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List Of Intel Xeon Processors (Rocket Lake-based)
" Rocket Lake-S" (14 nm) Xeon W-13xx (workstation, uniprocessor) * -E: embedded * -P: high performance (and power), with cTDP down to 95 W * -T: low power, with cTDP down to 25 W Xeon E-23xx (server, uniprocessor) * Xeon E-2x1x2x3: x1 represents the generation. x3 represents the number of cores. * No suffix letter: without integrated GPU * -G: with integrated GPU References * * {{refend Intel Xeon (Rocket Lake) ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Rocket Lake
Rocket Lake is Intel's codename for its 11th generation Core microprocessors. Released on March 30, 2021, it is based on the new Cypress Cove microarchitecture, a variant of Sunny Cove (used by Intel's Ice Lake mobile processors) backported to Intel's 14 nm process node. Rocket Lake cores contain significantly more transistors than Skylake-derived Comet Lake cores. Rocket Lake features the same LGA 1200 socket and 400-series chipset compatibility as Comet Lake, except H410 and B460 chipsets. It is accompanied by new 500-series chipsets as well. Rocket Lake has up to eight cores, down from 10 cores for Comet Lake. It features Intel Xe graphics, and PCIe 4.0 support. Only a single M.2 drive is supported in PCIe 4.0 mode, all the rest are wired via PCIe 3.0. Intel officially launched the Rocket Lake desktop family on March 16, 2021, with sales commencing on March 30. The 11th generation Core i3, as well as Rocket Lake-based Pentium Gold and Celeron CPUs were not inclu ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Configurable TDP
The thermal design power (TDP), sometimes called thermal design point, is the maximum amount of heat generated by a computer chip or component (often a CPU, GPU or system on a chip) that the cooling system in a computer is designed to dissipate under any workload. Some sources state that the peak power rating for a microprocessor is usually 1.5 times the TDP rating. Intel has introduced a new metric called ''scenario design power'' (SDP) for some Ivy Bridge Y-series processors. Calculation The ''average CPU power'' (ACP) is the power consumption of central processing units, especially server processors, under "average" daily usage as defined by Advanced Micro Devices (AMD) for use in its line of processors based on the K10 microarchitecture ( Opteron 8300 and 2300 series processors). Intel's thermal design power (TDP), used for Pentium and Core 2 processors, measures the energy consumption under high workload; it is numerically somewhat higher than the "average" ACP ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Intel Turbo Boost
Intel Turbo Boost is Intel's trade name for central processing units (CPUs) dynamic frequency scaling feature that automatically raises certain versions of its operating frequency when demanding tasks are running, thus enabling a higher resulting performance. The frequency is accelerated when the operating system requests the highest performance state of the processor. Processor performance states are defined by the Advanced Configuration and Power Interface (ACPI) specification, an open standard supported by all major operating systems; no additional software or drivers are required to support the technology. The design concept behind Turbo Boost is commonly referred to as "dynamic overclocking". When the workload on the processor calls for faster performance, the processor's clock will try to increase the operating frequency in regular increments as required to meet demand. The increased clock rate is limited by the processor's power, current, and thermal limits, the number ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
CPU Cache
A CPU cache is a hardware cache used by the central processing unit (CPU) of a computer to reduce the average cost (time or energy) to access data from the main memory. A cache is a smaller, faster memory, located closer to a processor core, which stores copies of the data from frequently used main memory locations. Most CPUs have a hierarchy of multiple cache levels (L1, L2, often L3, and rarely even L4), with different instruction-specific and data-specific caches at level 1. The cache memory is typically implemented with static random-access memory (SRAM), in modern CPUs by far the largest part of them by chip area, but SRAM is not always used for all levels (of I- or D-cache), or even any level, sometimes some latter or all levels are implemented with eDRAM. Other types of caches exist (that are not counted towards the "cache size" of the most important caches mentioned above), such as the translation lookaside buffer (TLB) which is part of the memory management unit ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Thermal Design Power
The thermal design power (TDP), sometimes called thermal design point, is the maximum amount of heat generated by a computer chip or component (often a CPU, GPU or system on a chip) that the cooling system in a computer is designed to dissipate under any workload. Some sources state that the peak power rating for a microprocessor is usually 1.5 times the TDP rating. Intel has introduced a new metric called ''scenario design power'' (SDP) for some Ivy Bridge Y-series processors. Calculation The ''average CPU power'' (ACP) is the power consumption of central processing units, especially server processors, under "average" daily usage as defined by Advanced Micro Devices (AMD) for use in its line of processors based on the K10 microarchitecture ( Opteron 8300 and 2300 series processors). Intel's thermal design power (TDP), used for Pentium and Core 2 processors, measures the energy consumption under high workload; it is numerically somewhat higher than the "average" AC ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
CPU Socket
In computer hardware, a CPU socket or CPU slot contains one or more mechanical components providing mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows for placing and replacing the central processing unit (CPU) without soldering. Common sockets have retention clips that apply a constant force, which must be overcome when a device is inserted. For chips with many pins, zero insertion force (ZIF) sockets are preferred. Common sockets include Pin Grid Array (PGA) or Land Grid Array (LGA). These designs apply a compression force once either a handle (PGA type) or a surface plate (LGA type) is put into place. This provides superior mechanical retention while avoiding the risk of bending pins when inserting the chip into the socket. Certain devices use Ball Grid Array (BGA) sockets, although these require soldering and are generally not considered user replaceable. CPU sockets are used on the motherboard in desktop and ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
United States Dollar
The United States dollar (symbol: $; code: USD; also abbreviated US$ or U.S. Dollar, to distinguish it from other dollar-denominated currencies; referred to as the dollar, U.S. dollar, American dollar, or colloquially buck) is the official currency of the United States and several other countries. The Coinage Act of 1792 introduced the U.S. dollar at par with the Spanish silver dollar, divided it into 100 cents, and authorized the minting of coins denominated in dollars and cents. U.S. banknotes are issued in the form of Federal Reserve Notes, popularly called greenbacks due to their predominantly green color. The monetary policy of the United States is conducted by the Federal Reserve System, which acts as the nation's central bank. The U.S. dollar was originally defined under a bimetallic standard of (0.7735 troy ounces) fine silver or, from 1837, fine gold, or $20.67 per troy ounce. The Gold Standard Act of 1900 linked the dollar solely to gold. From 1934, its ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
