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Glossary Of Microelectronics Manufacturing Terms
Glossary of microelectronics manufacturing terms ''This is a list of terms used in the manufacture of electronic micro-components. Many of the terms are already defined and explained in Wikipedia; this glossary is for looking up, comparing, and reviewing the terms. You can help enhance this page by adding new terms or clarifying definitions of existing ones.'' * 2.5D integration – an advanced integrated circuit packaging technology that bonds dies and/or chiplets onto an interposer for enclosure within a single package * 3D integration – an advanced semiconductor technology that incorporates multiple layers of circuitry into a single chip, integrated both vertically and horizontally * 3D-IC (also 3DIC or 3D IC) – Three-dimensional integrated circuit; an integrated circuit built with 3D integration * advanced packaging – the aggregation and interconnection of components before traditional packaging * ALD – see atomic layer deposition * atomic layer deposition (ALD) ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Microelectronics
Microelectronics is a subfield of electronics. As the name suggests, microelectronics relates to the study and manufacture (or microfabrication) of very small electronic designs and components. Usually, but not always, this means micrometre-scale or smaller. These devices are typically made from semiconductor materials. Many components of a normal electronic design are available in a microelectronic equivalent. These include transistors, capacitors, inductors, resistors, diodes and (naturally) insulators and conductors can all be found in microelectronic devices. Unique wiring techniques such as wire bonding are also often used in microelectronics because of the unusually small size of the components, leads and pads. This technique requires specialized equipment and is expensive. Digital integrated circuits (ICs) consist of billions of transistors, resistors, diodes, and capacitors. Analog circuits commonly contain resistors and capacitors as well. Inductors are u ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Chip Carrier
In electronics, a chip carrier is one of several kinds of surface-mount technology packages for integrated circuits (commonly called "chips"). Connections are made on all four edges of a square package; compared to the internal cavity for mounting the integrated circuit, the package overall size is large.Kenneth Jackson, Wolfgang Schroter, (ed), ''Handbook of Semiconductor Technology Volume 2'', Wiley VCH, 2000, , page 627 Types Chip carriers may have either J-shaped metal leads for connections by solder or by a socket, or may be lead-less with metal pads for connections. If the leads extend beyond the package, the preferred description is " flat pack". Chip carriers can be smaller than dual in-line packages and since they use all four edges of the package they can have a larger pin count. Chip carriers may be made of ceramic or plastic. Some forms of chip carrier package are standardized in dimensions and registered with trade industry associations such as JEDEC. Other forms a ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Software Tools
A programming tool or software development tool is a computer program that is used to software development, develop another computer program, usually by helping the developer manage computer files. For example, a programmer may use a tool called a source code editor to edit source code files, and then a compiler to convert the source code into machine code files. They may also use Build automation, build tools that automatically package executable program and data files into shareable package manager, packages or Installation (computer programs), install kits. A set of tools that are run one after another, with each tool feeding its output to the next one, is called a toolchain. An integrated development environment (IDE) integrates the function of several tools into a single program. Usually, an IDE provides a source code editor as well as other built-in or Plug-in (computing), plug-in tools that help with compiler, compiling, debugging, and software test, testing. Whether a pro ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Electronic Design Automation
Electronic design automation (EDA), also referred to as electronic computer-aided design (ECAD), is a category of software tools for designing Electronics, electronic systems such as integrated circuits and printed circuit boards. The tools work together in a Design flow (EDA), design flow that chip designers use to design and analyze entire semiconductor chips. Since a modern semiconductor chip can have billions of components, EDA tools are essential for their design; this article in particular describes EDA specifically with respect to integrated circuits (ICs). History Early days The earliest electronic design automation is attributed to IBM with the documentation of its IBM 700/7000 series, 700 series computers in the 1950s. Prior to the development of EDA, integrated circuits were designed by hand and manually laid out. Some advanced shops used geometric software to generate tapes for a Gerber format, Gerber photoplotter, responsible for generating a monochromatic ex ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Electron-beam Processing
Electron-beam processing or electron irradiation (EBI) is a process that involves using electrons, usually of high energy, to treat an object for a variety of purposes. This may take place under elevated temperatures and nitrogen atmosphere. Possible uses for electron irradiation include sterilization, alteration of gemstone colors, and cross-linking of polymers. Electron energies typically vary from the keV to MeV range, depending on the depth of penetration required. The irradiation dose is usually measured in grays but also in Mrads ( is equivalent to ). The basic components of a typical electron-beam processing device include: an electron gun (consisting of a cathode, grid, and anode), used to generate and accelerate the primary beam; and, a magnetic optical (focusing and deflection) system, used for controlling the way in which the electron beam impinges on the material being processed (the "workpiece"). In operation, the gun's hot cathode emits electrons that are both ac ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Semiconductor Material
A semiconductor is a material with electrical conductivity between that of a Electrical conductor, conductor and an Insulator (electricity), insulator. Its conductivity can be modified by adding impurities ("doping (semiconductor), doping") to its crystal structure. When two regions with different doping levels are present in the same crystal, they form a semiconductor junction. The behavior of charge carriers, which include electrons, ions, and electron holes, at these junctions is the basis of diodes, transistors, and most modern electronics. Some examples of semiconductors are silicon, germanium, gallium arsenide, and elements near the so-called "metalloid staircase" on the periodic table. After silicon, gallium arsenide is the second-most common semiconductor and is used in laser diodes, solar cells, microwave-frequency integrated circuits, and others. Silicon is a critical element for fabricating most electronic circuits. Semiconductor devices can display a range of diffe ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Doping (semiconductor)
In semiconductor production, doping is the intentional introduction of impurities into an intrinsic (undoped) semiconductor for the purpose of modulating its electrical, optical and structural properties. The doped material is referred to as an extrinsic semiconductor. Small numbers of dopant atoms can change the ability of a semiconductor to conduct electricity. When on the order of one dopant atom is added per 100 million intrinsic atoms, the doping is said to be ''low'' or ''light''. When many more dopant atoms are added, on the order of one per ten thousand atoms, the doping is referred to as ''high'' or ''heavy''. This is often shown as ''n+'' for n-type doping or ''p+'' for p-type doping. (''See the article on semiconductors for a more detailed description of the doping mechanism.'') A semiconductor doped to such high levels that it acts more like a conductor than a semiconductor is referred to as a degenerate semiconductor. A semiconductor can be considered i-typ ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Aspect Ratio
The aspect ratio of a geometry, geometric shape is the ratio of its sizes in different dimensions. For example, the aspect ratio of a rectangle is the ratio of its longer side to its shorter side—the ratio of width to height, when the rectangle is oriented as a "landscape format, landscape". The aspect ratio is most often expressed as two integer numbers separated by a colon (x:y), less commonly as a simple or decimal Fraction (mathematics), fraction. The values x and y do not represent actual widths and heights but, rather, the proportion between width and height. As an example, 8:5, 16:10, 1.6:1, and 1.6 are all ways of representing the same aspect ratio. In objects of more than two dimensions, such as hyperrectangles, the aspect ratio can still be defined as the ratio of the longest side to the shortest side. Applications and uses The term is most commonly used with reference to: * Graphic / image ** Aspect ratio (image), Image aspect ratio ** Display aspect ratio ** Pape ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Deep Reactive-ion Etching
Deep reactive-ion etching (DRIE) is a special subclass of reactive-ion etching (RIE). It enables highly anisotropy, anisotropic etching (microfab), etch process used to create deep penetration, steep-sided holes and trenches in wafer (semiconductor), wafers/substrates, typically with high aspect ratio (image), aspect ratios. It was developed for microelectromechanical systems (MEMS), which require these features, but is also used to excavate trenches for high-density capacitors for dynamic random access memory, DRAM and more recently for creating through-silicon vias (Through-silicon via, TSVs) in advanced 3D wafer level packaging technology. In DRIE, the substrate is placed inside a reactor, and several gases are introduced. A plasma is struck in the gas mixture which breaks the gas molecules into ions. The ions are accelerated towards, and react with the surface of the material being etched, forming another gaseous element. This is known as the chemical part of the reactive ion ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Thermoelectric Materials
Thermoelectric materials show the thermoelectric effect in a strong or convenient form. The ''thermoelectric effect'' refers to phenomena by which either a temperature difference creates an electric potential or an electric current creates a temperature difference. These phenomena are known more specifically as the Seebeck effect (creating a voltage from temperature difference), Peltier effect (driving heat flow with an electric current), and Thomson effect (reversible heating or cooling within a conductor when there is both an electric current and a temperature gradient). While all materials have a nonzero thermoelectric effect, in most materials it is too small to be useful. However, low-cost materials that have a sufficiently strong thermoelectric effect (and other required properties) are also considered for applications including power generation and refrigeration. The most commonly used thermoelectric material is based on bismuth telluride (). Thermoelectric materials are ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Thermal Copper Pillar Bump
A thermal copper pillar bump, also known as a "thermal bump", is a thermoelectric device made from thin-film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and optoelectronic packaging, including: flip chip packaging of CPU and GPU integrated circuits (chips), laser diodes, and semiconductor optical amplifiers (SOA). Unlike conventional solder bumps that provide an electrical path and a mechanical connection to the package, thermal bumps act as solid-state heat pumps and add thermal management functionality locally on the surface of a chip or to another electrical component. The diameter of a thermal bump is 238 μm and 60 μm high. Thermal bumps use the thermoelectric effect, which is the direct conversion of temperature differences to electric voltage and vice versa. Simply put, a thermoelectric device creates a voltage when there is a different temperature on each side, or when a voltage is applied ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Particulates
Particulate matter (PM) or particulates are microscopic particles of solid or liquid matter suspension (chemistry), suspended in the atmosphere of Earth, air. An ''aerosol'' is a mixture of particulates and air, as opposed to the particulate matter alone, though it is sometimes defined as a subset of aerosol terminology. Sources of particulate matter can be natural or anthropogenic hazard, anthropogenic. Particulates have impacts on climate and precipitation that adversely affect human health. Types of atmosphere, atmospheric particles include suspended particulate matter; thoracic and respirable particles; inhalable coarse particles, designated PM, which are granularity, coarse particles with a particle size, diameter of 10 micrometre, micrometers (μm) or less; fine particles, designated PM, with a diameter of 2.5 μm or less; ultrafine particles, with a diameter of 100 nm or less; and soot. Airborne particulate matter is a List of IARC Group 1 carcinogens, Group ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
