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Socket G3 Memory Extender
The Socket G3 Memory Extender (G3MX) was a planned Advanced Micro Devices' solution to the problem of connecting large amounts of memory to a single microprocessor. The G3MX was expected to be available on AMD 800S series chipset for server market starting from 2009, but was officially cancelled together with the cancellation of Socket G3 in early 2008. retrieved August 20, 2008 Electrical limitations preclude connecting more than 2 unbuffered s or 4 buffered DIMMs to a single shared bus. It is also impractical to manufacture a single chip with more than two DDR memory buses (channels). Th ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Advanced Micro Devices
Advanced Micro Devices, Inc. (AMD) is an American multinational semiconductor company based in Santa Clara, California, that develops computer processors and related technologies for business and consumer markets. While it initially manufactured its own processors, the company later outsourced its manufacturing, a practice known as going fabless, after GlobalFoundries was spun off in 2009. AMD's main products include microprocessors, motherboard chipsets, embedded processors, graphics processors, and FPGAs for servers, workstations, personal computers, and embedded system applications. History First twelve years Advanced Micro Devices was formally incorporated by Jerry Sanders, along with seven of his colleagues from Fairchild Semiconductor, on May 1, 1969. Sanders, an electrical engineer who was the director of marketing at Fairchild, had, like many Fairchild executives, grown frustrated with the increasing lack of support, opportunity, and flexibility within th ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
AMD 800 Chipset Series
The AMD 800 chipset series is a set of chipsets developed by AMD, released in 2009. The chipset series was revealed in its presentation slides during the AMD Financial Analyst Day 2007 held on December 13, 2007. This chipset series also marks the return of AMD to the workstation/server market after the completion of the ATI acquisition in October 2006 with the first server chipsets. Lineup Server The chipset series is targeted in three markets: the workstation/server market, the desktop market and the notebook market. Current information about the chipset series is very scarce, while the officially published information about the series is the server chipsets with two variants available, the AMD 890S chipset and the AMD 870S chipset, all of them paired with the SB700S series southbridge. The chipsets were supposed to support the codenamed "Montreal" processor made on 45 nm process, in Socket G3 package, supporting both unbuffered or buffered DDR3 (with Socket G3MX), HyperTran ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
AMD Socket G3
The Socket G3, originally as part of the codenamed ''Piranha'' server platform, was supposed to be the intermediate successor to Socket F and Socket F+ to be used in AMD Opteron processor for dual-processor (2P) and above server platforms scheduled to be launched 2009. The Socket G3 would have been accompanied by the Socket G3 Memory Extender (Socket G3MX), for connecting large amounts of memory to a single microprocessor by a G3MX chip placed on the motherboard. AMD had planned socket G3 to arrive with the advent of the previously planned 8-core MCM chip code named Montreal. Since Q1 2008, the plan for and 8-core MCM server chip based on 45 nm K10.5 design has been scrapped in favor of a 6-core fully integrated MPU design code named Istanbul, which would use the existing socket F/F+ platform, produced by Nvidia, Broadcom, as well as Fiorano to be introduced by AMD in 2009. However, socket G3 was officially discontinued as of March 2008. The socket that was the successo ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
DDR SDRAM
Double Data Rate Synchronous Dynamic Random-Access Memory (DDR SDRAM) is a double data rate (DDR) synchronous dynamic random-access memory (SDRAM) class of memory integrated circuits used in computers. DDR SDRAM, also retroactively called DDR1 SDRAM, has been superseded by DDR2 SDRAM, DDR3 SDRAM, DDR4 SDRAM and DDR5 SDRAM. None of its successors are forward or backward compatible with DDR1 SDRAM, meaning DDR2, DDR3, DDR4 and DDR5 memory modules will not work in DDR1-equipped motherboards, and vice versa. Compared to single data rate ( SDR) SDRAM, the DDR SDRAM interface makes higher transfer rates possible by more strict control of the timing of the electrical data and clock signals. Implementations often have to use schemes such as phase-locked loops and self-calibration to reach the required timing accuracy. The interface uses double pumping (transferring data on both the rising and falling edges of the clock signal) to double data bus bandwidth without a corresponding in ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
DIMM
A DIMM () (Dual In-line Memory Module), commonly called a RAM stick, comprises a series of dynamic random-access memory integrated circuits. These memory modules are mounted on a printed circuit board and designed for use in personal computers, workstations, printers, and servers. They are the predominant method for adding memory into a computer system. The vast majority of DIMMs are standardized through JEDEC standards, although there are proprietary DIMMs. DIMMs come in a variety of speeds and sizes, but generally are one of two lengths - PC which are and laptop (SO-DIMM) which are about half the size at . History DIMMs (Dual In-line Memory Module) were a 1990s upgrade for SIMMs (Single In-line Memory Modules) as Intel P5-based Pentium processors began to gain market share. The Pentium had a 64-bit bus width, which would require SIMMs installed in matched pairs in order to populate the data bus. The processor would then access the two SIMMs in parallel. DIMMs were ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Point-to-point (telecommunications)
In telecommunications, a point-to-point connection refers to a communications connection between two communication endpoints or nodes. An example is a telephone call, in which one telephone is connected with one other, and what is said by one caller can only be heard by the other. This is contrasted with a '' point-to-multipoint'' or ''broadcast'' connection, in which many nodes can receive information transmitted by one node. Other examples of point-to-point communications links are leased lines and microwave radio relay. The term is also used in computer networking and computer architecture to refer to a wire or other connection that links only two computers or circuits, as opposed to other network topologies such as buses or crossbar switches which can connect many communications devices. ''Point-to-point'' is sometimes abbreviated as '' P2P''. This usage of ''P2P'' is distinct from ''P2P'' meaning ''peer-to-peer'' in the context of file sharing networks or other data-s ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Daisy Chain (electrical Engineering)
In electrical and electronic engineering, a daisy chain is a wiring scheme in which multiple devices are wired together in sequence or in a ring, similar to a garland of daisy flowers. Daisy chains may be used for power, analog signals, digital data, or a combination thereof. The term ''daisy chain'' may refer either to large scale devices connected in series, such as a series of power strips plugged into each other to form a single long line of strips, or to the wiring patterns embedded inside of devices. Other examples of devices which can be used to form daisy chains are those based on Universal Serial Bus (USB), FireWire, Thunderbolt and Ethernet cables. Signal transmission For analog signals, connections usually consist of a simple electrical bus and, especially in the case of a chain of many devices, may require the use of one or more repeaters or amplifiers within the chain to counteract attenuation (the natural loss of energy in such a system). Digital ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Intel
Intel Corporation is an American multinational corporation and technology company headquartered in Santa Clara, California. It is the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets, the instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 ''Fortune'' 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (''int''egrated and ''el''ectronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce ( ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
RDRAM
Rambus DRAM (RDRAM), and its successors Concurrent Rambus DRAM (CRDRAM) and Direct Rambus DRAM (DRDRAM), are types of synchronous dynamic random-access memory (SDRAM) developed by Rambus from the 1990s through to the early 2000s. The third-generation of Rambus DRAM, DRDRAM was replaced by XDR DRAM. Rambus DRAM was developed for high-bandwidth applications and was positioned by Rambus as replacement for various types of contemporary memories, such as SDRAM. DRDRAM was initially expected to become the standard in PC memory, especially after Intel agreed to license the Rambus technology for use with its future chipsets. Further, DRDRAM was expected to become a standard for graphics memory. However, RDRAM got embroiled in a standards war with an alternative technology—DDR SDRAM—and quickly lost out on grounds of price and, later, performance. By around 2003, DRDRAM was no longer supported in new personal computers. PC main memory The first PC motherboards with suppor ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Memory Latency
''Memory latency'' is the time (the latency) between initiating a request for a byte or word in memory until it is retrieved by a processor. If the data are not in the processor's cache, it takes longer to obtain them, as the processor will have to communicate with the external memory cells. Latency is therefore a fundamental measure of the speed of memory: the less the latency, the faster the reading operation. Latency should not be confused with memory bandwidth, which measures the throughput of memory. Latency can be expressed in clock cycles or in time measured in nanoseconds. Over time, memory latencies expressed in clock cycles have been fairly stable, but they have improved in time.Crucial Technology, "Speed ''vs.'' Latency: Why CAS latency isn't an accurate measure of memory performance/ref> See also * Burst mode (computing) * CAS latency * Multi-channel memory architecture * Interleaved memory In computing, interleaved memory is a design which compensates for th ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Semiconductor Device Fabrication
Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuit (IC) chips such as modern computer processors, microcontrollers, and memory chips such as NAND flash and DRAM that are present in everyday electrical and electronic devices. It is a multiple-step sequence of photolithographic and chemical processing steps (such as surface passivation, thermal oxidation, planar diffusion and junction isolation) during which electronic circuits are gradually created on a wafer made of pure semiconducting material. Silicon is almost always used, but various compound semiconductors are used for specialized applications. The entire manufacturing process takes time, from start to packaged chips ready for shipment, at least six to eight weeks (tape-out only, not including the circuit design) and is performed in highly specialized semiconductor fabrication plants, also called foundries or fabs. All fabrication takes place insid ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
FB-DIMM
Fully Buffered DIMM (or FB-DIMM) is a memory technology that can be used to increase reliability and density of memory systems. Unlike the parallel bus architecture of traditional DRAMs, an FB-DIMM has a serial interface between the memory controller and the ''advanced memory buffer'' (AMB). Conventionally, data lines from the memory controller have to be connected to data lines in every Dynamic random-access memory, DRAM module, i.e. via multidrop buses. As the memory width increases together with the access speed, the signal degrades at the interface between the bus and the device. This limits the speed and memory density, so FB-DIMMs take a different approach to solve the problem. 240-pin DDR2 FB-DIMMs are neither mechanically nor electrically compatible with conventional 240-pin DDR2 DIMMs. As a result, those two DIMM types are notched differently to prevent using the wrong one. As with nearly all RAM specifications, the FB-DIMM specification was published by JEDEC. Technol ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
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