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VIA Eden
VIA Eden is a variant of VIA Technologies, VIA's VIA C3, C3/VIA C7, C7 x86 CPU, processors, designed to be used in embedded devices. They have smaller package sizes, lower power consumption, and somewhat lower computing performance than their C equivalents, due to reduced clock rates. They are often used in VIA EPIA, EPIA mini-ITX, nano-ITX, and Pico-ITX motherboards. In addition to x86 instruction decoding, the processors have a second undocumented Alternate Instruction Set. The Eden is available in four main versions: The Eden ULV 500 MHz was the first variant to achieve a Thermal design power, TDP of 1W .http://www.viatech.com/en/2007/08/via-announces-1-watt-processor-the-worlds-most-power-efficient-x86-cpu/ VIA Eden ULV 500MHz press release See also * List of VIA Eden microprocessors References External links VIA Eden Processors - Low Power Fanless Processing
VIA Technologies x86 microprocessors, Eden Computer-related introductions in 2007 {{Compu-hardware- ...
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KL VIA Eden ESP5000
KL, kL, kl, or kl. may refer to: Businesses and organizations * KLM, a Dutch airline (IATA airline designator KL) * Koninklijke Landmacht, the Royal Netherlands Army * Kvenna Listin ("Women's List"), a political party in Iceland * KL FM, a Malay language radio station Places * Kaiserslautern, Germany (license plate code KL) * Kerala, India (ISO 3166-2:IN sub-code KL) * Kirkland Lake, Ontario, Canada * Kowloon, Hong Kong * Kuala Lumpur, Malaysia Science, technology, and mathematics * KL engine, version of the Mazda K engine * Klepton (kl.), a type of species in zoology * Kiloliter (kL), a unit of volume * Kullback–Leibler divergence in mathematics * KL (gene), a gene which encodes the klotho enzyme in humans Other uses * Jeep Cherokee (KL) * Kalaallisut language (ISO 639 alpha-2 language code "kl") * Kl (digraph), used in the Zulu language to write /kʟ̥ʼ/ or /kxʼ/ * Konzentrationslager, or concentration camp, abbreviated KZ or KL * '' KL: A History of the Nazi Concentratio ...
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Motherboard
A motherboard, also called a mainboard, a system board, a logic board, and informally a mobo (see #Nomenclature, "Nomenclature" section), is the main printed circuit board (PCB) in general-purpose computers and other expandable systems. It holds and allows communication between many of the crucial electronic components of a system, such as the central processing unit (CPU) and computer memory, memory, and provides connectors for other peripherals. Unlike a backplane, a motherboard usually contains significant sub-systems, such as the CPU, the chipset's input/output and Memory controller, memory controllers, interface (computing), interface connectors, and other components integrated for general use. Nomenclature ''Oxford English Dictionary'' traces the origin of the word ''motherboard'' to 1965, its earliest-found attestation occurring in the magazine ''Electronics (magazine), Electronics''. The term alludes to its importance and size compared to the components attached to i ...
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List Of VIA Eden Microprocessors
The Eden microprocessors from VIA Technologies are fifth- and sixth-generation CPUs targeted at the embedded market. Embedded processors Eden ESP "Samuel 2" (150 nm) * All models support: '' MMX, 3DNow!'' "Nehemiah" (130 nm) * All models support: '' MMX, SSE, VIA PadLock (AES, RNG)'' Eden-N "Nehemiah" (130 nm) * All models support: '' MMX, SSE, VIA PadLock (AES, RNG)'' * VIA PowerSaver supported Eden "Esther" (standard-voltage, 90 nm) * All models support: '' MMX, SSE, SSE2, SSE3, NX bit, VIA PadLock (SHA, AES, Montgomery Multiplier, RNG)'' * VIA PowerSaver supported with up to 8 ACPI P-states * Idle power 500 mW "Esther" (ultra-low-voltage, 90 nm) * All models support: '' MMX, SSE, SSE2, SSE3, NX bit, VIA PadLock (SHA, AES, Montgomery Multiplier, RNG)'' * VIA PowerSaver supported with up to 8 ACPI P-states Eden X2 "Eden X2" (40 nm) * All models support: '' MMX, SSE, SSE2, SSE3, x86-64, NX bit, x86 virtualization, VIA PadLock (S ...
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Ball Grid Array
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The traces connecting the package's leads to the wires or balls which connect the die to package are also on average shorter than with a perimeter-only type, leading to better performance at high speeds. Soldering of BGA devices requires precise control and is usually done by automated processes such as in computer-controlled automatic reflow ovens. Description The BGA is descended from the pin grid array (PGA), which is a package with one face covered (or partly covered) with pins in a grid pattern which, in operation, conduct electrical signals between the integrated circuit and the printed circuit board (PCB) ...
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Front-side Bus
The front-side bus (FSB) is a computer communication interface ( bus) that was often used in Intel-chip-based computers during the 1990s and 2000s. The EV6 bus served the same function for competing AMD CPUs. Both typically carry data between the central processing unit (CPU) and a memory controller hub, known as the northbridge. Depending on the implementation, some computers may also have a back-side bus that connects the CPU to the cache. This bus and the cache connected to it are faster than accessing the system memory (or RAM) via the front-side bus. The speed of the front side bus is often used as an important measure of the performance of a computer. The original front-side bus architecture was replaced by HyperTransport, Intel QuickPath Interconnect, and Direct Media Interface, followed by Intel Ultra Path Interconnect and AMD's Infinity Fabric. History The term came into use by Intel Corporation about the time the Pentium Pro and Pentium II products were announ ...
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Semiconductor Package
A semiconductor package is a metal, plastic, glass, or ceramic casing containing one or more discrete semiconductor devices or integrated circuits. Individual components are fabricated on semiconductor wafers (commonly silicon) before being diced into die, tested, and packaged. The package provides a means for connecting it to the external environment, such as printed circuit board, via leads such as lands, balls, or pins; and protection against threats such as mechanical impact, chemical contamination, and light exposure. Additionally, it helps dissipate heat produced by the device, with or without the aid of a heat spreader. There are thousands of package types in use. Some are defined by international, national, or industry standards, while others are particular to an individual manufacturer. Package functions A semiconductor package may have as few as two leads or contacts for devices such as diodes, or in the case of advanced microprocessors, a package may have several th ...
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Clock Speed
Clock rate or clock speed in computing typically refers to the frequency at which the clock generator of a processor can generate pulses used to synchronize the operations of its components. It is used as an indicator of the processor's speed. Clock rate is measured in the SI unit of frequency hertz (Hz). The clock rate of the first generation of computers was measured in hertz or kilohertz (kHz), the first personal computers from the 1970s through the 1980s had clock rates measured in megahertz (MHz). In the 21st century the speed of modern CPUs is commonly advertised in gigahertz (GHz). This metric is most useful when comparing processors within the same family, holding constant other features that may affect performance. Determining factors Binning Manufacturers of modern processors typically charge higher prices for processors that operate at higher clock rates, a practice called binning. For a given CPU, the clock rates are determined at the end of the manufac ...
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Alternate Instruction Set
The Alternate Instruction Set (AIS) is a second 32-bit instruction set architecture found in some x86 CPUs made by VIA Technologies. On these VIA C3 processors, the second hidden processor mode is accessed by executing the x86 instruction JMPAI (). If AIS mode has been enabled, the processor will perform a JMP EAX and begin executing AIS instructions at the address of the EAX register. Using AIS allows native access to the Centaur Technology-designed RISC core inside the processor. Instruction format The manufacturer describes the Alternate Instruction Set as "an extended set of integer, MMX, floating-point, and 3DNow! instructions along with additional registers and some more powerful instruction forms". Every AIS instruction is prefixed with the 3-byte sequence 0x8D8400 followed by the 32-bit instruction; this prefix form for the AIS instructions makes them appear to be x86 Load Effective Address (LEA) instructions. In 2018 researcher Christopher Domas reported that the ...
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Pico-ITX
In computer design, Pico-ITX is a PC motherboard form factor announced by VIA Technologies in January 2007 and demonstrated later the same year at CeBIT. The formfactor was transferred over to SFF-SIG in 2008. The Pico-ITX form factor specifications call for the board to be , which is half the area of Nano-ITX. EPIA PX PX10000G The first motherboard produced in this form factor is called EPIA PX10000G. It is and the printed circuit board is 10 layers deep. The operating temperature range is from . The operating humidity level (relative and non-condensing) can be from 0% to about 95%. It uses a 1 GHz VIA C7-M processor, a VIA VX700 chip set, and is RoHS compliant. It has onboard VGA video, VIA VT6106S 10/100 8P8C Ethernet, UDMA 33/66/100/133 44-pin ATA (1x), and SATA (1x) I/O. DVI and LVDS video-out, USB 2.0, COM, PS/2 Mouse & Keyboard, and HD 5.1 channel audio (supplied by a VIA VT1708A chip) are supported through the usage of I/O pin headers and add-on ...
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CPU VIA EDEN ESP N8000
A central processing unit (CPU), also called a central processor, main processor, or just processor, is the primary Processor (computing), processor in a given computer. Its electronic circuitry executes Instruction (computing), instructions of a computer program, such as arithmetic, logic, controlling, and input/output (I/O) operations. This role contrasts with that of external components, such as main memory and I/O circuitry, and specialized coprocessors such as graphics processing units (GPUs). The form, CPU design, design, and implementation of CPUs have changed over time, but their fundamental operation remains almost unchanged. Principal components of a CPU include the arithmetic–logic unit (ALU) that performs arithmetic operation, arithmetic and Bitwise operation, logic operations, processor registers that supply operands to the ALU and store the results of ALU operations, and a control unit that orchestrates the #Fetch, fetching (from memory), #Decode, decoding and ...
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Nano-ITX
Nano-ITX is a computer motherboard form factor first proposed by VIA Technologies at CeBIT in March 2003, and implemented in late 2005. Nano-ITX boards measure , and are fully integrated, very low power consumption motherboards with many uses, but targeted at smart digital entertainment devices such as DVRs, set-top boxes, media centers, car PCs, and thin devices. Nano-ITX motherboards have slots for SO-DIMM. There are four Nano-ITX motherboard product lines so far, VIA's EPIA N, EPIA NL, EPIA NX, and the VIA EPIA NR. These boards are available from a wide variety of manufacturers supporting numerous different CPU platforms. Udoo has now released at least 1 nano-ITX board: the Udoo Bolt. See also *Mini-ITX *Pico-ITX *Mobile-ITX *EPIA, mini-ITX and nano-ITX motherboards from VIA *Ultra-Mobile PC *Minimig Minimig (a portmanteau of ''Mini Amiga'') is an open source re-implementation of an Amiga 500 using a field-programmable gate array (FPGA). Minimig started around Janu ...
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