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Socket STRX4
Socket sTRX4, also known as Socket SP3r3, is a land grid array (LGA) CPU socket designed by AMD supporting its Zen 2-based Castle Peak Ryzen Threadripper desktop processors, launched on November 25, 2019 for the high-end desktop and workstation platforms Socket sTRX4 is the direct successor to Socket TR4 used in the first- and second-generation Ryzen Threadripper products. It is physically identical to, but electrically incompatible with, both TR4 and AMD's server Socket SP3. While Socket SP3 doesn't require a chipset, instead utilizing a system-on-a-chip A system on a chip or system-on-chip (SoC ; pl. ''SoCs'' ) is an integrated circuit that integrates most or all components of a computer or other electronic system. These components almost always include a central processing unit (CPU), memor ... design, Socket sTRX4 and its predecessor require a chipset to provide improved connectivity and functionality. For Socket sTRX4, the TRX40 chipset was developed, which pr ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Land Grid Array
The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket (when a socket is used) rather than the integrated circuit. An LGA can be electrically connected to a printed circuit board (PCB) either by the use of a socket or by soldering directly to the board. Description The ''land grid array'' is a packaging technology with a grid of contacts, 'lands', on the underside of a package. The contacts are to be connected to a grid of contacts on the PCB. Not all rows and columns of the grid need to be used. The contacts can either be made by using an LGA socket, or by using solder paste. The grid elements found in use can be e.g. circular, triangular or other polygonal shapes and might have even different sizes. Grids might sometimes appear like honey comb patterns. Designs are often optimized for factors like contact likeliness despite tolerances, electrical gap to neighboring contacts and for allowing ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Zero Insertion Force
Zero insertion force (ZIF) is a type of IC socket or electrical connector that requires very little (but not literally zero) force for insertion. With a ZIF socket, before the IC is inserted, a lever or slider on the side of the socket is moved, pushing all the sprung contacts apart so that the IC can be inserted with very little force - generally the weight of the IC itself is sufficient and no external downward force is required. The lever is then moved back, allowing the contacts to close and grip the pins of the IC. ZIF sockets are much more expensive than standard IC sockets and also tend to take up a larger board area due to the space taken up by the lever mechanism. Typically, they are only used when there is a good reason to do so. Design A normal integrated circuit (IC) socket requires the IC to be pushed into sprung contacts which then grip by friction. For an IC with hundreds of pins, the total insertion force can be very large (hundreds of newtons), leading to ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Flip-chip
Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, is a method for interconnecting dies such as semiconductor devices, IC chips, integrated passive devices and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads. The technique was developed by General Electric's Light Military Electronics Department, Utica, New York. The solder bumps are deposited on the chip pads on the top side of the wafer during the final wafer processing step. In order to mount the chip to external circuitry (e.g., a circuit board or another chip or wafer), it is flipped over so that its top side faces down, and aligned so that its pads align with matching pads on the external circuit, and then the solder is reflowed to complete the interconnect. This is in contrast to wire bonding, in which the chip is mounted upright and fine wires are welded onto the chip pads and lead frame contacts to interconne ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
PCI Express
PCI Express (Peripheral Component Interconnect Express), officially abbreviated as PCIe or PCI-e, is a high-speed serial computer expansion bus standard, designed to replace the older PCI, PCI-X and AGP bus standards. It is the common motherboard interface for personal computers' graphics cards, hard disk drive host adapters, SSDs, Wi-Fi and Ethernet hardware connections. PCIe has numerous improvements over the older standards, including higher maximum system bus throughput, lower I/O pin count and smaller physical footprint, better performance scaling for bus devices, a more detailed error detection and reporting mechanism (Advanced Error Reporting, AER), and native hot-swap functionality. More recent revisions of the PCIe standard provide hardware support for I/O virtualization. The PCI Express electrical interface is measured by the number of simultaneous lanes. (A lane is a single send/receive line of data. The analogy is a highway with traffic in both direc ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Infinity Fabric
HyperTransport (HT), formerly known as Lightning Data Transport, is a technology for interconnection of computer processors. It is a bidirectional serial/ parallel high- bandwidth, low- latency point-to-point link that was introduced on April 2, 2001. The HyperTransport Consortium is in charge of promoting and developing HyperTransport technology. HyperTransport is best known as the system bus architecture of AMD central processing units (CPUs) from Athlon 64 through AMD FX and the associated motherboard chipsets. HyperTransport has also been used by IBM and Apple for the Power Mac G5 machines, as well as a number of modern MIPS systems. The current specification HTX 3.1 remained competitive for 2014 high-speed (2666 and 3200 MT/s or about 10.4 GB/s and 12.8 GB/s) DDR4 RAM and slower (around 1 GB/similar to high end Solid-state drive#Standard card form factors, PCIe SSDs ULLtraDIMM flash RAM) technology—a wider range of RAM speeds on a common ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Ryzen
Ryzen ( ) is a brand of multi-core x86-64 microprocessors designed and marketed by AMD for desktop, mobile, server, and embedded platforms based on the Zen microarchitecture. It consists of central processing units (CPUs) marketed for mainstream, enthusiast, server, and workstation segments and accelerated processing units (APUs) marketed for mainstream and entry-level segments and embedded systems applications. AMD announced a new series of processors on December 13, 2016, named "Ryzen", and delivered them in Q1 2017, the first of several generations. The 1000 series featured up to eight cores and 16 threads, with a 52% instructions per cycle (IPC) increase over their prior CPU products. The second generation of Ryzen processors, the Ryzen 2000 series, released in April 2018, featured the Zen+ microarchitecture, a 12 nm process (GlobalFoundries); the aggregate performance increased 10% (of which approximately 3% was IPC, 6% was frequency); most importantly, Zen+ fixed ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Matisse (Ryzen) And Castle Peak (Ryzen Threadripper)
Henri Émile Benoît Matisse (; 31 December 1869 – 3 November 1954) was a French visual artist, known for both his use of colour and his fluid and original draughtsmanship. He was a draughtsman, printmaker, and sculptor, but is known primarily as a painter. Matisse is commonly regarded, along with Pablo Picasso, as one of the artists who best helped to define the revolutionary developments in the visual arts throughout the opening decades of the twentieth century, responsible for significant developments in painting and sculpture. The intense colourism of the works he painted between 1900 and 1905 brought him notoriety as one of the Fauves (French for "wild beasts"). Many of his finest works were created in the decade or so after 1906, when he developed a rigorous style that emphasised flattened forms and decorative pattern. In 1917, he relocated to a suburb of Nice on the French Riviera, and the more relaxed style of his work during the 1920s gained him critical acclaim as ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Socket TR4
Socket TR4, also known as ''Socket SP3r2'', is a zero insertion force land grid array (LGA) CPU socket designed by AMD supporting its first- and second-generation Zen-based Ryzen Threadripper desktop processors, launched on August 10, 2017 for the high-end desktop and workstation platforms. It was succeeded by Socket sTRX4 for the third generation of Ryzen Threadripper processors. Socket TR4 is AMD's second LGA socket for a consumer product after the short lived Socket 1207 FX. It is physically identical to, but electrically incompatible with both AMD's server Socket SP3, and Socket TR4's successor socket, Socket sTRX4. While Socket SP3 does not require a chipset, instead utilising a system-on-a-chip design, Socket TR4 and its successor require a chipset to provide improved functionality. For Socket TR4, the AMD X399 chipset was developed, which supports a total of 64 PCIe 4.0 lanes for quad SLI/CrossFire configurations. The socket is made by both Foxconn and Lotes. S ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Socket SP3
Socket SP3 is a zero insertion force land grid array CPU socket designed by AMD supporting its Zen-, Zen 2- and Zen 3-based Epyc server processors, launched on June 20, 2017. Because the socket is the same size as Socket TR4, and Socket sTRX4, users can use CPU coolers designed for not only those sockets, but CPU coolers designed for sTR4 and sTRX4. Socket SP3 is a system in a package socket - that means most features required to make the system fully functional (such as memory, PCI Express, SATA controllers etc.) are fully integrated into the processor, eliminating the need for a chipset to be placed on a motherboard. Variants for desktop platforms (as said below) are, eventually, requiring additional chipset to provide improved functionality of the system. A processor using socket SP3 is mounted by inserting the CPU into a slide and fixing the slide assembly by tightening three screws using the torque wrenches normally provided alongside the motherboard. Automated processor ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
DDR4 SDRAM
Double Data Rate 4 Synchronous Dynamic Random-Access Memory (DDR4 SDRAM) is a type of synchronous dynamic random-access memory with a high bandwidth (" double data rate") interface. Released to the market in 2014, it is a variant of dynamic random-access memory (DRAM), of which some have been in use since the early 1970s, and a higher-speed successor to the DDR2 and DDR3 technologies. DDR4 is not compatible with any earlier type of random-access memory (RAM) due to different signaling voltage and physical interface, besides other factors. DDR4 SDRAM was released to the public market in Q2 2014, focusing on ECC memory, while the non-ECC DDR4 modules became available in Q3 2014, accompanying the launch of Haswell-E processors that require DDR4 memory. Features The primary advantages of DDR4 over its predecessor, DDR3, include higher module density and lower voltage requirements, coupled with higher data rate transfer speeds. The DDR4 standard allows for DIMMs o ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
CPU Socket
In computer hardware, a CPU socket or CPU slot contains one or more mechanical components providing mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows for placing and replacing the central processing unit (CPU) without soldering. Common sockets have retention clips that apply a constant force, which must be overcome when a device is inserted. For chips with many pins, zero insertion force (ZIF) sockets are preferred. Common sockets include Pin Grid Array (PGA) or Land Grid Array (LGA). These designs apply a compression force once either a handle (PGA type) or a surface plate (LGA type) is put into place. This provides superior mechanical retention while avoiding the risk of bending pins when inserting the chip into the socket. Certain devices use Ball Grid Array (BGA) sockets, although these require soldering and are generally not considered user replaceable. CPU sockets are used on the motherboard in desktop and ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Zen 2
Zen 2 is a computer processor microarchitecture by AMD. It is the successor of AMD's Zen and Zen+ microarchitectures, and is fabricated on the 7 nanometer MOSFET node from TSMC. The microarchitecture powers the third generation of Ryzen processors, known as Ryzen 3000 for the mainstream desktop chips (codename "Matisse"), Ryzen 4000U/H (codename "Renoir") and Ryzen 5000U (codename "Lucienne") for mobile applications, as Threadripper 3000 for high-end desktop systems, and as Ryzen 4000G for accelerated processing units (APUs). The Ryzen 3000 series CPUs were released on 7 July 2019, while the Zen 2-based Epyc server CPUs (codename "Rome") were released on 7 August 2019. An additional chip, the Ryzen 9 3950X, was released in November 2019. At CES 2019, AMD showed a Ryzen third-generation engineering sample that contained one chiplet with eight cores and 16 threads. AMD CEO Lisa Su also said to expect more than eight cores in the final lineup. At Computex 2019, AMD revealed ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
