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32nm
The 32 nm node is the step following the 45 nm process in CMOS (MOSFET) semiconductor device fabrication. "32-nanometre" refers to the average half-pitch (i.e., half the distance between identical features) of a memory cell at this technology level. Toshiba produced commercial 32 GiB NAND flash memory chips with the 32nm process in 2009. Intel and AMD produced commercial microchips using the 32-nanometre process in the early 2010s. IBM and the Common Platform also developed a 32 nm high-κ metal gate process. Intel began selling its first 32 nm processors using the Westmere architecture on 7 January 2010. The 28-nanometre node was an intermediate half-node die shrink based on the 32-nanometre process. The 32 nm process was superseded by commercial 22 nm technology in 2012. [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Sandy Bridge
Sandy Bridge is the codename for Intel's 32 nm microarchitecture used in the second generation of the Intel Core processors ( Core i7, i5, i3). The Sandy Bridge microarchitecture is the successor to Nehalem and Westmere microarchitecture. Intel demonstrated a Sandy Bridge processor in 2009, and released first products based on the architecture in January 2011 under the Core brand. Sandy Bridge is manufactured in the 32 nm process and has a soldered contact with the die and IHS (Integrated Heat Spreader), while Intel's subsequent generation Ivy Bridge uses a 22 nm die shrink and a TIM (Thermal Interface Material) between the die and the IHS. Technology Intel demonstrated a Sandy Bridge processor with A1 stepping at 2 GHz during the Intel Developer Forum in September 2009. Upgraded features from Nehalem include: CPU * Intel Turbo Boost 2.0 * 32 KB data + 32 KB instruction L1 cache and 256 KB L2 cache per core * Shared L3 cache which incl ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Westmere (microarchitecture)
Westmere (formerly Nehalem-C) is the code name given to the 32 nm die shrink of '' Nehalem''. While sharing the same CPU sockets, Westmere included Intel HD Graphics, while Nehalem did not. The first ''Westmere''-based processors were launched on January 7, 2010, by Intel Corporation. The Westmere architecture has been available under the Intel brands of Core i3, Core i5, Core i7, Pentium, Celeron and Xeon. Technology Westmere's feature improvements from Nehalem, as reported: * Native six-core ( Gulftown) and ten-core ( Westmere-EX) processors. * A new set of instructions that gives over 3x the encryption and decryption rate of Advanced Encryption Standard (AES) processes compared to before. ** Delivers seven new instructions ( AES instruction set or AES-NI), out of which six implement the AES algorithm, and PCLMULQDQ (see CLMUL instruction set) implements carry-less multiplication for use in cryptography and data compression. * Integrated graphics, added into the pro ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
NAND Flash
Flash memory is an electronic non-volatile computer memory storage medium that can be electrically erased and reprogrammed. The two main types of flash memory, NOR flash and NAND flash, are named for the NOR and NAND logic gates. Both use the same cell design, consisting of floating gate MOSFETs. They differ at the circuit level depending on whether the state of the bit line or word lines is pulled high or low: in NAND flash, the relationship between the bit line and the word lines resembles a NAND gate; in NOR flash, it resembles a NOR gate. Flash memory, a type of floating-gate memory, was invented at Toshiba in 1980 and is based on EEPROM technology. Toshiba began marketing flash memory in 1987. EPROMs had to be erased completely before they could be rewritten. NAND flash memory, however, may be erased, written, and read in blocks (or pages), which generally are much smaller than the entire device. NOR flash memory allows a single machine word to be written to an era ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Micron Technology
Micron Technology, Inc. is an American producer of computer memory and computer data storage including dynamic random-access memory, flash memory, and USB flash drives. It is headquartered in Boise, Idaho. Its consumer products, including the Ballistix line of memory modules, are marketed under the Crucial brand. Micron and Intel together created IM Flash Technologies, which produced NAND flash memory. It owned Lexar between 2006 and 2017. History 1978–1999 Micron was founded in Boise, Idaho, in 1978 by Ward Parkinson, Joe Parkinson, Dennis Wilson, and Doug Pitman as a semiconductor design consulting company. Startup funding was provided by local Idaho businessmen Tom Nicholson, Allen Noble, Rudolph Nelson, and Ron Yanke. Later it received funding from Idaho billionaire J. R. Simplot, whose fortune was made in the potato business. In 1981, the company moved from consulting to manufacturing with the completion of its first wafer fabrication unit ("Fab 1"), producing ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
DDR3
Double Data Rate 3 Synchronous Dynamic Random-Access Memory (DDR3 SDRAM) is a type of synchronous dynamic random-access memory (SDRAM) with a high bandwidth ("double data rate") interface, and has been in use since 2007. It is the higher-speed successor to DDR and DDR2 and predecessor to DDR4 synchronous dynamic random-access memory (SDRAM) chips. DDR3 SDRAM is neither forward nor backward compatible with any earlier type of random-access memory (RAM) because of different signaling voltages, timings, and other factors. DDR3 is a DRAM interface specification. The actual DRAM arrays that store the data are similar to earlier types, with similar performance. The primary benefit of DDR3 SDRAM over its immediate predecessor DDR2 SDRAM, is its ability to transfer data at twice the rate (eight times the speed of its internal memory arrays), enabling higher bandwidth or peak data rates. The DDR3 standard permits DRAM chip capacities of up to 8 gigabits (Gbit), and up to four ran ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
SDRAM
Synchronous dynamic random-access memory (synchronous dynamic RAM or SDRAM) is any DRAM where the operation of its external pin interface is coordinated by an externally supplied clock signal. DRAM integrated circuits (ICs) produced from the early 1970s to early 1990s used an ''asynchronous'' interface, in which input control signals have a direct effect on internal functions only delayed by the trip across its semiconductor pathways. SDRAM has a ''synchronous'' interface, whereby changes on control inputs are recognised after a rising edge of its clock input. In SDRAM families standardized by JEDEC, the clock signal controls the stepping of an internal finite-state machine that responds to incoming commands. These commands can be pipelined to improve performance, with previously started operations completing while new commands are received. The memory is divided into several equally sized but independent sections called ''banks'', allowing the device to operate on a memory ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
DDR4
Double Data Rate 4 Synchronous Dynamic Random-Access Memory (DDR4 SDRAM) is a type of synchronous dynamic random-access memory with a high bandwidth ("double data rate") interface. Released to the market in 2014, it is a variant of dynamic random-access memory (DRAM), of which some have been in use since the early 1970s, and a higher-speed successor to the DDR2 and DDR3 technologies. DDR4 is not compatible with any earlier type of random-access memory (RAM) due to different signaling voltage and physical interface, besides other factors. DDR4 SDRAM was released to the public market in Q2 2014, focusing on ECC memory, while the non-ECC DDR4 modules became available in Q3 2014, accompanying the launch of Haswell-E processors that require DDR4 memory. Features The primary advantages of DDR4 over its predecessor, DDR3, include higher module density and lower voltage requirements, coupled with higher data rate transfer speeds. The DDR4 standard allows for DIMMs of up ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
TSMC
Taiwan Semiconductor Manufacturing Company Limited (TSMC; also called Taiwan Semiconductor) is a Taiwanese multinational semiconductor contract manufacturing and design company. It is the world's most valuable semiconductor company, the world's largest dedicated independent ( pure-play) semiconductor foundry, and one of Taiwan's largest companies, with its headquarters and main operations located in the Hsinchu Science Park in Hsinchu. It is majority owned by foreign investors. Founded in Taiwan in 1987 by Morris Chang, TSMC was the world's first dedicated semiconductor foundry and has long been the leading company in its field. When Chang retired in 2018, after 31 years of TSMC leadership, Mark Liu became chairman and C. C. Wei became Chief Executive. It has been listed on the Taiwan Stock Exchange (TWSE: 2330) since 1993; in 1997 it became the first Taiwanese company to be listed on the New York Stock Exchange (NYSE: TSM). Since 1994, TSMC has had a compound annual growth ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Numerical Aperture
In optics, the numerical aperture (NA) of an optical system is a dimensionless number that characterizes the range of angles over which the system can accept or emit light. By incorporating index of refraction in its definition, NA has the property that it is constant for a beam as it goes from one material to another, provided there is no refractive power at the interface. The exact definition of the term varies slightly between different areas of optics. Numerical aperture is commonly used in microscopy to describe the acceptance cone of an objective (and hence its light-gathering ability and resolution), and in fiber optics, in which it describes the range of angles within which light that is incident on the fiber will be transmitted along it. General optics In most areas of optics, and especially in microscopy, the numerical aperture of an optical system such as an objective lens is defined by :\mathrm = n \sin \theta, where is the index of refraction of the medium in ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Immersion Lithography
Immersion lithography is a photolithography resolution enhancement technique for manufacturing integrated circuits (ICs) that replaces the usual air gap between the final lens and the wafer surface with a liquid medium that has a refractive index greater than one. The resolution is increased by a factor equal to the refractive index of the liquid. Current immersion lithography tools use highly purified water for this liquid, achieving feature sizes below 45 nanometers. ASML and Nikon are currently the only manufacturers of immersion lithography systems. History The idea for immersion lithography was patented in 1984 by Takanashi et al. It was also proposed by Taiwanese engineer Burn J. Lin and realized in the 1980s. In 2004, IBM's director of silicon technology, Ghavam Shahidi, announced that IBM planned to commercialize lithography based on light filtered through water. Immersion lithography is now being extended to sub-20nm nodes through the use of multiple patterning. Back ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Interuniversity Microelectronics Centre
Interuniversity Microelectronics Centre (IMEC) is an international research & development organization, active in the fields of nanoelectronics and digital technologies, with headquarters in Belgium. Luc Van den hove has served as President and CEO since 2009. In September 2016, imec merged with the Flemish digital research center, iMinds. Overview Imec employs around 4,000 researchers from more than 90 countries; it has numerous facilities dedicated to research and development around the world, including 12,000 square meters of cleanroom capacity for semiconductor processing. The imec headquarters are located in Leuven. History In 1982, the Flemish Government set up a program to strengthen the microelectronics industry in Flanders. This program included setting up a laboratory for advanced research in microelectronics (imec), a semiconductor foundry (former Alcatel Microelectronics, now STMicroelectronics and AMI Semiconductor,) and a training program for VLSI design engi ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Photolithography
In integrated circuit manufacturing, photolithography or optical lithography is a general term used for techniques that use light to produce minutely patterned thin films of suitable materials over a substrate, such as a silicon wafer (electronics), wafer, to protect selected areas of it during subsequent etching, Chemical vapor deposition, deposition, or Ion implantation, implantation operations. Typically, ultraviolet light is used to transfer a geometry, geometric design from an photomask, optical mask to a photosensitivity, light-sensitive chemical (photoresist) coated on the substrate. The photoresist either breaks down or hardens where it is exposed to light. The patterned film is then created by removing the softer parts of the coating with appropriate solvents. Conventional photoresists typically consists of three components: resin, sensitizer, and solvent. Photolithography processes can be classified according to the type of light used, such as ultraviolet, deep ultrav ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
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