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Southbridge (computing)
In computing, a southbridge is a component of a traditional two-part chipset architecture on motherboards, historically used in personal computers. It works alongside the northbridge to manage communications between the central processing unit (CPU) and lower-speed peripheral interfaces. The northbridge typically handled high-speed connections such as RAM and GPU interfaces, while the southbridge managed lower-speed functions. The southbridge controls a range of input/output (I/O) functions, including USB, audio, firmware (e.g., BIOS or UEFI), storage interfaces such as SATA, NVMe, and legacy PATA, as well as buses like PCI, LPC, and SPI. Southbridge and northbridge components were often designed to work in pairs, though there was no universal standard for interoperability. In the 1990s and early 2000s, they commonly communicated via the PCI bus; more recent chipsets use Direct Media Interface (Intel) or PCI Express (AMD). Intel referred to its southbridge as the ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Chipset Schematic
In a computer system, a chipset is a set of electronic components on one or more integrated circuits that manages the data flow between the processor, memory and peripherals. The chipset is usually found on the motherboard of computers. Chipsets are usually designed to work with a specific family of microprocessors. Because it controls communications between the processor and external devices, the chipset plays a crucial role in determining system performance. Sometimes the term "chipset" is used to describe a system on chip (SoC) used in a mobile phone. Computers In computing, the term ''chipset'' commonly refers to a set of specialized chips on a computer's motherboard or an expansion card. In personal computers, the first chipset for the IBM PC AT of 1984 was the NEAT chipset developed by Chips and Technologies for the Intel 80286 CPU. In home computers, game consoles, and arcade hardware of the 1980s and 1990s, the term ''chipset'' was used for the custom audio and ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Direct Media Interface
In computing, Direct Media Interface (DMI) is Intel's proprietary link between the northbridge (or CPU) and southbridge (e.g. Platform Controller Hub family) chipset on a computer motherboard. It was first used between the 9xx chipsets and the ICH6, released in 2004. Previous Intel chipsets had used the Intel Hub Architecture to perform the same function, and server chipsets use a similar interface called ''Enterprise Southbridge Interface'' (ESI). While the "DMI" name dates back to ICH6, Intel mandates specific combinations of compatible devices, so the presence of a DMI does not guarantee by itself that a particular northbridge–southbridge combination is allowed. DMI is essentially PCI Express, using multiple lanes and differential signaling to form a point-to-point link. Most implementations use a ×8 or ×4 link, while some mobile systems (e.g. 915GMS, 945GMS/GSE/GU and the Atom N450) use a ×2 link, halving the bandwidth. The original implementation provides 10& ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Conventional PCI
Peripheral Component Interconnect (PCI) is a local computer bus for attaching hardware devices in a computer and is part of the PCI Local Bus standard. The PCI bus supports the functions found on a processor bus but in a standardized format that is independent of any given processor's native bus. Devices connected to the PCI bus appear to a bus master to be connected directly to its own bus and are assigned addresses in the processor's address space. It is a parallel bus, synchronous to a single bus clock. Attached devices can take either the form of an integrated circuit fitted onto the motherboard (called a ''planar device'' in the PCI specification) or an expansion card that fits into a slot. The PCI Local Bus was first implemented in IBM PC compatibles, where it displaced the combination of several slow Industry Standard Architecture (ISA) slots and one fast VESA Local Bus (VLB) slot as the bus configuration. It has subsequently been adopted for other computer type ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
AMD Ryzen
Ryzen ( ) is a brand of multi-core x86-64 microprocessors, designed and marketed by AMD for desktop, mobile, server, and embedded platforms, based on the Zen microarchitecture. It consists of central processing units (CPUs) marketed for mainstream, enthusiast, server, and workstation segments, and accelerated processing units (APUs), marketed for mainstream and entry-level segments, and embedded systems applications. A majority of AMD's consumer Ryzen products use the AM4 and AM5 platforms. In August 2017, AMD launched their Ryzen Threadripper line aimed at the enthusiast and workstation markets. Ryzen Threadripper uses different, larger sockets such as TR4, sTRX4, sWRX8, and sTR5, which support additional memory channels and PCI Express lanes. AMD has moved to the new AM5 platform for consumer desktop Ryzen with the release of Zen 4 products in late 2022. History Background Ryzen uses the "Zen" CPU microarchitecture, a redesign that returned AMD to the high-en ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Chiplet
A chiplet is a tiny integrated circuit (IC) that contains a well-defined subset of functionality. It is designed to be combined with other chiplets on an interposer in a single package to create a complex component such as a computer processor. Each chiplet in a computer processor provides only a portion of the processor's total functionality. A set of chiplets can be implemented in a mix-and-match "Lego-like" assembly. This provides several advantages over a traditional system on chip (SoC) which is monolithic as it comprises a single silicon die: * Reusable IP (intellectual property): the same chiplet can be used in many different devices * Heterogeneous integration: chiplets can be fabricated with different processes, materials, and nodes, each optimized for its particular function * Known good die: chiplets can be tested before assembly, improving the yield of the final device. Multiple chiplets working together in a single integrated circuit may be called a multi-chip modul ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Fusion Controller Hub
This is an overview of chipsets sold under the AMD brand, manufactured before May 2004 by the company itself, before the adoption of open platform approach as well as chipsets manufactured by ATI Technologies after October 2006 as the completion of the ATI acquisition. North- and Southbridges Northbridges AMD-xxx A-Link Express II A-Link Express and A-Link Express II are essentially PCIe 1.1 x4 lanes. See Comparison of ATI Chipsets for the comparison of chipsets sold under the ATI brand for AMD processors, before AMD's acquisition of ATI. A-Link Express III A-Link Express III is essentially PCIe 2.0 x4 lanes. Southbridges AMD-xxx 1 Parallel ATA, also known as Enhanced IDE supports up to 2 devices per channel. A-Link Express * All models support eSATA implementations of available SATA channels. 1 Parallel ATA, also known as Enhanced IDE supports up to 2 devices per channel. Fusion controller hubs (FCH) For AMD APU models from 2011 until 201 ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Intel 5 Series
Intel 5 Series is a computing architecture introduced in 2008 that improves the efficiency and balances the use of communication channels in the motherboard. The architecture consists primarily of a central processing unit (CPU) (connected to the graphics card and memory) and a single chipset (connected to motherboard components). All motherboard communications and activities circle around these two devices. The architecture is a product of adjustments made to the Intel 4 Series to deliver higher performance motherboards while maintaining efficiency and low power. The changes revolve around chipset and processor design, in conjunction with a rearrangement of functions and controllers. The result is the first major change in many years of computing. Design concept The concept of the architecture was to improve motherboard mechanics to keep pace with the CPU as it gained more speed and multiplied in number of cores. In the previous architecture, the CPU was communicating heavily wi ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
AMD Fusion
AMD Accelerated Processing Unit (APU), formerly known as Fusion, is a series of 64-bit microprocessors from Advanced Micro Devices (AMD), combining a general-purpose AMD64 central processing unit ( CPU) and 3D integrated graphics processing unit (IGPU) on a single die. AMD announced the first generation APUs, ''Llano'' for high-performance and ''Brazos'' for low-power devices, in January 2011 and launched the first units on June 14. The second generation ''Trinity'' for high-performance and ''Brazos-2'' for low-power devices were announced in June 2012. The third generation ''Kaveri'' for high performance devices were launched in January 2014, while ''Kabini'' and ''Temash'' for low-power devices were announced in the summer of 2013. Since the launch of the Zen microarchitecture, Ryzen and Athlon APUs have released to the global market as Raven Ridge on the DDR4 platform, after Bristol Ridge a year prior. AMD has also supplied semi-custom APUs for consoles starting with the r ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Sandy Bridge
Sandy Bridge is the List of Intel codenames, codename for Intel's 32 nm process, 32 nm microarchitecture used in the second generation of the Intel Core, Intel Core processors (Intel Core i7, Core i7, Intel Core i5, i5, Intel Core i3, i3). The Sandy Bridge microarchitecture is the successor to Nehalem (microarchitecture), Nehalem and Westmere (microarchitecture), Westmere microarchitecture. Intel demonstrated an A1 stepping Sandy Bridge processor in 2009 during Intel Developer Forum (IDF), and released first products based on the architecture in January 2011 under the Intel Core#Sandy Bridge microarchitecture based, Core brand. Sandy Bridge is manufactured in the 32 nanometer, 32 nm process and has a soldered contact with the die and IHS (Integrated Heat Spreader), while Intel's subsequent generation Ivy Bridge (microarchitecture), Ivy Bridge uses a 22 nanometer, 22 nm die shrink and a TIM (Thermal Interface Material) between the die and the IHS. Technology Intel demonstrated a S ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Intel
Intel Corporation is an American multinational corporation and technology company headquartered in Santa Clara, California, and Delaware General Corporation Law, incorporated in Delaware. Intel designs, manufactures, and sells computer components such as central processing units (CPUs) and related products for business and consumer markets. It is one of the world's List of largest semiconductor chip manufacturers, largest semiconductor chip manufacturers by revenue, and ranked in the Fortune 500, ''Fortune'' 500 list of the List of largest companies in the United States by revenue, largest United States corporations by revenue for nearly a decade, from 2007 to 2016 Fiscal year, fiscal years, until it was removed from the ranking in 2018. In 2020, it was reinstated and ranked 45th, being the List of Fortune 500 computer software and information companies, 7th-largest technology company in the ranking. It was one of the first companies listed on Nasdaq. Intel supplies List of I ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Die (integrated Circuit)
A die, in the context of integrated circuits, is a small block of semiconducting material on which a given functional circuit is Semiconductor fabrication, fabricated. Typically, integrated circuits are produced in large batches on a single wafer (electronics), wafer of electronic-grade Monocrystalline silicon, silicon (EGS) or other semiconductor (such as Gallium arsenide, GaAs) through processes such as photolithography. The wafer is cut (wafer dicing, diced) into many pieces, each containing one copy of the circuit. Each of these pieces is called a die. There are three commonly used plural forms: ''dice'', ''dies,'' and ''die''. To simplify handling and integration onto a printed circuit board, most dies are integrated circuit packaging, packaged in List of electronic component packaging types, various forms. Manufacturing process Most dies are composed of silicon and used for integrated circuits. The process begins with the production of Single crystal, monocrystalline sili ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
System On A Chip
A system on a chip (SoC) is an integrated circuit that combines most or all key components of a computer or Electronics, electronic system onto a single microchip. Typically, an SoC includes a central processing unit (CPU) with computer memory, memory, input/output, and computer data storage#Secondary storage, data storage control functions, along with optional features like a graphics processing unit (GPU), Wi-Fi connectivity, and radio frequency processing. This high level of integration minimizes the need for separate, discrete components, thereby enhancing Performance per watt, power efficiency and simplifying device design. High-performance SoCs are often paired with dedicated memory, such as LPDDR, and flash storage chips, such as Universal Flash Storage, eUFS or eMMC, which may be stacked directly on top of the SoC in a Package on a package, package-on-package (PoP) configuration or placed nearby on the motherboard. Some SoCs also operate alongside specialized chips, such ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
