cause an intermittent connection. This helical spring makes pogo pins unique, since most other types of pin mechanisms use a cantilever spring or expansion sleeve. A complete connection path requires a mating receptacle for the pin to engage, which is termed a ''target'' or ''land''. A pogo target consists of a flat or concave metal surface, which unlike the pins, has no movin ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Ball Grid Array
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The traces connecting the package's leads to the wires or balls which connect the die to package are also on average shorter than with a perimeter-only type, leading to better performance at high speeds. Soldering of BGA devices requires precise control and is usually done by automated processes such as in computer-controlled automatic reflow ovens. Description The BGA is descended from the pin grid array (PGA), which is a package with one face covered (or partly covered) with pins in a grid pattern which, in operation, conduct electrical signals between the integrated circuit and the printed circuit board (PCB) ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Strain Gage
A strain gauge (also spelled strain gage) is a device used to measure strain on an object. Invented by Edward E. Simmons and Arthur C. Ruge in 1938, the most common type of strain gauge consists of an insulating flexible backing which supports a metallic foil pattern. The gauge is attached to the object by a suitable adhesive, such as cyanoacrylate. As the object is deformed, the foil is deformed, causing its electrical resistance to change. This resistance change, usually measured using a Wheatstone bridge, is related to the strain by the quantity known as the gauge factor. History Edward E. Simmons and Professor Arthur C. Ruge independently invented the strain gauge. Simmons was involved in a research project by Dätwyler and Clark at Caltech between 1936 and 1938. They researched the stress-strain behavior of metals under shock loads. Simmons came up with an original way to measure the force introduced into the sample by equipping a dynamometer with fine resistance wir ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Test Probe
A test probe is a physical device used to connect electronic test equipment to a device under test (DUT). Test probes range from very simple, robust devices to complex probes that are sophisticated, expensive, and fragile. Specific types include test prods, oscilloscope probes and current probes. A test probe is often supplied as a test lead, which includes the probe, cable and terminating connector. Voltage Voltage probes are used to measure voltages present on the DUT. To achieve high accuracy, the test instrument and its probe must not significantly affect the voltage being measured. This is accomplished by ensuring that the combination of instrument and probe exhibit a sufficiently high impedance that will not load the DUT. For AC measurements, the reactive component of impedance may be more important than the resistive. Simple test leads A typical voltmeter probe consists of a single wire ''test lead'' that has on one end a connector that fits the voltmeter and on t ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Circuit Board
A printed circuit board (PCB), also called printed wiring board (PWB), is a laminated sandwich structure of conductive and insulating layers, each with a pattern of traces, planes and other features (similar to wires on a flat surface) etched from one or more sheet layers of copper laminated onto or between sheet layers of a non-conductive substrate. PCBs are used to connect or "wire" components to one another in an electronic circuit. Electrical components may be fixed to conductive pads on the outer layers, generally by soldering, which both electrically connects and mechanically fastens the components to the board. Another manufacturing process adds vias, metal-lined drilled holes that enable electrical interconnections between conductive layers, to boards with more than a single side. Printed circuit boards are used in nearly all electronic products today. Alternatives to PCBs include wire wrap and point-to-point construction, both once popular but now rarely ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Strain Gage
A strain gauge (also spelled strain gage) is a device used to measure strain on an object. Invented by Edward E. Simmons and Arthur C. Ruge in 1938, the most common type of strain gauge consists of an insulating flexible backing which supports a metallic foil pattern. The gauge is attached to the object by a suitable adhesive, such as cyanoacrylate. As the object is deformed, the foil is deformed, causing its electrical resistance to change. This resistance change, usually measured using a Wheatstone bridge, is related to the strain by the quantity known as the gauge factor. History Edward E. Simmons and Professor Arthur C. Ruge independently invented the strain gauge. Simmons was involved in a research project by Dätwyler and Clark at Caltech between 1936 and 1938. They researched the stress-strain behavior of metals under shock loads. Simmons came up with an original way to measure the force introduced into the sample by equipping a dynamometer with fine resistance wir ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Functional Test
In software development, functional testing is a form of software testing that verifies whether a system meets its functional requirements.ISO/IEC/IEEE 24765:2017, "Systems and software engineering — Vocabulary", International Organization for Standardization, Geneva, Switzerland, 2017. Generally, functional testing is black-box, meaning the internal program structure is ignored (unlike for white-box testing).Kaner, Falk, Nguyen. ''Testing Computer Software''. Wiley Computer Publishing, 1999, p. 42. . Sometimes, functional testing is a quality assurance (QA) process.Prasad, Dr. K.V.K.K. (2008) ''ISTQB Certification Study Guide'', Wiley, , p. vi As a form of system testing, functional testing tests slices of functionality of the whole system. Despite similar naming, functional testing is not testing the code of a single function. The concept of incorporating testing earlier in the delivery cycle is not restricted to functional testing. Types Functional testing include ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
