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STR5
Socket sTR5 is a land grid array (LGA) CPU socket designed by AMD. It supports the Zen 4-based Ryzen Threadripper 7000 series, which launched in November 2023. Details sTR5 is a socket for both ''Ryzen Threadripper'' HEDT and ''Ryzen Threadripper Pro'' workstation processor lineups. This is unlike the preceding (3000 and 5000 series) generations of Ryzen Threadripper / Threadripper Pro processors, which were on separate sockets, sTRX4 and sWRX8 respectively. The sTR5 socket has two chipsets available: TRX50 for HEDT consumer systems, and WRX90 for professional workstation systems. TRX50 supports both Threadripper and Threadripper PRO CPU models, while WRX90 supports only Threadripper Pro models. Socket sTR5 supports DDR5 memory of the RDIMM type with ECC, as well as PCIe 5.0. It does not support non-registered DIMMs, non-ECC RAM, or DDR4. The maximum number of memory channels is 8 and the maximum number of PCIe 5.0 lanes is 128 with a Threadripper PRO CPU and a WRX90 mot ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Ryzen
Ryzen ( ) is a brand of multi-core x86-64 microprocessors, designed and marketed by AMD for desktop, mobile, server, and embedded platforms, based on the Zen microarchitecture. It consists of central processing units (CPUs) marketed for mainstream, enthusiast, server, and workstation segments, and accelerated processing units (APUs), marketed for mainstream and entry-level segments, and embedded systems applications. A majority of AMD's consumer Ryzen products use the AM4 and AM5 platforms. In August 2017, AMD launched their Ryzen Threadripper line aimed at the enthusiast and workstation markets. Ryzen Threadripper uses different, larger sockets such as TR4, sTRX4, sWRX8, and sTR5, which support additional memory channels and PCI Express lanes. AMD has moved to the new AM5 platform for consumer desktop Ryzen with the release of Zen 4 products in late 2022. History Background Ryzen uses the "Zen" CPU microarchitecture, a redesign that returned AMD to the high- ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Threadripper
Threadripper, or Ryzen Threadripper, is a brand of HEDT (high-end desktop) and workstation multi-core x86-64 microprocessors designed and marketed by Advanced Micro Devices (AMD), and based on the Zen microarchitecture. It consists of central processing units (CPUs) marketed for mainstream and workstation segments, and as such comes in two line-ups, Threadripper and Threadripper PRO respectively. Background Threadripper, which is geared for high-end desktops (HEDT) and workstations, was not developed as part of a business plan or a specific roadmap. Instead, a small team inside AMD saw an opportunity to give AMD the lead in desktop CPU performance. After some progress was made in their spare time, the project was greenlit and put in an official roadmap by 2016. Characteristics Threadripper chips have higher core counts, increased power requirements, support faster memory, and more expansion opportunities. The Zen 4 core's pipelines use a high-density leading-edge 5 nm process ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Socket SP6
Socket SP6 (LGA 4844) is a zero insertion force land grid array CPU socket designed by AMD supporting its Zen 4c-based ''Siena'' Epyc server processors that launched on September 18, 2023. It is designed for server systems targeting infrastructure and edge computing segments. History In November 2022, AMD launched the SP5 socket alongside its Epyc 9004 series of processors, codenamed Genoa. The large physical socket and thermal footprint excluded SP5 from certain edge applications. Socket SP6 was created as a smaller variant of socket SP5 with fewer pins and less memory support, reducing the footprint from 72×75.4 mm to 58.5×75.4 mm, identical to that of SP3. The SP6 platform comes in at a lower cost than the SP5 platform's Genoa and Bergamo server processors. Socket SP6 serves segments of the server market where performance is not a priority, but cost, value, small footprint, and low power consumption / heat dissipation are. Examples of this are infrastructure c ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
List Of AMD Chipsets
This is an overview of chipsets sold under the AMD brand, manufactured before May 2004 by the company itself, before the adoption of open platform approach as well as chipsets manufactured by ATI Technologies after October 2006 as the completion of the ATI acquisition. North- and Southbridges Northbridges AMD-xxx A-Link Express II A-Link Express and A-Link Express II are essentially PCIe 1.1 x4 lanes. See Comparison of ATI Chipsets for the comparison of chipsets sold under the ATI brand for AMD processors, before AMD's acquisition of ATI. A-Link Express III A-Link Express III is essentially PCIe 2.0 x4 lanes. Southbridges AMD-xxx 1 Parallel ATA, also known as Enhanced IDE supports up to 2 devices per channel. A-Link Express * All models support eSATA implementations of available SATA channels. 1 Parallel ATA, also known as Enhanced IDE supports up to 2 devices per channel. Fusion controller hubs (FCH) For AMD APU models from 2011 until ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Socket SWRX8
Socket sWRX8, also known as ''Socket SP3r4'', is a land grid array (LGA) CPU socket designed by AMD supporting its Ryzen Threadripper Pro 3000 and 5000 series workstation processors, which are based on Zen 2 and Zen 3 platforms, respectively. It was initially launched in July 2020 for OEMs only, with retail availability coming later in March 2021. Socket sWRX8 does not succeed any previous sockets; instead it sits alongside socket sTRX4 as a socket for professional workstation computers, while sTRX4 is for consumer high-end desktop (HEDT) computers. sWRX8 has support for octa-channel DDR4 memory and 128 PCIe 4.0 lanes from the CPU, whereas sTRX4 only supports quad-channel DDR4 and 64 PCIe 4.0 lanes. Furthermore, unlike sTRX4, it supports RDIMM, LRDIMM and 3DS RDIMM memory types, allowing up to 2TB of RAM to be installed (compared to the maximum of 256GB for sTRX4). It is physically identical to, but electrically incompatible with both sTRX4 and AMD's server socket SP3. While ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Land Grid Array
The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket (when a socket is used) — as opposed to pins on the integrated circuit, known as a '' pin grid array'' (PGA). An LGA can be electrically connected to a printed circuit board (PCB) either by the use of a socket or by soldering directly to the board. Description The ''land grid array'' is a packaging technology with a grid of contacts, 'lands', on the underside of a package. The contacts are to be connected to a grid of contacts on the PCB. Not all rows and columns of the grid need to be used. The contacts can either be connected by using an LGA socket, or by surface-mount soldering using solder paste. The grid elements found in use can be e.g. circular, triangular or other polygonal shapes and might have even different sizes. Grids might sometimes appear like honey comb patterns. Designs are often optimized for factors like contact likelin ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Zen 4
Zen 4 is the name for a CPU microarchitecture designed by AMD, released on September 27, 2022. It is the successor to Zen 3 and uses TSMC's N6 process for I/O dies, N5 process for CCDs, and N4 process for APUs. Zen 4 powers Ryzen 7000 performance desktop processors (codenamed "Raphael"), Ryzen 8000G series mainstream desktop APUs (codenamed "Phoenix"), and Ryzen Threadripper 7000 series HEDT and workstation processors (codenamed "Storm Peak"). It is also used in extreme mobile processors (codenamed "Dragon Range"), thin & light mobile processors (codenamed "Phoenix" and "Hawk Point"), as well as EPYC 8004/9004 server processors (codenamed "Siena", "Genoa" and "Bergamo"). Zen 4 is the first microarchitecture whose chips (Ryzen 7000) use the AM5 motherboard socket. Features Like its predecessor, Zen 4 in its Desktop Ryzen variants features one or two Core Complex Dies (CCDs) built on TSMC's 5 nm process and one I/O die built on 6 nm. Previously, the I/O die on Z ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Land Grid Array
The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket (when a socket is used) — as opposed to pins on the integrated circuit, known as a '' pin grid array'' (PGA). An LGA can be electrically connected to a printed circuit board (PCB) either by the use of a socket or by soldering directly to the board. Description The ''land grid array'' is a packaging technology with a grid of contacts, 'lands', on the underside of a package. The contacts are to be connected to a grid of contacts on the PCB. Not all rows and columns of the grid need to be used. The contacts can either be connected by using an LGA socket, or by surface-mount soldering using solder paste. The grid elements found in use can be e.g. circular, triangular or other polygonal shapes and might have even different sizes. Grids might sometimes appear like honey comb patterns. Designs are often optimized for factors like contact likelin ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
CPU Socket
In computer hardware, a CPU socket or CPU slot contains one or more mechanical components providing mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows for placing and replacing the central processing unit (CPU) without soldering. Common sockets have retention clips that apply a constant force, which must be overcome when a device is inserted. For chips with many pins, zero insertion force (ZIF) sockets are preferred. Common sockets include pin grid array (PGA) or land grid array (LGA). These designs apply a compression force once either a handle (PGA type) or a surface plate (LGA type) is put into place. This provides superior mechanical retention while avoiding the risk of bending pins when inserting the chip into the socket. Certain devices use Ball Grid Array (BGA) sockets, although these require soldering and are generally not considered user replaceable. CPU sockets are used on the motherboard in desktop and ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
DDR5 SDRAM
Double Data Rate 5 Synchronous Dynamic Random-Access Memory (DDR5 SDRAM) is a type of synchronous dynamic random-access memory. Compared to its predecessor DDR4 SDRAM, DDR5 was planned to reduce power consumption, while doubling bandwidth. The standard, originally targeted for 2018, was released on July 14, 2020. A new feature called Decision Feedback Equalization (DFE) enables input/output (I/O) speed scalability for higher bandwidth and performance improvement. DDR5 has about the same latency as DDR4 and DDR3. DDR5 octuples the maximum DIMM capacity from 64 GB to 512 GB. DDR5 also has higher frequencies than DDR4, up to 9600 MT/s is currently possible, 8200 MT/s translates into around 66 GB/s of bandwidth. Using liquid nitrogen 13000 MT/s speeds were achieved. Rambus announced a working DDR5 dual in-line memory module (DIMM) in September 2017. On November 15, 2018, SK Hynix announced completion of its first DDR5 RAM chip; running at 5.2 GT/s at 1.1 V ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
