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Ion Beam
An ion beam is a beam of ions, a type of charged particle beam. Ion beams have many uses in electronics manufacturing (principally ion implantation) and other industries. There are many ion beam sources, some derived from the mercury vapor thrusters developed by NASA in the 1960s. The most widely used ion beams are of singly-charged ions. Units Ion current density is typically measured in mA/cm2, and ion energy in electronvolts (eV). The use of eV is convenient for converting between voltage and energy, especially when dealing with singly charged ion beams. Broad-beam ion sources Most commercial applications use two popular types of ion source, gridded and gridless, which differ in current and power characteristics and the ability to control ion trajectories. In both cases electrons are needed to generate an ion beam. The most common types of electron emitter are hot filament and hollow cathode. Gridded ion source In a gridded ion source, DC or RF discharge are u ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Ion Beam - GPN-2000-000383
An ion () is an atom or molecule with a net electrical charge. The charge of an electron is considered to be negative by convention and this charge is equal and opposite to the charge of a proton, which is considered to be positive by convention. The net charge of an ion is not zero because its total number of electrons is unequal to its total number of protons. A cation is a positively charged ion with fewer electrons than protons (e.g. K+ (potassium ion)) while an anion is a negatively charged ion with more electrons than protons (e.g. Cl− (chloride ion) and OH− (hydroxide ion)). Opposite electric charges are pulled towards one another by electrostatic force, so cations and anions attract each other and readily form ionic compounds. Ions consisting of only a single atom are termed ''monatomic ions'', ''atomic ions'' or ''simple ions'', while ions consisting of two or more atoms are termed polyatomic ions or ''molecular ions''. If only a + or − is present, it indicates ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Child's Law
Space charge is an interpretation of a collection of electric charges in which excess electric charge is treated as a continuum of charge distributed over a region of space (either a volume or an area) rather than distinct point-like charges. This model typically applies when charge carriers have been emitted from some region of a solid—the cloud of emitted carriers can form a space charge region if they are sufficiently spread out, or the charged atoms or molecules left behind in the solid can form a space charge region. Space charge effects are most pronounced in dielectric media (including vacuum); in highly conductive media, the charge tends to be rapidly neutralized or screened. The sign of the space charge can be either negative or positive. This situation is perhaps most familiar in the area near a metal object when it is heated to incandescence in a vacuum. This effect was first observed by Thomas Edison in light bulb filaments, where it is sometimes called the Edison e ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Photomask
A photomask (also simply called a mask) is an opaque plate with transparent areas that allow light to shine through in a defined pattern. Photomasks are commonly used in photolithography for the production of integrated circuits (ICs or "chips") to produce a pattern on a thin wafer of material (usually silicon). In semiconductor manufacturing, a mask is sometimes called a reticle. In photolithography, several masks are used in turn, each one reproducing a layer of the completed design, and together known as a mask set. A curvilinear photomask has patterns with curves, which is a departure from conventional photomasks which only have patterns that are completely vertical or horizontal, known as manhattan geometry. These photomasks require special equipment to manufacture. History For IC production in the 1960s and early 1970s, an opaque rubylith film laminated onto a transparent mylar sheet was used. The design of one layer was cut into the rubylith, initially by hand on an i ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Fabrication (semiconductor)
Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as microprocessors, microcontrollers, and memories (such as Random-access memory, RAM and flash memory). It is a multiple-step Photolithography, photolithographic and physico-chemical process (with steps such as thermal oxidation, thin-film deposition, ion-implantation, etching) during which electronic circuits are gradually created on a wafer (electronics), wafer, typically made of pure single-crystal semiconducting material. Silicon is almost always used, but various compound semiconductors are used for specialized applications. This article focuses on the manufacture of integrated circuits, however steps such as etching and photolithography can be used to manufacture other devices such as LCD and OLED displays. The fabrication process is performed in highly specialized semiconductor fabrication plants, also called foundries or "fabs", with the cen ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Reactive Ion Etching
Reactive-ion etching (RIE) is an etching technology used in microfabrication. RIE is a type of dry etching which has different characteristics than wet etching. RIE uses chemically reactive plasma to remove material deposited on wafers. The plasma is generated under low pressure (vacuum) by an electromagnetic field. High-energy ions from the plasma attack the wafer surface and react with it. Equipment A typical (parallel plate) RIE system consists of a cylindrical vacuum chamber, with a wafer platter situated in the bottom portion of the chamber. The wafer platter is electrically isolated from the rest of the chamber. Gas enters through small inlets in the top of the chamber, and exits to the vacuum pump system through the bottom. The types and amount of gas used vary depending upon the etch process; for instance, sulfur hexafluoride is commonly used for etching silicon. Gas pressure is typically maintained in a range between a few millitorr and a few hundred millitor ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Ablate
Ablation ( – removal) is the removal or destruction of something from an object by vaporization, chipping, erosive processes, or by other means. Examples of ablative materials are described below, including spacecraft material for ascent and atmospheric reentry, ice and snow in glaciology, biological tissues in medicine and passive fire protection materials. Artificial intelligence In artificial intelligence (AI), especially machine learning, ablation is the removal of a component of an AI system. The term is by analogy with biology: removal of components of an organism. Biology Biological ablation is the removal of a biological structure or functionality. Genetic ablation is another term for gene silencing, in which gene expression is abolished through the alteration or deletion of genetic sequence information. In cell ablation, individual cells in a population or culture are destroyed or removed. Both can be used as experimental tools, as in loss-of-function experiment ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Sandblasting
Sandblasting, sometimes known as abrasive blasting, is the operation of forcibly propelling a stream of abrasive material against a surface under high pressure to smooth a rough surface, roughen a smooth surface, shape a surface or remove surface contaminants. A pressurised fluid, typically compressed air, or a centrifugal wheel is used to propel the blasting material (often called the ''media''). The first abrasive blasting process was patented by Benjamin Chew Tilghman on 18 October 1870. There are several variants of the process, using various media; some are highly abrasive, whereas others are milder. The most abrasive are shot blasting (with metal shot) and sandblasting (with sand). Moderately abrasive variants include glass bead blasting (with glass beads) and plastic media blasting (PMB) with ground-up plastic stock or walnut shells and corncobs. Some of these substances can cause anaphylactic shock to individuals allergic to the media. A mild version is sodablas ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Ion Beam Analysis
Ion beam analysis (IBA) is an important family of modern analytical techniques involving the use of MeV ion beams to probe the composition and obtain elemental depth profiles in the near-surface layer of solids. IBA is not restricted to MeV energy ranges. It can be operated at low energy (GeV) using instruments like the LHC. All IBA methods are highly sensitive and allow the detection of elements in the sub-monolayer range. The depth resolution is typically in the range of a few nanometers to a few ten nanometers. Atomic depth resolution can be achieved, but requires special equipment. The analyzed depth ranges from a few ten nanometers to a few ten micrometers. IBA methods are always quantitative with an accuracy of a few percent. Channeling allows to determine the depth profile of damage in single crystals. *RBS: Rutherford backscattering is sensitive to heavy elements in a light matrix. This technique is used for determining elemental composition and depth profiling of materials ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Sputtering
In physics, sputtering is a phenomenon in which microscopic particles of a solid material are ejected from its surface, after the material is itself bombarded by energetic particles of a plasma or gas. It occurs naturally in outer space, and can be an unwelcome source of wear in precision components. However, the fact that it can be made to act on extremely fine layers of material is utilised in science and industry—there, it is used to perform precise etching, carry out analytical techniques, and deposit thin film layers in the manufacture of optical coatings, semiconductor devices and nanotechnology products. It is a physical vapor deposition technique. Physics When energetic ions collide with atoms of a target material, an exchange of momentum takes place between them. These ions, known as "incident ions", set off collision cascades in the target. Such cascades can take many paths; some recoil back toward the surface of the target. If a collision cascade reaches the su ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Nanofluidics Channels (33411553986)
Nanofluidics is the study of the behavior, manipulation, and control of fluids that are confined to structures of nanometer (typically 1–100 nm) characteristic dimensions (1 nm = 10−9 m). Fluids confined in these structures exhibit physical behaviors not observed in larger structures, such as those of micrometer dimensions and above, because the characteristic physical scaling lengths of the fluid, (''e.g.'' Debye length, hydrodynamic radius) very closely coincide with the dimensions of the nanostructure itself. When structures approach the size regime corresponding to molecular scaling lengths, new physical constraints are placed on the behavior of the fluid. For example, these physical constraints induce regions of the fluid to exhibit new properties not observed in bulk, ''e.g.'' vastly increased viscosity near the pore wall; they may effect changes in thermodynamic properties and may also alter the chemical reactivity of species at the fluid-solid interface. A ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
ZEISS Crossbeam 550- Your FIB-SEM For High Throughput 3D Analysis And Sample Preparation (33411552526)
Zeiss or Zeiß may refer to: People *Carl Zeiss (1816–1888), German optician and entrepreneur *Emil Zeiß (1833–1910), German Protestant minister and painter * Juan Pablo Zeiss (born 1989), Argentine rugby union player * Mary Zeiss Stange (1950–2024), American academic Companies *Carl Zeiss Foundation, holding company for several Zeiss companies *Carl Zeiss Meditec AG, a Zeiss subsidiary * Carl Zeiss SMT, a Zeiss subsidiary *Schott AG, a Zeiss subsidiary *Zeiss (company), German manufacturer of optics, industrial measurements and medical devices founded by Carl Zeiss Institutions and organizations *Carl-Zeiss-Gymnasium Jena, a school in Jena, Germany. *FC Carl Zeiss Jena, football club founded in 1903 by workers at Carl Zeiss optics company Technologies *Zeiss formula, a formula for depth of field calculations. *Zeiss projector, a line of planetarium projectors manufactured by one of the Zeiss companies *Zeiss Planar, a photographic lens patented by the Zeiss compan ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
