|
High Bandwidth Memory
High Bandwidth Memory (HBM) is a computer memory interface for 3D-stacked synchronous dynamic random-access memory (SDRAM) initially from Samsung, AMD and SK Hynix. It is used in conjunction with high-performance graphics accelerators, network devices, high-performance datacenter AI ASICs, as on-package cache in CPUs and on-package RAM in upcoming CPUs, and FPGAs and in some supercomputers (such as the NEC SX-Aurora TSUBASA and Fujitsu A64FX). The first HBM memory chip was produced by SK Hynix in 2013, and the first devices to use HBM were the AMD Fiji GPUs in 2015. HBM was adopted by JEDEC as an industry standard in October 2013.High Bandwidth Memory (HBM) DRAM (JESD235) JEDEC, October 2013 The second generation, HBM2, was accepted by JEDEC in January 2016. [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Computer Memory
Computer memory stores information, such as data and programs, for immediate use in the computer. The term ''memory'' is often synonymous with the terms ''RAM,'' ''main memory,'' or ''primary storage.'' Archaic synonyms for main memory include ''core'' (for magnetic core memory) and ''store''. Main memory operates at a high speed compared to mass storage which is slower but less expensive per bit and higher in capacity. Besides storing opened programs and data being actively processed, computer memory serves as a Page cache, mass storage cache and write buffer to improve both reading and writing performance. Operating systems borrow RAM capacity for caching so long as it is not needed by running software. If needed, contents of the computer memory can be transferred to storage; a common way of doing this is through a memory management technique called ''virtual memory''. Modern computer memory is implemented as semiconductor memory, where data is stored within memory cell (com ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Graphics Processing Unit
A graphics processing unit (GPU) is a specialized electronic circuit designed for digital image processing and to accelerate computer graphics, being present either as a discrete video card or embedded on motherboards, mobile phones, personal computers, workstations, and game consoles. GPUs were later found to be useful for non-graphic calculations involving embarrassingly parallel problems due to their parallel structure. The ability of GPUs to rapidly perform vast numbers of calculations has led to their adoption in diverse fields including artificial intelligence (AI) where they excel at handling data-intensive and computationally demanding tasks. Other non-graphical uses include the training of neural networks and cryptocurrency mining. History 1970s Arcade system boards have used specialized graphics circuits since the 1970s. In early video game hardware, RAM for frame buffers was expensive, so video chips composited data together as the display was being scann ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Virtual Reality
Virtual reality (VR) is a Simulation, simulated experience that employs 3D near-eye displays and pose tracking to give the user an immersive feel of a virtual world. Applications of virtual reality include entertainment (particularly video games), education (such as medical, safety, or military training) and business (such as virtual meetings). VR is one of the key technologies in the Reality–virtuality continuum, reality-virtuality continuum. As such, it is different from other digital visualization solutions, such as augmented virtuality and augmented reality. Currently, standard virtual reality systems use either virtual reality headsets or multi-projected environments to generate some realistic images, sounds, and other sensations that simulate a user's physical presence in a virtual environment. A person using virtual reality equipment is able to look around the artificial world, move around in it, and interact with virtual features or items. The effect is commonly creat ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
GT/s
In computer technology, transfers per second and its more common secondary terms gigatransfers per second (abbreviated as GT/s) and megatransfers per second (MT/s) are informal language that refer to the number of operations transferring data that occur in each second in some given data-transfer channel. It is also known as sample rate, i.e. the number of data samples captured per second, each sample normally occurring at the clock edge. The terms are neutral with respect to the method of physically accomplishing each such data-transfer operation; nevertheless, they are most commonly used in the context of transmission of digital data. is 106 or one million transfers per second; similarly, means 109, or equivalently in the US/short scale, one billion transfers per second. Units These terms alone do not specify the bit rate at which binary data is being transferred because they do not specify the number of bits transferred in each transfer operation (known as the channel width or ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Differential Signaling
Differential signalling is a method for electrically transmitting information using two complementary signals. The technique sends the same electrical signal as a differential pair of signals, each in its own conductor. The pair of conductors can be wires in a twisted-pair or ribbon cable or traces on a printed circuit board. Electrically, the two conductors carry voltage signals which are equal in magnitude, but of opposite polarity. The receiving circuit responds to the difference between the two signals, which results in a signal with a magnitude twice as large. The symmetrical signals of differential signalling may be referred to as ''balanced'', but this term is more appropriately applied to balanced circuits and balanced lines which reject common-mode interference when fed into a differential receiver. Differential signalling does not make a line balanced, nor does noise rejection in balanced circuits require differential signalling. Differential signalli ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
High Bandwidth Memory Schematic
High may refer to: Science and technology * Height * High (atmospheric), a high-pressure area * High (computability), a quality of a Turing degree, in computability theory * High (tectonics), in geology an area where relative tectonic uplift took or takes place * Substance intoxication, also known by the slang description "being high" * Sugar high, a misconception about the supposed psychological effects of sucrose Music Performers * High (musical group), a 1974–1990 Indian rock group * The High, an English rock band formed in 1989 Albums * High (The Blue Nile album), ''High'' (The Blue Nile album) or the title song, 2004 * High (Flotsam and Jetsam album), ''High'' (Flotsam and Jetsam album), 1997 * High (New Model Army album), ''High'' (New Model Army album) or the title song, 2007 * High (Royal Headache album), ''High'' (Royal Headache album) or the title song, 2015 * High (Keith Urban album), ''High'' (Keith Urban album), 2024 * High (EP), ''High'' (EP), by Jarryd James, o ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Radeon Rx 300 Series
The Radeon 300 series is a series of graphics processors developed by AMD. All of the GPUs of the series are produced in 28 nm format and use the Graphics Core Next (GCN) micro-architecture. The series includes the Fiji and Tonga GPU dies based on AMD's GCN 3 or "Volcanic Islands" architecture, which had originally been introduced with the Tonga based (though cut-down) R9 285 slightly earlier. Some of the cards in the series include the Fiji based flagship AMD Radeon R9 Fury X, cut-down Radeon R9 Fury and small form factor Radeon R9 Nano, which are the first GPUs to feature High Bandwidth Memory (HBM) technology, which AMD co-developed in partnership with SK Hynix. HBM is faster and more power efficient than GDDR5, GDDR5 memory, though also more expensive. However, the remaining GPUs in the series outside the Tonga based R9 380 and R9 380X are rebranding, based on previous generation GPUs with revised power management, and therefore only feature GDDR5 memory (something Tonga ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Printed Circuit Board
A printed circuit board (PCB), also called printed wiring board (PWB), is a Lamination, laminated sandwich structure of electrical conduction, conductive and Insulator (electricity), insulating layers, each with a pattern of traces, planes and other features (similar to wires on a flat surface) Chemical milling, etched from one or more sheet layers of copper laminated onto or between sheet layers of a non-conductive substrate. PCBs are used to connect or Electrical wiring, "wire" Electronic component, components to one another in an electronic circuit. Electrical components may be fixed to conductive pads on the outer layers, generally by soldering, which both electrically connects and mechanically fastens the components to the board. Another manufacturing process adds Via (electronics), vias, metal-lined drilled holes that enable electrical interconnections between conductive layers, to boards with more than a single side. Printed circuit boards are used in nearly all e ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Semiconductor Device Fabrication
Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as microprocessors, microcontrollers, and memories (such as Random-access memory, RAM and flash memory). It is a multiple-step Photolithography, photolithographic and physico-chemical process (with steps such as thermal oxidation, thin-film deposition, ion-implantation, etching) during which electronic circuits are gradually created on a wafer (electronics), wafer, typically made of pure single-crystal semiconducting material. Silicon is almost always used, but various compound semiconductors are used for specialized applications. This article focuses on the manufacture of integrated circuits, however steps such as etching and photolithography can be used to manufacture other devices such as LCD and OLED displays. The fabrication process is performed in highly specialized semiconductor fabrication plants, also called foundries or "fabs", with the cen ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Micron Technology
Micron Technology, Inc. is an American producer of computer memory and computer data storage including dynamic random-access memory, flash memory, and solid-state drives (SSDs). It is headquartered in Boise, Idaho. Micron's consumer products, including the Ballistix line of consumer and gaming memory modules, are marketed under the Crucial brand. Micron and Intel together created IM Flash Technologies, which produced NAND flash memory. It owned Lexar between 2006 and 2017. Micron is the only U.S.-based manufacturer of memory. History 1978–1999 Micron was founded in Boise, Idaho, in 1978 by Ward Parkinson, Joe Parkinson, Dennis Wilson, and Doug Pitman as a semiconductor design consulting company. Startup funding was provided by local Idaho businessmen Tom Nicholson, Allen Noble, Rudolph Nelson, and Ron Yanke. Later it received funding from Idaho billionaire J. R. Simplot, whose fortune was made in the potato business. In 1981, the company moved from consulting to manu ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Hybrid Memory Cube
Hybrid Memory Cube (HMC) is a high-performance computer random-access memory (RAM) interface for through-silicon via (TSV)-based stacked DRAM memory. HMC competes with the incompatible rival interface High Bandwidth Memory (HBM). Overview Hybrid Memory Cube was co-developed by Samsung Electronics and Micron Technology in 2011, and announced by Micron in September 2011.Micron Reinvents DRAM Memory Linley Group, Jag Bolaria, 12 September 2011 It promised a 15 times speed improvement over . The Hybrid Memory Cube Consortium (HMCC) is backed by several major technology companies including |
Microbump
In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules; in the latter case, they may be referred to as microbumps (μbumps, ubumps), since they are usually significantly smaller than the former. The solder balls can be placed manually or by automated equipment, and are held in place with a tacky flux. A coined solder ball is a solder ball subject to coining, i.e., flattening to a shape resembling that of a coin, to increase contact reliability. Ball grid array, chip-scale package, and flip chip packages generally use solder balls. Underfill After the solder balls are used to attach an integrated circuit chip to a printed circuit board (PCB), often the remaining air gap between them is underfilled with epoxy. In some cases, there may be multiple layers of sold ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
