|
CoreExpress
CoreExpress modules are complete computer-on-module (COM) highly integrated, compact computers that can be used in an embedded computer board design, much like an integrated circuit component. COMs integrate CPU, memory, graphics, and BIOS, and common I/O interfaces. The interfaces are modern, using only digital buses such as PCI Express, Serial ATA, Ethernet, USB, and HD audio ( Intel High Definition Audio). All signals are accessible on a high-density, high-speed, 220-pin connector. Although most implementations use Intel processors, the specification is open for different CPU modules. CoreExpress modules are mounted on a custom carrier board, containing the peripherals required for the specific application. In this way, small but highly specialized computer systems can be built. The CoreExpress form factor was originally developed by LiPPERT Embedded Computers and standardized by the Small Form Factor Special Interest Group (SFF-SIG) in March 2010. It was competing with othe ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Small Form Factor Special Interest Group
The Small Form Factor Special Interest Group (SFF-SIG, pronounced ''ess-eff-eff-sig'') is an international non-profit standards body focused on modular computer hardware technologies used in embedded and small form factor computers and controllers. Members are mainly computer board and component manufacturers. The group was founded in 2007 and had a web site until early 2020. History SFF-SIG generally targets low power components and processors from VIA Technologies and Intel including the Nano and Atom processors, although products for RISC processors were discussed in some working groups. VIA, WinSystems, and Octagon Systems were founding members of SFF-SIG. It was created in 2007. A logo and web site debuted in April 2008. SFF-SIG creates, promotes, and maintains embedded computer standards for form factors and computer buses. Examples include the governing documents and trademarks for CoreExpress, Pico-ITX, Express104, and SUMIT. Members use the specifications to build spe ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Computer-on-module
A computer-on-module (COM) is a type of single-board computer (SBC), a subtype of an embedded computer system. An extension of the concept of System on a chip, system on chip (SoC) and system in package (SiP), COM lies between a full-up computer and a microcontroller in nature. It is very similar to a system on module (SOM). Design COMs are complete embedded computers built on a single circuit board. The design is centered on a microprocessor with random-access memory, RAM, input/output controllers and all other features needed to be a functional computer on the one board. However, unlike a single-board computer, the COM usually lacks the standard connectors for any input/output peripherals to be attached directly to the board. The module usually needs to be mounted on a carrier board (or "baseboard") which breaks the bus out to standard peripheral connectors. Some COMs also include peripheral connectors. Some can be used without a carrier. A COM solution offers a dense pa ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
DIGITAL-LOGIC AG
Kontron AG is a German-based multinational company that designs and manufactures embedded systems, modules and boards, and provides software products for Internet of Things and 5G technologies. The company operates in various industrial segments (including industrial automation, communications, transportation, energy, avionics, medical, automotive, and military), manufacturing and selling its products worldwide. Kontron is a premier member of the Intel Embedded Alliance. The corporate group was originally headquartered in Augsburg and consisted of the ''Kontron Europe GmbH'', with its main sites in Ismaning, Augsburg, Deggendorf, and Saarbrücken (other locations included San Diego, Fremont, California, Montreal, Plzeň, Toulon, Bangalore, Taipei, Tokyo and Beijing). Kontron acquired Dolch in 2005. At the 2007 Embedded World trade exhibition in Nuremberg, Kontron introduced a product called UGM-M72, a modular graphics card for Computer-on-Module systems, which was based on U ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Embedded System
An embedded system is a specialized computer system—a combination of a computer processor, computer memory, and input/output peripheral devices—that has a dedicated function within a larger mechanical or electronic system. It is embedded as part of a complete device often including electrical or electronic hardware and mechanical parts. Because an embedded system typically controls physical operations of the machine that it is embedded within, it often has real-time computing constraints. Embedded systems control many devices in common use. , it was estimated that ninety-eight percent of all microprocessors manufactured were used in embedded systems. Modern embedded systems are often based on microcontrollers (i.e. microprocessors with integrated memory and peripheral interfaces), but ordinary microprocessors (using external chips for memory and peripheral interface circuits) are also common, especially in more complex systems. In either case, the processor(s) us ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Computer Form Factor
Form factor is a hardware design aspect that defines and prescribes the size, shape, and other physical specifications of components, particularly in electronics. A form factor may represent a broad class of similarly sized components, or it may prescribe a specific standard. It may also define an entire system, as in a computer form factor. Evolution and standardization As electronic hardware has become smaller following Moore's law and related patterns, ever-smaller form factors have become feasible. Specific technological advances, such as PCI Express, have had a significant design impact, though form factors have historically evolved slower than individual components. Standardization of form factors is vital for hardware compatibility between different manufacturers. Trade-offs Smaller form factors may offer more efficient use of limited space, greater flexibility in the placement of components within a larger assembly, reduced use of material, and greater ease of transportat ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Embedded System Module
Embedded System Module, or ESM, is a compact computer-on-module (COM) standard. An ESM module typically includes a CPU processor, memory, module-specific I/O interfaces and a number of basic front I/O connectors. They can be plugged on a carrier board or be used as a stand-alone processor card. If the ESM module is plugged on a carrier, it relies on the standard PCI bus as a board-to-board interface. In this case two connectors create a link to the carrier. While the "J1" connector provides a specified PCI connection, the "J2" connector brings I/O signals from the ESM module to the carrier, which then includes all necessary connectors. The signal assignment of J2 is not fixed but can be completely customized, although there are reserved pins for a 64-bit PCI bus interface. A third connector, "J3", is used for additional I/O signals if the ESM module has no front I/O. The signal assignment of this connector is fixed to support a special set of I/O functions. A large part of the I/O ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Heat Sink
A heat sink (also commonly spelled heatsink) is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is thermal management (electronics), dissipated away from the device, thereby allowing regulation of the device's temperature. In computers, heat sinks computer cooling, are used to cool central processing unit, CPUs, graphics processing unit, GPUs, and some chipsets and RAM modules. Heat sinks are used with other high-power semiconductor devices such as Transistor#Other transistor types, power transistors and optoelectronics such as lasers and light-emitting diodes (LEDs), where the heat dissipation ability of the component itself is insufficient to moderate its temperature. A heat sink is designed to maximize its surface area in contact with the cooling medium surrounding it, such as the air. Air velocity, choice of material, protrusion design and surface treatment are fact ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Dissipation
In thermodynamics, dissipation is the result of an irreversible process that affects a thermodynamic system. In a dissipative process, energy ( internal, bulk flow kinetic, or system potential) transforms from an initial form to a final form, where the capacity of the final form to do thermodynamic work is less than that of the initial form. For example, transfer of energy as heat is dissipative because it is a transfer of energy other than by thermodynamic work or by transfer of matter, and spreads previously concentrated energy. Following the second law of thermodynamics, in conduction and radiation from one body to another, the entropy varies with temperature (reduces the capacity of the combination of the two bodies to do work), but never decreases in an isolated system. In mechanical engineering, dissipation is the irreversible conversion of mechanical energy into thermal energy with an associated increase in entropy. Processes with defined local temperature produce ent ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
