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Signal Integrity
Signal integrity or SI is a set of measures of the quality of an electrical signal. In digital electronics, a stream of binary values is represented by a voltage (or current) waveform. However, digital signals are fundamentally analog signal, analog in nature, and all signals are subject to effects such as electrical noise, noise, distortion, and loss. Over short distances and at low bit rates, a simple conductor can transmit this with sufficient fidelity. At high bit rates and over longer distances or through various mediums, various effects can degrade the electrical signal to the point where errors occur and the system or device fails. Signal integrity engineering is the task of analyzing and mitigating these effects. It is an important activity at all levels of electronics packaging and assembly, from internal connections of an integrated circuit (IC), A survey of the field of electronic design automation. Portions of IC section of this article were derived (with permission) fro ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] [Amazon] |
DDR3 DQ Eye Diagram
Double Data Rate 3 Synchronous Dynamic Random-Access Memory (DDR3 SDRAM) is a type of synchronous dynamic random-access memory (SDRAM) with a high Bandwidth (computing), bandwidth ("double data rate") interface, and has been in use since 2007. It is the higher-speed successor to DDR SDRAM, DDR and DDR2 SDRAM, DDR2 and predecessor to DDR4 SDRAM, DDR4 synchronous dynamic random-access memory (SDRAM) chips. DDR3 SDRAM is neither Forward compatibility, forward nor Backward compatibility, backward compatible with any earlier type of random-access memory (RAM) because of different signaling voltages, timings, and other factors. DDR3 is a DRAM interface specification. The actual DRAM arrays that store the data are similar to earlier types, with similar performance. The primary benefit of DDR3 SDRAM over its immediate predecessor DDR2 SDRAM, is its ability to transfer data at twice the rate (eight times the speed of its internal memory arrays), enabling higher bandwidth or peak data ra ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] [Amazon] |
Transatlantic Telegraph Cable
Transatlantic telegraph cables were undersea cables running under the Atlantic Ocean for telegraph communications. Telegraphy is a largely obsolete form of communication, and the cables have long since been decommissioned, but telephone and data are still carried on other transatlantic telecommunications cables. The Atlantic Telegraph Company led by Cyrus West Field constructed the first transatlantic telegraph cable. The project began in 1854 with the first cable laid from Valentia Island off the west coast of Ireland to Bay of Bulls, Trinity Bay, Newfoundland. The first communications occurred on August 16, 1858, but the line speed was poor. The first official telegram to pass between two continents that day was a letter of congratulations from Queen Victoria of the United Kingdom to President of the United States James Buchanan. Signal quality declined rapidly, slowing transmission to an almost unusable speed. The cable was destroyed after three weeks when Wildman ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] [Amazon] |
Capacitance
Capacitance is the ability of an object to store electric charge. It is measured by the change in charge in response to a difference in electric potential, expressed as the ratio of those quantities. Commonly recognized are two closely related notions of capacitance: ''self capacitance'' and ''mutual capacitance''. An object that can be electrically charged exhibits self capacitance, for which the electric potential is measured between the object and ground. Mutual capacitance is measured between two components, and is particularly important in the operation of the capacitor, an elementary linear electronic component designed to add capacitance to an electric circuit. The capacitance between two conductors depends only on the geometry; the opposing surface area of the conductors and the distance between them; and the permittivity of any dielectric material between them. For many dielectric materials, the permittivity, and thus the capacitance, is independent of the potential ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] [Amazon] |
CMOS
Complementary metal–oxide–semiconductor (CMOS, pronounced "sea-moss ", , ) is a type of MOSFET, metal–oxide–semiconductor field-effect transistor (MOSFET) semiconductor device fabrication, fabrication process that uses complementary and symmetrical pairs of p-type semiconductor, p-type and n-type semiconductor, n-type MOSFETs for logic functions. CMOS technology is used for constructing integrated circuit (IC) chips, including microprocessors, microcontrollers, memory chips (including Nonvolatile BIOS memory, CMOS BIOS), and other digital logic circuits. CMOS technology is also used for analog circuits such as image sensors (CMOS sensors), data conversion, data converters, RF circuits (RF CMOS), and highly integrated transceivers for many types of communication. In 1948, Bardeen and Brattain patented an insulated-gate transistor (IGFET) with an inversion layer. Bardeen's concept forms the basis of CMOS technology today. The CMOS process was presented by Fairchild Semico ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] [Amazon] |
Opportunity Cost
In microeconomic theory, the opportunity cost of a choice is the value of the best alternative forgone where, given limited resources, a choice needs to be made between several mutually exclusive alternatives. Assuming the best choice is made, it is the "cost" incurred by not enjoying the ''benefit'' that would have been had if the second best available choice had been taken instead. The '' New Oxford American Dictionary'' defines it as "the loss of potential gain from other alternatives when one alternative is chosen". As a representation of the relationship between scarcity and choice, the objective of opportunity cost is to ensure efficient use of scarce resources. It incorporates all associated costs of a decision, both explicit and implicit. Thus, opportunity costs are not restricted to monetary or financial costs: the real cost of output forgone, lost time, pleasure, or any other benefit that provides utility should also be considered an opportunity cost. Types Expl ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] [Amazon] |
Photomask
A photomask (also simply called a mask) is an opaque plate with transparent areas that allow light to shine through in a defined pattern. Photomasks are commonly used in photolithography for the production of integrated circuits (ICs or "chips") to produce a pattern on a thin wafer of material (usually silicon). In semiconductor manufacturing, a mask is sometimes called a reticle. In photolithography, several masks are used in turn, each one reproducing a layer of the completed design, and together known as a mask set. A curvilinear photomask has patterns with curves, which is a departure from conventional photomasks which only have patterns that are completely vertical or horizontal, known as manhattan geometry. These photomasks require special equipment to manufacture. History For IC production in the 1960s and early 1970s, an opaque rubylith film laminated onto a transparent mylar sheet was used. The design of one layer was cut into the rubylith, initially by hand on an i ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] [Amazon] |
Printed Circuit
A printed circuit board (PCB), also called printed wiring board (PWB), is a laminated sandwich structure of conductive and insulating layers, each with a pattern of traces, planes and other features (similar to wires on a flat surface) etched from one or more sheet layers of copper laminated onto or between sheet layers of a non-conductive substrate. PCBs are used to connect or "wire" components to one another in an electronic circuit. Electrical components may be fixed to conductive pads on the outer layers, generally by soldering, which both electrically connects and mechanically fastens the components to the board. Another manufacturing process adds vias, metal-lined drilled holes that enable electrical interconnections between conductive layers, to boards with more than a single side. Printed circuit boards are used in nearly all electronic products today. Alternatives to PCBs include wire wrap and point-to-point construction, both once popular but now rarely ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] [Amazon] |
Integrated Circuits
An integrated circuit (IC), also known as a microchip or simply chip, is a set of electronic circuits, consisting of various electronic components (such as transistors, resistors, and capacitors) and their interconnections. These components are etched onto a small, flat piece ("chip") of semiconductor material, usually silicon. Integrated circuits are used in a wide range of electronic devices, including computers, smartphones, and televisions, to perform various functions such as processing and storing information. They have greatly impacted the field of electronics by enabling device miniaturization and enhanced functionality. Integrated circuits are orders of magnitude smaller, faster, and less expensive than those constructed of discrete components, allowing a large transistor count. The IC's mass production capability, reliability, and building-block approach to integrated circuit design have ensured the rapid adoption of standardized ICs in place of designs using discre ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] [Amazon] |
Timing Closure
The Timing closure in VLSI design and electronics engineering is the process by which a logic design of a clocked synchronous circuit consisting of primitive elements such as combinatorial logic gates ( AND, OR, NOT, NAND, NOR, etc.) and sequential logic gates (flip flops, latches, memories) is modified to meet its timing requirements. Unlike in a computer program where there is no explicit delay to perform a calculation, logic circuits have intrinsic and well defined delays to propagate inputs to outputs. Overview In simple cases, the user can compute the path delay between elements manually. If the design is more than a dozen or so elements this is impractical. For example, the time delay along a path from the output of a D-Flip Flop, through combinatorial logic gates, then into the next D-Flip Flop input must satisfy (be less than) the time period between synchronizing clock pulses to the two flip flops. When the delay through the elements is greater than the clock cycle ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] [Amazon] |
Moore's Law
Moore's law is the observation that the Transistor count, number of transistors in an integrated circuit (IC) doubles about every two years. Moore's law is an observation and Forecasting, projection of a historical trend. Rather than a law of physics, it is an empirical relationship. It is an experience-curve law, a type of law quantifying efficiency gains from experience in production. The observation is named after Gordon Moore, the co-founder of Fairchild Semiconductor and Intel and former CEO of the latter, who in 1965 noted that the number of components per integrated circuit had been exponential growth, doubling every year, and projected this rate of growth would continue for at least another decade. In 1975, looking forward to the next decade, he revised the forecast to doubling every two years, a compound annual growth rate (CAGR) of 41%. Moore's empirical evidence did not directly imply that the historical trend would continue, nevertheless, his prediction has held si ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] [Amazon] |
Design Flows (EDA)
Design flows are the explicit combination of electronic design automation tools to accomplish the design of an integrated circuit. Moore's law has driven the entire IC implementation RTL to GDSII design flows from one which uses primarily stand-alone synthesis, placement, and routing algorithms to an integrated construction and analysis flows for design closure. The challenges of rising interconnect delay led to a new way of thinking about and integrating design closure tools. The RTL to GDSII flow underwent significant changes from 1980 through 2005. The continued scaling of CMOS technologies significantly changed the objectives of the various design steps. The lack of good predictors for delay has led to significant changes in recent design flows. New scaling challenges such as leakage power, variability, and reliability will continue to require significant changes to the design closure process in the future. Many factors describe what drove the design flow from a set of sep ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] [Amazon] |
