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Slot 1
Slot 1 refers to the physical and electrical specification for the connector used by some of Intel's microprocessors, including the Pentium Pro, Celeron, Pentium II and the Pentium III. Both single and dual processor configurations were implemented. Intel reverted to the traditional socket interface with the release of Socket 370 in 1999. General With the introduction of the Pentium II CPU, the need for greater access for testing had made the transition from socket to slot necessary. Previously with the Pentium Pro, Intel had combined processor and cache dies in the same Socket 8 package. These were connected by a full-speed bus, resulting in significant performance benefits. Unfortunately, this method required that the two components be bonded together early in the production process, before testing was possible. As a result, a single, tiny flaw in either die made it necessary to discard the entire assembly, causing low production yield and high cost. Intel subseq ...
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Asus P3C2000 - Slot 1-8626
ASUSTeK Computer Inc. (, , , ; stylized as ASUSTeK or ASUS) is a Taiwanese Multinational corporation, multinational computer, phone hardware and electronics manufacturer headquartered in Beitou District, Taipei, Taiwan. Its products include desktop computers, laptops, netbooks, mobile phones, networking equipment, monitors, wireless router, Wi-Fi routers, projectors, motherboards, graphics cards, optical storage, multimedia products, peripherals, wearables, server (computing), servers, workstations and tablet PCs. The company is also an original equipment manufacturer (OEM). Asus is the Market share of personal computer vendors, world's fifth-largest personal computer vendor by unit sales. Asus has a primary listing on the Taiwan Stock Exchange under the ticker code ''2357'' and formerly had a secondary listing on the London Stock Exchange under the ticker code ''ASKD''. Name The company is usually referred to as ''ASUS'' or ''Huáshuò'' in Chinese language, Chinese ( zh , t = ...
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Edge Connector
An edge connector is the portion of a printed circuit board (PCB) consisting of signal trace, traces leading to the edge of the board that are intended to plug into a matching jack (connector), socket. The edge connector is a money-saving device because it only requires a single discrete female connector (the male connector is formed out of the edge of the PCB), and they also tend to be fairly robust and durable. They are commonly used in computers for expansion slots for peripheral cards, such as Peripheral Component Interconnect, PCI, PCI Express, and Accelerated Graphics Port, AGP cards. Socket design Edge connector sockets consist of a plastic "box" open on one side, with pins on one or both sides of the longer edges, sprung to push into the middle of the open center. Connectors are often Key (engineering), keyed to ensure the correct Electrical polarity, polarity, and may contain bumps or notches both for polarity and to ensure that the wrong type of device is not inserte ...
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Pentium MMX
The Pentium (also referred to as the i586 or P5 Pentium) is a microprocessor introduced by Intel on March 22, 1993. It is the first CPU using the Pentium brand. Considered the fifth generation in the x86 (8086) compatible line of processors, succeeding the i486, its implementation and microarchitecture was internally called ''P5''. Like the Intel i486, the Pentium is instruction set compatible with the 32-bit i386. It uses a very similar microarchitecture to the i486, but was extended enough to implement a dual integer pipeline design, as well as a more advanced floating-point unit (FPU) that was noted to be ten times faster than its predecessor. The Pentium was succeeded by the Pentium Pro in November 1995. In October 1996, the Pentium MMX was introduced, complementing the same basic microarchitecture of the original Pentium with the MMX instruction set, larger caches, and some other enhancements. Intel discontinued the P5 Pentium processors (sold as a cheaper product sinc ...
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P5 (microarchitecture)
The Pentium (also referred to as the i586 or P5 Pentium) is a microprocessor introduced by Intel on March 22, 1993. It is the first CPU using the Pentium, Pentium brand. Considered the fifth generation in the x86 (8086) compatible line of processors, succeeding the i486, its implementation and microarchitecture was internally called ''P5''. Like the Intel i486, the Pentium is instruction set compatible with the 32-bit i386. It uses a very similar microarchitecture to the i486, but was extended enough to implement a dual integer instruction pipelining, pipeline design, as well as a more advanced floating-point unit (FPU) that was noted to be ten times faster than its predecessor. The Pentium was succeeded by the Pentium Pro in November 1995. In October 1996, the Pentium MMX was introduced, complementing the same basic microarchitecture of the original Pentium with the MMX (instruction set), MMX instruction set, larger caches, and some other enhancements. Intel discontinued the ...
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Flip-chip Pin Grid Array
A pin grid array (PGA) is a type of integrated circuit packaging. In a PGA, the package is square or rectangular, and the pins are arranged in a regular array on the underside of the package. The pins are commonly spaced 2.54 mm (0.1") apart, and may or may not cover the entire underside of the package. PGAs are often mounted on printed circuit boards using the through hole method or inserted into a socket. PGAs allow for more pins per integrated circuit than older packages, such as dual in-line package (DIP). Chip mounting The chip can be mounted either on the top or the bottom (the pinned side). Connections can be made either by wire bonding or through flip chip mounting. Typically, PGA packages use wire bonding when the chip is mounted on the pinned side, and flip chip construction when the chip is on the top side. Some PGA packages contain multiple dies, for example Zen 2 and Zen 3 Ryzen CPUs for the AM4 socket. Flip chip A flip-chip pin grid array (FC-P ...
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Coppermine (microprocessor)
The Pentium III (marketed as Intel Pentium III Processor, informally PIII or P3) brand refers to Intel's 32-bit x86 desktop and mobile CPUs based on the sixth-generation P6 (microarchitecture), P6 microarchitecture introduced on February 28, 1999. The brand's initial processors were very similar to the earlier Pentium II-branded processors. The most notable differences were the addition of the Streaming SIMD Extensions (SSE) instruction set (to accelerate floating point and parallel calculations), and the introduction of a controversial serial number embedded in the chip during manufacturing. Even after the release of the Pentium 4 in late 2000, the Pentium III continued to be produced with new models introduced up until early 2003. They were then discontinued in April 2004 for desktop units and May 2007 for mobile units. Processor cores Similarly to the Pentium II it superseded, the Pentium III was also accompanied by the Celeron brand for lower-end versions, and the Xeon for ...
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P6 (microarchitecture)
The P6 microarchitecture is the sixth-generation Intel x86 microarchitecture, implemented by the Pentium Pro microprocessor that was introduced in November 1995. It is frequently referred to as i686. It was planned to be succeeded by the NetBurst microarchitecture used by the Pentium 4 in 2000, but was revived for the Pentium M line of microprocessors. The successor to the Pentium M variant of the P6 microarchitecture is the Intel Core (microarchitecture), Core microarchitecture which in turn is also derived from P6. P6 was used within Intel's mainstream offerings from the Pentium Pro to Pentium III, and was widely known for low power consumption, excellent integer performance, and relatively high instructions per cycle (IPC). Features The P6 core was the sixth generation Intel microprocessor in the x86 line. The first implementation of the P6 core was the Pentium Pro CPU in 1995, the immediate successor to the original Pentium design (P5). P6 processors dynamically translate ...
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Flip Chip
Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, is a method for interconnecting dies such as semiconductor devices, IC chips, integrated passive devices and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads. The technique was developed by General Electric's Light Military Electronics Department, Utica, New York. The solder bumps are deposited on the chip pads on the top side of the wafer during the final wafer processing step. In order to mount the chip to external circuitry (e.g., a circuit board or another chip or wafer), it is flipped over so that its top side faces down, and aligned so that its pads align with matching pads on the external circuit, and then the solder is reflowed to complete the interconnect. This is in contrast to wire bonding, in which the chip is mounted upright and fine wires are welded onto the chip pads and lead frame contacts to interconne ...
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Anodizing
Anodizing is an electrolytic passivation process used to increase the thickness of the natural oxide layer on the surface of metal parts. The process is called ''anodizing'' because the part to be treated forms the anode electrode of an electrolytic cell. Anodizing increases resistance to corrosion and wear, and provides better adhesion for paint primers and glues than bare metal does. Anodic films can also be used for several cosmetic effects, either with thick porous coatings that can absorb dyes or with thin transparent coatings that add reflected light wave interference effects. Anodizing is also used to prevent galling of threaded components and to make dielectric films for electrolytic capacitors. Anodic films are most commonly applied to protect aluminium alloys, although processes also exist for titanium, zinc, magnesium, niobium, zirconium, hafnium, and tantalum. Iron or carbon steel metal exfoliates when oxidized under neutral or alkaline micro-electrolytic condit ...
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Hologram
Holography is a technique that allows a wavefront to be recorded and later reconstructed. It is best known as a method of generating three-dimensional images, and has a wide range of other uses, including data storage, microscopy, and interferometry. In principle, it is possible to make a hologram for any type of wave. A hologram is a recording of an interference pattern that can reproduce a 3D light field using diffraction. In general usage, a hologram is a recording of any type of wavefront in the form of an interference pattern. It can be created by capturing light from a real scene, or it can be generated by a computer, in which case it is known as a computer-generated hologram, which can show virtual objects or scenes. Optical holography needs a laser light to record the light field. The reproduced light field can generate an image that has the depth and parallax of the original scene. A hologram is usually unintelligible when viewed under diffuse ambient light. When s ...
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Celeron 300A
Celeron is a series of IA-32 and x86-64 computer microprocessors targeted at low-cost personal computers, manufactured by Intel from 1998 until 2023. The first Celeron-branded CPU was introduced on April 15, 1998, and was based on the Pentium II. Celeron-branded processors released from 2009 to 2023 are compatible with IA-32 software. They typically offer less performance per clock speed compared to flagship Intel CPU lines, such as the Pentium or Core brands. They often have less cache or intentionally disabled advanced features, with variable impact on performance. While some Celeron designs have achieved strong performance for their segment, the majority of the Celeron line has exhibited noticeably degraded performance. This has been the primary justification for the higher cost of other Intel CPU brands versus the Celeron range. In September 2022, Intel announced that the Celeron brand, along with Pentium, were to be replaced with the new "Intel Processor" branding for low ...
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