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JCET (company)
JCET Group Co., Ltd. is a public company headquartered in Jiangyin on China's eastern coast. It is the largest Outsourced Semiconductor Assembly and Test (OSAT) company in mainland China and the third-largest globally. JCET was formed in 1972, when Jiangyin converted a local factory to produce transistors. JCET went public on the Shanghai Stock Exchange in 2003 and continued to grow over time. JCET provides a range of semiconductor packaging, assembly, manufacturing, and testing products and services. History JCET was founded in 1972, when the Jiangyin converted a factory into a facility for manufacturing transistors. The company's first automated manufacturing processes came online in 1986. JCET went public on the Shanghai Stock Exchange in June 2003. Later that year, it introduced several new products and subsidiaries, including the subsidiary JiangYin Changdian Advanced Packaging Co., Ltd. (JCAP) (later renamed as JCET Advanced Packaging Co.). JCAP works with Chinese univer ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Jiangyin
Jiangyin (, Jiangyin dialect: ) is a county-level city on the southern bank of the Yangtze River, and is administered by Wuxi, Jiangsu province. Jiangyin is one of the most important transport hubs on the Yangtze River, it is also one of the most developed counties in China. With 1,595,138 inhabitants as of the 2010 census, the city is now part of Jiangyin-Zhangjiagang-Jingjiang built-up or metropolitan area with 3,526,260 inhabitants Etymology Jiangyin's name means "River Shade", from its location on the south or shady side of the Yangtze River. History Jiangyin was a township of Yanling (; later known as Piling, ) county initially. Since the township was located in the north of Ji Lake, it was given the name "Jiyang" (). In 281, it was promoted as a county of Piling commandery. In 558, the north-west part was taken away from then Lanling county (Wujin and its around areas) to create Jiangyin county. It was served as the seat of Jiangyin commandery, of which jurisdiction ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Shanghai Stock Exchange
The Shanghai Stock Exchange (SSE) is a stock exchange based in the city of Shanghai, China. It is one of the three stock exchanges operating independently in mainland China, the others being the Beijing Stock Exchange and the Shenzhen Stock Exchange. The Shanghai Stock Exchange is the world's List of stock exchanges, 3rd largest stock market by market capitalization at US$7.62 trillion . It is also Asia's biggest stock exchange. Unlike the Hong Kong Stock Exchange, the Shanghai Stock Exchange is still not entirely open to foreign investors and often affected by the decisions of the central government, due to Capital control, capital account controls exercised by the mainland China, Chinese mainland authorities. In 1891, Shanghai founded China's first exchange system. The current stock exchange was re-established on November 26, 1990, and was in operation on December 19 of the same year. It is a non-profit organization directly administered by the China Securities Regulatory Commis ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Initial Public Offering
An initial public offering (IPO) or stock launch is a public offering in which shares of a company are sold to institutional investors and usually also to retail (individual) investors. An IPO is typically underwritten by one or more investment banks, who also arrange for the shares to be listed on one or more stock exchanges. Through this process, colloquially known as ''floating'', or ''going public'', a privately held company is transformed into a public company. Initial public offerings can be used to raise new equity capital for companies, to monetize the investments of private shareholders such as company founders or private equity investors, and to enable easy trading of existing holdings or future capital raising by becoming publicly traded. After the IPO, shares are traded freely in the open market at what is known as the free float. Stock exchanges stipulate a minimum free float both in absolute terms (the total value as determined by the share price multiplied b ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Research And Development
Research and development (R&D or R+D), known in Europe as research and technological development (RTD), is the set of innovative activities undertaken by corporations or governments in developing new services or products, and improving existing ones. Research and development constitutes the first stage of development of a potential new service or the production process. R&D activities differ from institution to institution, with two primary models of an R&D department either staffed by engineers and tasked with directly developing new products, or staffed with industrial scientists and tasked with applied research in scientific or technological fields, which may facilitate future product development. R&D differs from the vast majority of corporate activities in that it is not intended to yield immediate profit, and generally carries greater risk and an uncertain return on investment. However R&D is crucial for acquiring larger shares of the market through the marketisation ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Wafer-level Packaging
Wafer-level packaging (WLP) is a process where packaging components are attached to an integrated circuit (IC) ''before'' the wafer – on which the IC is fabricated – is diced. In WSP, the top and bottom layers of the packaging and the solder bumps are attached to the integrated circuits while they are still in the wafer. This process differs from a conventional process, in which the wafer is sliced into individual circuits (dice) before the packaging components are attached. WLP is essentially a true chip-scale package (CSP) technology, since the resulting package is practically of the same size as the die. Wafer-level packaging allows integration of wafer fab, packaging, test, and burn-in at wafer level in order to streamline the manufacturing process undergone by a device from silicon start to customer shipment. There is no single industry-standard method of wafer-level packaging at present. A major application area of WLPs are smartphones due to the size constraints. Fo ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Integrated Circuits
An integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, usually silicon. Transistor count, Large numbers of tiny MOSFETs (metal–oxide–semiconductor field-effect transistors) integrate into a small chip. This results in circuits that are orders of magnitude smaller, faster, and less expensive than those constructed of discrete electronic components. The IC's mass production capability, reliability, and building-block approach to integrated circuit design has ensured the rapid adoption of standardized ICs in place of designs using discrete transistors. ICs are now used in virtually all electronic equipment and have revolutionized the world of electronics. Computers, mobile phones and other home appliances are now inextricable parts of the structure of modern societies, made possible by the small size and low cost of ICs such as mode ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Transistor
upright=1.4, gate (G), body (B), source (S) and drain (D) terminals. The gate is separated from the body by an insulating layer (pink). A transistor is a semiconductor device used to Electronic amplifier, amplify or electronic switch, switch electrical signals and electrical power, power. The transistor is one of the basic building blocks of modern electronics. It is composed of semiconductor material, usually with at least three terminals for connection to an electronic circuit. A voltage or current applied to one pair of the transistor's terminals controls the current through another pair of terminals. Because the controlled (output) power can be higher than the controlling (input) power, a transistor can amplify a signal. Some transistors are packaged individually, but many more are found embedded in integrated circuits. Austro-Hungarian physicist Julius Edgar Lilienfeld proposed the concept of a field-effect transistor in 1926, but it was not possible to actually co ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Semiconductor Industry
The semiconductor industry is the aggregate of companies engaged in the design and fabrication of semiconductors and semiconductor devices, such as transistors and integrated circuits. It formed around 1960, once the fabrication of semiconductor devices became a viable business. The industry's annual semiconductor sales revenue has since grown to over , as of 2018. The semiconductor industry is in turn the driving force behind the wider electronics industry, with annual power electronics sales of £135billion () as of 2011, annual consumer electronics sales expected to reach by 2020, tech industry sales expected to reach in 2019, and e-commerce with over in 2017. In 2019, 32.4% of the semiconductor market segment was for networks and communications devices. In 2021, the sales of semiconductors reached a record $555.9 billion, up 26.2 percent with sales in China reaching $192.5 billion, according to the Semiconductor Industry Association. A record 1.15 trillion sem ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Semiconductor Industry In China
The Chinese semiconductor industry, including IC design and manufacturing, forms a major part of mainland China's IT industry. China's semiconductor industry consists of a wide variety of companies, from integrated device manufacturers to pure-play foundries, fabless semiconductor companies and OSAT companies. Integrated device manufacturers (IDMs) design and manufacture integrated circuits. Pure-play foundries only manufacture devices for other companies, without designing them, while fabless semiconductor companies only design devices. Examples of Chinese IDMs are YMTC and CXMT, examples of Chinese pure-play foundries are SMIC, Hua Hong Semiconductor and Wingtech, examples of Chinese fabless companies are Zhaoxin, HiSilicon and UNISOC, and examples of Chinese OSAT companies are JCET, Huatian Technology and Tongfu Microelectronics. Overview China is currently the world’s largest semiconductor market in terms of consumption. In 2020, China represented 53.7% of worldw ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Integrated Circuit Packaging
In electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the block of semiconductor material is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a " package", supports the electrical contacts which connect the device to a circuit board. In the integrated circuit industry, the process is often referred to as packaging. Other names include semiconductor device assembly, assembly, encapsulation or sealing. The packaging stage is followed by testing of the integrated circuit. The term is sometimes confused with electronic packaging, which is the mounting and interconnecting of integrated circuits (and other components) onto printed-circuit boards. Design considerations Electrical The current-carrying traces that run out of the die, through the package, and into the printed circuit board (PCB) have very different electrical properties compared to on-chip sign ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Wafer-level Packaging
Wafer-level packaging (WLP) is a process where packaging components are attached to an integrated circuit (IC) ''before'' the wafer – on which the IC is fabricated – is diced. In WSP, the top and bottom layers of the packaging and the solder bumps are attached to the integrated circuits while they are still in the wafer. This process differs from a conventional process, in which the wafer is sliced into individual circuits (dice) before the packaging components are attached. WLP is essentially a true chip-scale package (CSP) technology, since the resulting package is practically of the same size as the die. Wafer-level packaging allows integration of wafer fab, packaging, test, and burn-in at wafer level in order to streamline the manufacturing process undergone by a device from silicon start to customer shipment. There is no single industry-standard method of wafer-level packaging at present. A major application area of WLPs are smartphones due to the size constraints. Fo ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
System In A Package
A system in a package (SiP) or system-in-package is a number of integrated circuits enclosed in one or more chip carrier packages that may be stacked using package on package. The SiP performs all or most of the functions of an electronic system, and is typically used inside a mobile phone, digital music player, etc. Dies containing integrated circuits may be stacked vertically on a substrate. They are internally connected by fine wires that are bonded to the package. Alternatively, with a flip chip technology, solder bumps are used to join stacked chips together. A SiP is like a system on a chip (SoC) but less tightly integrated and not on a single semiconductor die. SiP dies can be stacked vertically or tiled horizontally, unlike less dense multi-chip modules, which place dies horizontally on a carrier. SiP connects the dies with standard off-chip wire bonds or solder bumps, unlike slightly denser three-dimensional integrated circuits which connect stacked silicon dies wi ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
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