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Process Corners
In semiconductor manufacturing, a process corner is an example of a design-of-experiments (DoE) technique that refers to a variation of fabrication parameters used in applying an integrated circuit design to a semiconductor wafer. Process corners represent the extremes of these parameter variations within which a circuit that has been etched onto the wafer must function correctly. A circuit running on devices fabricated at these process corners may run slower or faster than specified and at lower or higher temperatures and voltages, but if the circuit does not function properly at any of these process extremes the design is considered to have inadequate design margin. To verify the robustness of an integrated circuit design, semiconductor manufacturers will fabricate corner lots, which are groups of wafers that have had process parameters adjusted according to these extremes, and will then test the devices made from these special wafers at varying increments of environmental co ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Semiconductor
A semiconductor is a material with electrical conductivity between that of a conductor and an insulator. Its conductivity can be modified by adding impurities (" doping") to its crystal structure. When two regions with different doping levels are present in the same crystal, they form a semiconductor junction. The behavior of charge carriers, which include electrons, ions, and electron holes, at these junctions is the basis of diodes, transistors, and most modern electronics. Some examples of semiconductors are silicon, germanium, gallium arsenide, and elements near the so-called " metalloid staircase" on the periodic table. After silicon, gallium arsenide is the second-most common semiconductor and is used in laser diodes, solar cells, microwave-frequency integrated circuits, and others. Silicon is a critical element for fabricating most electronic circuits. Semiconductor devices can display a range of different useful properties, such as passing current more easil ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Die (integrated Circuit)
A die, in the context of integrated circuits, is a small block of semiconducting material on which a given functional circuit is Semiconductor fabrication, fabricated. Typically, integrated circuits are produced in large batches on a single wafer (electronics), wafer of electronic-grade Monocrystalline silicon, silicon (EGS) or other semiconductor (such as Gallium arsenide, GaAs) through processes such as photolithography. The wafer is cut (wafer dicing, diced) into many pieces, each containing one copy of the circuit. Each of these pieces is called a die. There are three commonly used plural forms: ''dice'', ''dies,'' and ''die''. To simplify handling and integration onto a printed circuit board, most dies are integrated circuit packaging, packaged in List of electronic component packaging types, various forms. Manufacturing process Most dies are composed of silicon and used for integrated circuits. The process begins with the production of Single crystal, monocrystalline sili ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Simulation
A simulation is an imitative representation of a process or system that could exist in the real world. In this broad sense, simulation can often be used interchangeably with model. Sometimes a clear distinction between the two terms is made, in which simulations require the use of models; the model represents the key characteristics or behaviors of the selected system or process, whereas the simulation represents the evolution of the model over time. Another way to distinguish between the terms is to define simulation as experimentation with the help of a model. This definition includes time-independent simulations. Often, computer simulation, computers are used to execute the simulation. Simulation is used in many contexts, such as simulation of technology for performance tuning or optimizing, safety engineering, testing, training, education, and video games. Simulation is also used with scientific modelling of natural systems or human systems to gain insight into their functio ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
BSIM
BSIM (Berkeley Short-channel IGFET Model) refers to a family of MOSFET transistor models for integrated circuit design. It also refers to the BSIM group located in the Department of Electrical Engineering and Computer Sciences (EECS) at the University of California, Berkeley, that develops these models. Accurate transistor models are needed for electronic circuit simulation, which in turn is needed for integrated circuit design. As the devices become smaller in each process generation (see Moore's law), new models are needed to accurately reflect the transistor's behavior. Commercial and industrial analog simulators (such as SPICE) have added many other device models as technology advanced and earlier models became inaccurate. To attempt standardization of these models so that a set of model parameters may be used in different simulators, an industry working group was formed, the Compact Model Coalition, to choose, maintain, and promote the use of standard models. BSIM models, d ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
SPICE
In the culinary arts, a spice is any seed, fruit, root, Bark (botany), bark, or other plant substance in a form primarily used for flavoring or coloring food. Spices are distinguished from herbs, which are the leaves, flowers, or stems of plants used for flavoring or as a garnish (food), garnish. Spices and seasoning do not mean the same thing, but spices fall under the seasoning category with herbs. Spices are sometimes used in medicine, Sacred rite, religious rituals, cosmetics, or perfume production. They are usually classified into spices, spice seeds, and herbal categories. For example, vanilla is commonly used as an ingredient in Aroma compound, fragrance manufacturing. Plant-based sweeteners such as sugar are not considered spices. Spices can be used in various forms, including fresh, whole, dried, grated, chopped, crushed, ground, or extracted into a tincture. These processes may occur before the spice is sold, during meal preparation in the kitchen, or even at the ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
90nm
The 90 nm process refers to the technology used in semiconductor manufacturing to create integrated circuits with a minimum feature size of 90 nanometers. It was an advancement over the previous 130 nm process. Eventually, it was succeeded by smaller process nodes, such as the 65 nm, 45 nm, and 32 nm processes. It was commercialized by the 2003–2005 timeframe, by semiconductor companies including Toshiba, Sony, Samsung, IBM, Intel, Fujitsu, TSMC, Elpida, AMD, Infineon, Texas Instruments and Micron Technology. The origin of the 90 nm value is historical; it reflects a trend of 70% scaling every 2–3 years. The naming is formally determined by the International Technology Roadmap for Semiconductors (ITRS). The 300 mm wafer size became mainstream at the 90 nm node. The previous wafer size was 200 mm diameter. The 193 nm wavelength was introduced by many (but not all) companies for lithography of critical layers mainly during the 90 nm ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Die Shrink
The term die shrink (sometimes optical shrink or process shrink) refers to the List of semiconductor scale examples, scaling of metal–oxide–semiconductor (MOS) devices. The act of shrinking a Die (integrated circuit), die creates a somewhat identical circuit using a more advanced fabrication process, usually involving an advance of lithographic semiconductor node, nodes. This reduces overall costs for a chip company, as the absence of major architectural changes to the Central processing unit, processor lowers research and development costs while at the same time allowing more processor dies to be manufactured on the same piece of silicon wafer, resulting in less cost per product sold. Die shrinks are the key to lower prices and higher performance at Semiconductor company, semiconductor companies such as Samsung Electronics, Samsung, Intel, TSMC, and SK Hynix, and fabless manufacturers such as Advanced Micro Devices, AMD (including the former ATI Technologies, ATI), Nvidia, ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Latch (electronics)
In electronics, flip-flops and latches are circuits that have two stable states that can store state information – a bistable multivibrator. The circuit can be made to change state by signals applied to one or more control inputs and will output its state (often along with its logical complement too). It is the basic storage element in sequential logic. Flip-flops and latches are fundamental building blocks of digital electronics systems used in computers, communications, and many other types of systems. Flip-flops and latches are used as data storage elements to store a single '' bit'' (binary digit) of data; one of its two states represents a "one" and the other represents a "zero". Such data storage can be used for storage of '' state'', and such a circuit is described as sequential logic in electronics. When used in a finite-state machine, the output and next state depend not only on its current input, but also on its current state (and hence, previous inputs). It can a ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Product Binning
Product binning is the categorizing of finished products based on their characteristics. Any mining, harvesting, or manufacturing process will yield products spanning a range of quality and desirability in the marketplace. Binning allows differing quality products to be priced appropriately for various uses and markets. Economic and legal theory In order to undergo binning, manufactured products require testing, usually performed by machines in bulk. Binning allows large variances in performance to be condensed into a smaller number of marketed designations. This ensures coherency in the marketplace, with tiers of performance clearly delineated. The immediate result of this practice is that, for legal and reputational reasons, products sold under a certain designation must meet that designation at a ''minimum''. Individual products may still exceed advertised performance. Different bins may even be assigned different model numbers and prices. Examples are listed in the sections b ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Carrier Mobility
In solid-state physics, the electron mobility characterizes how quickly an electron can move through a metal or semiconductor when pushed or pulled by an electric field. There is an analogous quantity for holes, called hole mobility. The term carrier mobility refers in general to both electron and hole mobility. Electron and hole mobility are special cases of electrical mobility of charged particles in a fluid under an applied electric field. When an electric field ''E'' is applied across a piece of material, the electrons respond by moving with an average velocity called the drift velocity, v_d. Then the electron mobility ''μ'' is defined as v_d = \mu E. Electron mobility is almost always specified in units of cm2/( V⋅ s). This is different from the SI unit of mobility, m2/( V⋅ s). They are related by 1 m2/(V⋅s) = 104 cm2/(V⋅s). Conductivity is proportional to the product of mobility and carrier concentration. For example, the same conductivity could come fro ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
PMOS Logic
PMOS or pMOS logic, from p-channel metal–oxide–semiconductor, is a family of digital circuits based on p-channel, enhancement mode metal–oxide–semiconductor field-effect transistors (MOSFETs). In the late 1960s and early 1970s, PMOS logic was the dominant semiconductor technology for large-scale integrated circuits before being superseded by NMOS and CMOS devices. History and application Mohamed Atalla and Dawon Kahng manufactured the first working MOSFET at Bell Labs in 1959. They fabricated both PMOS and NMOS devices but only the PMOS devices were working. It would be more than a decade before contaminants in the manufacturing process (particularly sodium) could be managed well enough to manufacture practical NMOS devices. Compared to the bipolar junction transistor, the only other device available at the time for use in an integrated circuit, the MOSFET offers a number of advantages: *Given semiconductor device fabrication processes of similar precision ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
NMOS Logic
NMOS or nMOS logic (from N-type metal–oxide–semiconductor) uses n-type (-) MOSFETs (metal–oxide–semiconductor field-effect transistors) to implement logic gates and other digital circuits. NMOS transistors operate by creating an inversion layer in a p-type transistor body. This inversion layer, called the n-channel, can conduct electrons between n-type ''source'' and ''drain'' terminals. The n-channel is created by applying voltage to the third terminal, called the ''gate''. Like other MOSFETs, nMOS transistors have four modes of operation: cut-off (or subthreshold), triode, saturation (sometimes called active), and velocity saturation. NMOS AND-by-default logic can produce unusual glitches or buggy behavior in NMOS components, such as the 6502 "illegal opcodes" which are absent in CMOS 6502s. In some cases such as Commodore's VIC-II chip, the bugs present in the chip's logic were extensively exploited by programmers for graphics effects. For many years, NMOS ci ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
