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Component Placement
Component placement is an electronics manufacturing process that places electrical components precisely on printed circuit boards (PCBs) to create electrical interconnections between functional components and the interconnecting circuitry in the PCBs (leads-pads). The component leads must be accurately immersed in the solder paste previously deposited on the PCB pads. The next step after component placement is soldering. Placement inputs * Flexible placer, chip shooter, and other specialized machines. * PWB with solder print. * Components supplied by feeders. * Computer files: computer program controls location of each component on the PWB (X, Y and angular theta), feeder inventory levels, placement machine vacuum holder capability, automatic component realignment, placement accuracy, vision systems, and transportation of PCBs through the line. Placement process Basic placement sequence generally includes: board indexing, board registration, fiducial vision alignment, component ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Electronics Manufacturing
The electronics industry is the industry that produces electronic devices. It emerged in the 20th century and is today one of the largest global industries. Contemporary society uses a vast array of electronic devices that are built in factories operated by the industry, which are almost always partially automated. Electronic products are primarily assembled from metal–oxide–semiconductor (MOS) transistors and integrated circuits, the latter principally by photolithography and often on printed circuit boards. Circuit boards are assembled largely using surface-mount technology, which typically involves the automated placement of electronic parts on circuit boards using pick-and-place machines. Surface-mount technology and pick-and-place machines make it possible to assemble large numbers of circuit boards at high speed. The industry's size, the use of toxic materials, and the difficulty of recycling have led to a series of problems with electronic waste. International reg ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Electronic Component
An electronic component is any basic discrete electronic device or physical entity part of an electronic system used to affect electrons or their associated fields. Electronic components are mostly industrial products, available in a singular form and are not to be confused with electrical elements, which are conceptual abstractions representing idealized electronic components and elements. A datasheet for an electronic component is a technical document that provides detailed information about the component's specifications, characteristics, and performance. Discrete circuits are made of individual electronic components that only perform one function each as packaged, which are known as discrete components, although strictly the term discrete component refers to such a component with semiconductor material such as individual transistors. Electronic components have a number of electrical terminals or leads. These leads connect to other electrical components, often over wire, ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Printed Circuit Board
A printed circuit board (PCB), also called printed wiring board (PWB), is a Lamination, laminated sandwich structure of electrical conduction, conductive and Insulator (electricity), insulating layers, each with a pattern of traces, planes and other features (similar to wires on a flat surface) Chemical milling, etched from one or more sheet layers of copper laminated onto or between sheet layers of a non-conductive substrate. PCBs are used to connect or Electrical wiring, "wire" Electronic component, components to one another in an electronic circuit. Electrical components may be fixed to conductive pads on the outer layers, generally by soldering, which both electrically connects and mechanically fastens the components to the board. Another manufacturing process adds Via (electronics), vias, metal-lined drilled holes that enable electrical interconnections between conductive layers, to boards with more than a single side. Printed circuit boards are used in nearly all e ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Soldering
Soldering (; ) is a process of joining two metal surfaces together using a filler metal called solder. The soldering process involves heating the surfaces to be joined and melting the solder, which is then allowed to cool and solidify, creating a strong and durable joint. Soldering is commonly used in the electronics industry for the manufacture and repair of Printed circuit board, printed circuit boards (PCBs) and other electronic components. It is also used in plumbing and Metalworking, metalwork, as well as in the manufacture of jewelry and other decorative items. The solder used in the process can vary in composition, with different alloys used for different applications. Common solder alloys include tin-lead, tin-silver, and tin-copper, among others. Lead-free solder has also become more widely used in recent years due to health and environmental concerns associated with the use of lead. In addition to the type of solder used, the temperature and method of heating also p ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Fiducial Marker
A fiducial marker or fiducial is an object placed in the field of view of an image for use as a point of reference or a measure. It may be either something placed into or on the imaging subject, or a mark or set of marks in the reticle of an optical instrument. Applications Microscopy In high-resolution optical microscopy, fiducials can be used to actively stabilize the field of view. Stabilization to better than 0.1 nm is achievable. Physics In physics, 3D computer graphics, and photography, fiducials are reference points: fixed points or lines within a scene to which other objects can be related or against which objects can be measured. Cameras outfitted with Réseau plates produce these reference marks (also called Réseau crosses) and are commonly used by NASA. Such marks are closely related to the timing marks used in optical mark recognition. Geographical survey Airborne geophysics, geophysical surveys also use the term "fiducial" as a sequential reference number ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Vacuum Tweezers
A vacuum (: vacuums or vacua) is space devoid of matter. The word is derived from the Latin adjective (neuter ) meaning "vacant" or "void". An approximation to such vacuum is a region with a gaseous pressure much less than atmospheric pressure. Physicists often discuss ideal test results that would occur in a ''perfect'' vacuum, which they sometimes simply call "vacuum" or free space, and use the term partial vacuum to refer to an actual imperfect vacuum as one might have in a laboratory or in space. In engineering and applied physics on the other hand, vacuum refers to any space in which the pressure is considerably lower than atmospheric pressure. The Latin term ''in vacuo'' is used to describe an object that is surrounded by a vacuum. The ''quality'' of a partial vacuum refers to how closely it approaches a perfect vacuum. Other things equal, lower gas pressure means higher-quality vacuum. For example, a typical vacuum cleaner produces enough suction to reduce air pressur ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
SMT Placement Equipment
Surface-mount technology (SMT) component placement systems, commonly called pick-and-place machines or P&Ps, are robotic machines which are used to place surface-mount devices (SMDs) onto a printed circuit board (PCB). They are used for high speed, high precision placing of a broad range of electronic components (such as capacitors, resistors, and integrated circuits) onto the PCBs which are in turn used in computers, consumer electronics, and industrial, medical, automotive, military and telecommunications equipment. Similar equipment exists for through-hole components. This type of equipment is sometimes used to package microchips using the flip chip method. History 1980s and 1990s During this time, a typical SMT assembly line employed two different types of pick-and-place (P&P) machines arranged in sequence. The unpopulated board was fed into a rapid placement machine. These machines, sometimes called chip shooters, place mainly low-precision, simple package co ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Plastic Leaded Chip Carrier
In electronics, a chip carrier is one of several kinds of surface-mount technology packages for integrated circuits (commonly called "chips"). Connections are made on all four edges of a square package; compared to the internal cavity for mounting the integrated circuit, the package overall size is large.Kenneth Jackson, Wolfgang Schroter, (ed), ''Handbook of Semiconductor Technology Volume 2'', Wiley VCH, 2000, , page 627 Types Chip carriers may have either J-shaped metal leads for connections by solder or by a socket, or may be lead-less with metal pads for connections. If the leads extend beyond the package, the preferred description is " flat pack". Chip carriers can be smaller than dual in-line packages and since they use all four edges of the package they can have a larger pin count. Chip carriers may be made of ceramic or plastic. Some forms of chip carrier package are standardized in dimensions and registered with trade industry associations such as JEDEC. Other forms a ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Just-in-Time Manufacturing
Lean manufacturing is a method of manufacturing goods aimed primarily at reducing times within the production system as well as response times from suppliers and customers. It is closely related to another concept called just-in-time manufacturing (JIT manufacturing in short). Just-in-time manufacturing tries to match production to demand by only supplying goods that have been ordered and focus on efficiency, productivity (with a commitment to continuous improvement), and reduction of "wastes" for the producer and supplier of goods. Lean manufacturing adopts the just-in-time approach and additionally focuses on reducing cycle, flow, and throughput times by further eliminating activities that do not add any value for the customer. Lean manufacturing also involves people who work outside of the manufacturing process, such as in marketing and customer service. Lean manufacturing (also known as agile manufacturing) is particularly related to the operational model impleme ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Derating
In electronics, derating is the operation of a device at less than its rated maximum capability to prolong its life. Typical examples include operations below the maximum power rating, current rating, or voltage rating. In electronics Power semiconductor devices have a maximum power dissipation rating usually quoted at a case temperature of . The datasheet for the device also includes a ''derating curve'' which indicates how much a device will dissipate without getting damaged at any given case temperature, and this must be taken into account while designing a system. As can be seen from the derating curve image for a hypothetical bipolar junction transistor, the device (rated for 100 W at ) cannot be expected to dissipate anything more than about 40 W if the ambient temperature is such that the temperature at which the device's case will stabilize (after heat-sinking) is . This final case temperature is a function of the thermal resistance between the device's case and the ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Bill Of Materials
A bill of materials or product structure (sometimes bill of material, BOM or associated list) is a list of the raw materials, sub-assemblies, intermediate assemblies, sub-components, parts, and the quantities of each needed to manufacture an Product (business), end product. A BOM may be used for communication between manufacturing partners or confined to a single manufacturing plant. A bill of materials is often tied to a production order whose issuance may generate reservations for components in the bill of materials that are in stock and requisitions for components that are not in stock. The first Hierarchical database model, hierarchical databases were developed for automating bills of materials for manufacturing organizations in the early 1960s. At present, this BOM is used as a database to identify the many parts and their codes in automobile manufacturing companies. A BOM can also be visually represented by a Product structure modeling, product structure tree, although they ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
