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TO-263
The Double Decawatt Package, D2PAK, SOT404 or DDPAK, standardized as TO-263, is a semiconductor package type intended for surface mounting on circuit boards. The TO-263 is designed by Motorola. They are similar to the earlier TO-220-style packages intended for high power dissipation but lack the extended metal tab and mounting hole, while representing a larger version of the TO-252, also known as DPAK, SMT package. As with all SMT packages, the pins on a D2PAK are bent to lie against the PCB surface. The TO-263 can have 3 to 7 terminals. Image:D2PAK.JPG, A pair of MOSFETs in the surface-mount package D2PAK. Image:TO263 beside TO220.JPG, A TO-220 package compared to a D2PAK package. Dimensions Variants Texas instruments has a smaller version of the TO-263: the TO-263 THIN. The height of the TO-263 THIN is 2 mm instead of the standard 4.5 mm. See also *TO-220, through hole version of the TO-263 References External links Package informationfrom Fairchild Mecha ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
TO-252
TO-252, also known as DPAK or Decawatt Package, is a semiconductor package developed by Motorola for surface mounting on circuit boards. It represents a surface-mount variant of TO-251 package, and smaller variant of the D2PAK package. It is often used for high-power MOSFETs and voltage regulators. Variants Package can have 3 pins with pitch or 5 pins with pitch. The middle pin is usually connected to the tab. The middle pin is sometimes omitted. See also * TO-263 References External links TO-252 standardfrom JEDEC TO-252 drawingsfrom ON Semiconductor ON Semiconductor Corporation (stylized and doing business as onsemi) is an American semiconductor supplier company, based in Scottsdale, Arizona. Products include power and signal management, logic, discrete, and custom devices for automotive, c ... TO-252 package detailsfrom Central Semiconductor Corp. TO-252 (DPAK) package informationfrom Amkor Technology {{Semiconductor packages Semiconductor packages [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
TO-220
The TO-220 is a style of electronic package used for high-powered, through-hole components with pin spacing. The "TO" designation stands for "transistor outline". TO-220 packages have three leads. Similar packages with two, four, five or seven leads are also manufactured. A notable characteristic is a metal tab with a hole, used to mount the case to a heatsink, allowing the component to dissipate more heat than one constructed in a TO-92 case. Common TO-220-packaged components include discrete semiconductors such as transistors and silicon-controlled rectifiers, as well as integrated circuits. Typical applications The TO-220 package is a "power package" intended for power semiconductors and an example of a through-hole design rather than a surface-mount technology type of package. TO-220 packages can be mounted to a heat sink to dissipate several watts of waste heat. On a so-called "infinite heat sink", this can be 50 W or more. The top of the package has a metal tab ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Semiconductor Package
A semiconductor package is a metal, plastic, glass, or ceramic casing containing one or more discrete semiconductor devices or integrated circuits. Individual components are fabricated on semiconductor wafers (commonly silicon) before being diced into die, tested, and packaged. The package provides a means for connecting it to the external environment, such as printed circuit board, via leads such as lands, balls, or pins; and protection against threats such as mechanical impact, chemical contamination, and light exposure. Additionally, it helps dissipate heat produced by the device, with or without the aid of a heat spreader. There are thousands of package types in use. Some are defined by international, national, or industry standards, while others are particular to an individual manufacturer. Package functions A semiconductor package may have as few as two leads or contacts for devices such as diodes, or in the case of advanced microprocessors, a package may have several th ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Surface Mount
Surface-mount technology (SMT), originally called planar mounting, is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). An electrical component mounted in this manner is referred to as a surface-mount device (SMD). In industry, this approach has largely replaced through-hole technology construction method of fitting components, in large part because SMT allows for increased manufacturing automation which reduces cost and improves quality. It also allows for more components to fit on a given area of substrate. Both technologies can be used on the same board, with the through-hole technology often used for components not suitable for surface mounting such as large transformers and heat-sinked power semiconductors. An SMT component is usually smaller than its through-hole counterpart because it has either smaller leads or no leads at all. It may have short pins or leads of various styles, flat contacts, a matrix of ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Circuit Board
A printed circuit board (PCB), also called printed wiring board (PWB), is a laminated sandwich structure of conductive and insulating layers, each with a pattern of traces, planes and other features (similar to wires on a flat surface) etched from one or more sheet layers of copper laminated onto or between sheet layers of a non-conductive substrate. PCBs are used to connect or "wire" components to one another in an electronic circuit. Electrical components may be fixed to conductive pads on the outer layers, generally by soldering, which both electrically connects and mechanically fastens the components to the board. Another manufacturing process adds vias, metal-lined drilled holes that enable electrical interconnections between conductive layers, to boards with more than a single side. Printed circuit boards are used in nearly all electronic products today. Alternatives to PCBs include wire wrap and point-to-point construction, both once popular but now rarely ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Motorola
Motorola, Inc. () was an American multinational telecommunications company based in Schaumburg, Illinois. It was founded by brothers Paul and Joseph Galvin in 1928 and had been named Motorola since 1947. Many of Motorola's products had been radio-related communication equipment such as two-way radios, consumer walkie-talkies, cellular infrastructure, mobile phones, satellite communicators, pagers, as well as cable modems and semiconductors. After having lost $4.3 billion from 2007 to 2009, Motorola was split into two independent public companies: Motorola Solutions (its legal successor) and Motorola Mobility (spun off), on January 4, 2011. Motorola designed and sold wireless network equipment such as cellular transmission base stations and signal amplifiers. Its business and government customers consisted mainly of wireless voice and broadband systems (used to build private networks), and public safety communications systems like Astro and Dimetra. Motorola's h ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Power Dissipation
In thermodynamics, dissipation is the result of an irreversible process that affects a thermodynamic system. In a dissipative process, energy ( internal, bulk flow kinetic, or system potential) transforms from an initial form to a final form, where the capacity of the final form to do thermodynamic work is less than that of the initial form. For example, transfer of energy as heat is dissipative because it is a transfer of energy other than by thermodynamic work or by transfer of matter, and spreads previously concentrated energy. Following the second law of thermodynamics, in conduction and radiation from one body to another, the entropy varies with temperature (reduces the capacity of the combination of the two bodies to do work), but never decreases in an isolated system. In mechanical engineering, dissipation is the irreversible conversion of mechanical energy into thermal energy with an associated increase in entropy. Processes with defined local temperature produc ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Printed Circuit Board
A printed circuit board (PCB), also called printed wiring board (PWB), is a Lamination, laminated sandwich structure of electrical conduction, conductive and Insulator (electricity), insulating layers, each with a pattern of traces, planes and other features (similar to wires on a flat surface) Chemical milling, etched from one or more sheet layers of copper laminated onto or between sheet layers of a non-conductive substrate. PCBs are used to connect or Electrical wiring, "wire" Electronic component, components to one another in an electronic circuit. Electrical components may be fixed to conductive pads on the outer layers, generally by soldering, which both electrically connects and mechanically fastens the components to the board. Another manufacturing process adds Via (electronics), vias, metal-lined drilled holes that enable electrical interconnections between conductive layers, to boards with more than a single side. Printed circuit boards are used in nearly all e ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
MOSFETs
upright=1.3, Two power MOSFETs in amperes">A in the ''on'' state, dissipating up to about 100 watt">W and controlling a load of over 2000 W. A matchstick is pictured for scale. In electronics, the metal–oxide–semiconductor field-effect transistor (MOSFET, MOS-FET, MOS FET, or MOS transistor) is a type of field-effect transistor (FET), most commonly fabricated by the controlled oxidation of silicon. It has an insulated gate, the voltage of which determines the conductivity of the device. This ability to change conductivity with the amount of applied voltage can be used for amplifying or switching electronic signals. The term ''metal–insulator–semiconductor field-effect transistor'' (''MISFET'') is almost synonymous with ''MOSFET''. Another near-synonym is ''insulated-gate field-effect transistor'' (''IGFET''). The main advantage of a MOSFET is that it requires almost no input current to control the load current under steady-state or low-frequency conditions, e ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Surface-mount Technology
Surface-mount technology (SMT), originally called planar mounting, is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). An electrical component mounted in this manner is referred to as a surface-mount device (SMD). In industry, this approach has largely replaced through-hole technology construction method of fitting components, in large part because SMT allows for increased manufacturing automation which reduces cost and improves quality. It also allows for more components to fit on a given area of substrate. Both technologies can be used on the same board, with the through-hole technology often used for components not suitable for surface mounting such as large transformers and heat-sinked power semiconductors. An SMT component is usually smaller than its through-hole counterpart because it has either smaller leads or no leads at all. It may have short pins or leads of various styles, flat contacts, a matrix of ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Texas Instruments
Texas Instruments Incorporated (TI) is an American multinational semiconductor company headquartered in Dallas, Texas. It is one of the top 10 semiconductor companies worldwide based on sales volume. The company's focus is on developing analog chips and embedded processors, which account for more than 80% of its revenue. TI also produces digital light processing (DLP) technology and education technology products including calculators, microcontrollers, and multi-core processors. Texas Instruments emerged in 1951 after a reorganization of Geophysical Service Incorporated, a company founded in 1930 that manufactured equipment for use in the seismic industry, as well as defense electronics. TI produced the world's first commercial silicon transistor in 1954, and the same year designed and manufactured the first transistor radio. Jack Kilby invented the integrated circuit in 1958 while working at TI's Central Research Labs. TI also invented the hand-held calculator in 1967, and intr ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
