LGA 7529
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LGA 7529
LGA 7529 is a zero insertion force flip-chip land grid array (LGA) socket designed by Intel which supports the Sierra Forest line of E-core Xeon processors, designed for heavily multithreaded cloud workloads, as well as the Granite Rapids line of P-core Xeon microprocessors, designed for mainstream usage. The socket is also expected to support the mainstream successor to Granite Rapids, Diamond Rapids. The first pictures of the Intel Birch Stream platform were posted on January 31, 2023, by Yuuki_Ans. They showcased a dual LGA 7529 socket engineering sample motherboard A motherboard, also called a mainboard, a system board, a logic board, and informally a mobo (see #Nomenclature, "Nomenclature" section), is the main printed circuit board (PCB) in general-purpose computers and other expandable systems. It ho .... The Birch Stream platform is expected to support 12 channels of DDR5 memory per socket, for a total of 24 channels of DDR5 memory on a dual socket system. Int ...
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Land Grid Array
The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket (when a socket is used) — as opposed to pins on the integrated circuit, known as a '' pin grid array'' (PGA). An LGA can be electrically connected to a printed circuit board (PCB) either by the use of a socket or by soldering directly to the board. Description The ''land grid array'' is a packaging technology with a grid of contacts, 'lands', on the underside of a package. The contacts are to be connected to a grid of contacts on the PCB. Not all rows and columns of the grid need to be used. The contacts can either be connected by using an LGA socket, or by surface-mount soldering using solder paste. The grid elements found in use can be e.g. circular, triangular or other polygonal shapes and might have even different sizes. Grids might sometimes appear like honey comb patterns. Designs are often optimized for factors like contact likelin ...
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Zero Insertion Force
Zero insertion force (ZIF) is a type of IC socket or electrical connector that requires very little (but not literally zero) force for insertion. With a ZIF socket, before the IC is inserted, a lever or slider on the side of the socket is moved, pushing all the sprung contacts apart so that the IC can be inserted with very little force - generally the weight of the IC itself is sufficient and no external downward force is required. The lever is then moved back, allowing the contacts to close and grip the pins of the IC. ZIF sockets are much more expensive than standard IC sockets and also tend to take up a larger board area due to the space taken up by the lever mechanism. Typically, they are only used when there is a good reason to do so. Design A normal integrated circuit (IC) socket requires the IC to be pushed into sprung contacts which then grip by friction. For an IC with hundreds of pins, the total insertion force can be very large (hundreds of newtons), leading ...
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Flip-chip
Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, is a method for interconnecting Die (integrated circuit), dies such as semiconductor devices, Integrated circuit, IC chips, integrated passive devices and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads. The technique was developed by General Electric's Light Military Electronics Department, Utica, New York. The solder bumps are deposited on the chip pads on the top side of the wafer during the final wafer (electronics), wafer processing step. In order to mount the chip to external circuitry (e.g., a circuit board or another chip or wafer), it is flipped over so that its top side faces down, and aligned so that its pads align with matching pads on the external circuit, and then the solder is Reflow soldering, reflowed to complete the interconnect. This is in contrast to wire bonding, in which the chip is mounted upright an ...
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Granite Rapids
Granite Rapids is the codename for 6th generation Xeon Scalable server processors designed by Intel, launched on 24 September 2024. Featuring up to 128 P-cores, Granite Rapids is designed for high performance computing applications. The platform equivalent Sierra Forest processors with up to 288 E-cores launched in June 2024 before Granite Rapids. Background On February 17, 2022, Intel announced that upcoming Xeon generations would be split into two tracks for those with P-cores exclusively and E-cores exclusively. These two tracks are intended to serve different market segments with P-core Xeon processors targeting high performance computing while E-core Xeon processors target cloud customers who prioritize greater core density, energy efficiency and performance in heavily multi-threaded workloads over strong single-threaded usage. On January 10, 2023, Intel released its 4th generation Xeon processors codenamed Sapphire Rapids. Sapphire Rapids was the first server processors ...
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Sierra Forest
Sierra Forest is the codename for sixth generation Xeon Scalable server processors designed by Intel, launched in June 2024. It is the first generation of Xeon processors to exclusively feature density-optimized E-cores. Sierra Forest processors are targeted towards cloud server customers with up to 288 Crestmont E-cores. Background On February 17, 2022, Intel announced that upcoming Xeon generations would be split into two tracks for those with P-cores exclusively and E-cores exclusively. These two tracks are intended to serve different market segments with P-core Xeon processors targeting high-performance computing while E-core Xeon processors target cloud customers who prioritize greater core density, energy efficiency and performance in heavily multi-threaded workloads over strong single-threaded usage. On March 29, 2023, Intel announced that Sierra Forest processors had powered on and displayed a processor running 144 E-cores, and announced a release timeline for H1 202 ...
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LGA 4677
LGA 4677 (Socket E) is a zero insertion force flip-chip land grid array (LGA) CPU socket designed by Intel, compatible with Sapphire Rapids server and workstation processors, which was released in January 2023. Features * Support for PCI Express 5.0 and Direct Media Interface 4.0 * Supports 8 channels of DDR5 RAM with error correction code support * Intel Smart Sound Technology that provides dedicated audio voice processing to support voice wake functions is currently available only on the W790 chipset. Chipsets See also * List of Intel microprocessors This generational list of Intel processors attempts to present all of Intel's processors from the 4-bit 4004 (1971) to the present high-end offerings. Concise technical data is given for each product. Latest 15th generation Core Deskto ... * List of Intel chipsets References Intel CPU sockets {{Compu-hardware-stub ...
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DDR5
Double Data Rate 5 Synchronous Dynamic Random-Access Memory (DDR5 SDRAM) is a type of synchronous dynamic random-access memory. Compared to its predecessor DDR4 SDRAM, DDR5 was planned to reduce power consumption, while doubling bandwidth. The standard, originally targeted for 2018, was released on July 14, 2020. A new feature called Decision Feedback Equalization (DFE) enables input/output (I/O) speed scalability for higher bandwidth and performance improvement. DDR5 has about the same latency as DDR4 and DDR3. DDR5 octuples the maximum DIMM capacity from 64 GB to 512 GB. DDR5 also has higher frequencies than DDR4, up to 9600 MT/s is currently possible, 8200 MT/s translates into around 66 GB/s of bandwidth. Using liquid nitrogen 13000 MT/s speeds were achieved. Rambus announced a working DDR5 dual in-line memory module (DIMM) in September 2017. On November 15, 2018, SK Hynix announced completion of its first DDR5 RAM chip; running at 5.2  GT/s at 1.1 V. ...
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Zero Insertion Force
Zero insertion force (ZIF) is a type of IC socket or electrical connector that requires very little (but not literally zero) force for insertion. With a ZIF socket, before the IC is inserted, a lever or slider on the side of the socket is moved, pushing all the sprung contacts apart so that the IC can be inserted with very little force - generally the weight of the IC itself is sufficient and no external downward force is required. The lever is then moved back, allowing the contacts to close and grip the pins of the IC. ZIF sockets are much more expensive than standard IC sockets and also tend to take up a larger board area due to the space taken up by the lever mechanism. Typically, they are only used when there is a good reason to do so. Design A normal integrated circuit (IC) socket requires the IC to be pushed into sprung contacts which then grip by friction. For an IC with hundreds of pins, the total insertion force can be very large (hundreds of newtons), leading ...
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Flip-chip
Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, is a method for interconnecting Die (integrated circuit), dies such as semiconductor devices, Integrated circuit, IC chips, integrated passive devices and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads. The technique was developed by General Electric's Light Military Electronics Department, Utica, New York. The solder bumps are deposited on the chip pads on the top side of the wafer during the final wafer (electronics), wafer processing step. In order to mount the chip to external circuitry (e.g., a circuit board or another chip or wafer), it is flipped over so that its top side faces down, and aligned so that its pads align with matching pads on the external circuit, and then the solder is Reflow soldering, reflowed to complete the interconnect. This is in contrast to wire bonding, in which the chip is mounted upright an ...
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Land Grid Array
The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket (when a socket is used) — as opposed to pins on the integrated circuit, known as a '' pin grid array'' (PGA). An LGA can be electrically connected to a printed circuit board (PCB) either by the use of a socket or by soldering directly to the board. Description The ''land grid array'' is a packaging technology with a grid of contacts, 'lands', on the underside of a package. The contacts are to be connected to a grid of contacts on the PCB. Not all rows and columns of the grid need to be used. The contacts can either be connected by using an LGA socket, or by surface-mount soldering using solder paste. The grid elements found in use can be e.g. circular, triangular or other polygonal shapes and might have even different sizes. Grids might sometimes appear like honey comb patterns. Designs are often optimized for factors like contact likelin ...
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Intel
Intel Corporation is an American multinational corporation and technology company headquartered in Santa Clara, California, and Delaware General Corporation Law, incorporated in Delaware. Intel designs, manufactures, and sells computer components such as central processing units (CPUs) and related products for business and consumer markets. It is one of the world's List of largest semiconductor chip manufacturers, largest semiconductor chip manufacturers by revenue, and ranked in the Fortune 500, ''Fortune'' 500 list of the List of largest companies in the United States by revenue, largest United States corporations by revenue for nearly a decade, from 2007 to 2016 Fiscal year, fiscal years, until it was removed from the ranking in 2018. In 2020, it was reinstated and ranked 45th, being the List of Fortune 500 computer software and information companies, 7th-largest technology company in the ranking. It was one of the first companies listed on Nasdaq. Intel supplies List of I ...
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Xeon
Xeon (; ) is a brand of x86 microprocessors designed, manufactured, and marketed by Intel, targeted at the non-consumer workstation, server, and embedded markets. It was introduced in June 1998. Xeon processors are based on the same architecture as regular desktop-grade CPUs, but have advanced features such as support for error correction code (ECC) memory, higher core counts, more PCI Express lanes, support for larger amounts of RAM, larger cache memory and extra provision for enterprise-grade reliability, availability and serviceability (RAS) features responsible for handling hardware exceptions through the Machine Check Architecture (MCA). They are often capable of safely continuing execution where a normal processor cannot due to these extra RAS features, depending on the type and severity of the machine-check exception (MCE). Some also support multi-socket systems with two, four, or eight sockets through use of the Ultra Path Interconnect (UPI) bus, which replaced ...
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