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RDNA 3.5
RDNA 3 is a Graphics processing unit, GPU microarchitecture designed by AMD, released with the Radeon Radeon RX 7000 series, RX 7000 series on December 13, 2022. Alongside powering the RX 7000 series, RDNA 3 is also featured in the SoCs designed by AMD for the Asus ROG Ally, Lenovo Legion Go, and the PlayStation 5, PlayStation 5 Pro consoles. Background On June 9, 2022, AMD held their Financial Analyst Day where they presented a client GPU roadmap which contained mention of RDNA 3 coming in 2022 and RDNA 4 coming in 2024. AMD announced to investors their intention to achieve a performance-per-watt uplift of over 50% with RDNA 3 and that the upcoming architecture would be built using chiplet packaging on a 5 nm process. A sneak preview for RDNA 3 was included towards the end of AMD's Ryzen 7000 unveiling event on August 29, 2022. The preview included RDNA 3 running gameplay of ''Lies of P'', AMD CEO Lisa Su confirming that a chiplet design would be used, and a partial look ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
TSMC
Taiwan Semiconductor Manufacturing Company Limited (TSMC or Taiwan Semiconductor) is a Taiwanese multinational semiconductor contract manufacturing and design company. It is one of the world's most valuable semiconductor companies, the world's largest Foundry model#Dedicated foundry, dedicated independent ("Pure play, pure-play") Foundry (electronics), semiconductor foundry, and Taiwan's largest company, with headquarters and main operations located in the Hsinchu Science Park in Hsinchu, Taiwan. Although the government of Taiwan is the largest individual shareholder, the majority of TSMC is owned by foreign investors. In 2023, the company was ranked 44th in the Forbes Global 2000, ''Forbes'' Global 2000. Taiwan's exports of integrated circuits amounted to $184 billion in 2022, nearly 25 percent of Taiwan's GDP. TSMC constitutes about 30 percent of the Taiwan Stock Exchange's main index. TSMC was founded in 1987 by Morris Chang as the world's first dedicated semiconductor foun ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
RDNA 2
RDNA 2 is a GPU microarchitecture designed by AMD, released with the Radeon RX 6000 series on November 18, 2020. Alongside powering the RX 6000 series, RDNA 2 is also featured in the SoCs designed by AMD for the PlayStation 5, Xbox Series X/S, and Steam Deck consoles. Background On July 7, 2019, AMD released the first iteration of the RDNA microarchitecture, a new graphics architecture designed specifically for gaming that replaced the aging Graphics Core Next (GCN) microarchitecture. With RDNA, AMD sought to reduce latency and improve power efficiency over their previous Vega series based on GCN 5th gen and Nvidia's competing Turing microarchitecture. RDNA 2 was first publicly announced in January 2020 with AMD initially calling RDNA 2 a "refresh" of the original RDNA architecture from the previous year. At AMD's Financial Analysts Day held on March 5, 2020, AMD showed a client GPU roadmap that gave details on RDNA's successor, RDNA 2, that it would again be built using ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Epyc
Epyc (stylized as EPYC) is a brand of multi-core x86-64 microprocessors designed and sold by AMD, based on the company's Zen microarchitecture. Introduced in June 2017, they are specifically targeted for the server and embedded system markets. Epyc processors share the same microarchitecture as their regular desktop-grade counterparts, but have enterprise-grade features such as higher core counts, more PCI Express lanes, support for larger amounts of RAM, and larger cache memory. They also support multi-chip and dual-socket system configurations by using the Infinity Fabric interconnect. History *In March 2017, AMD announced plans to re-enter the server market with a platform based on the Zen microarchitecture, codenamed Naples, and officially revealed it under the brand name Epyc in May. That June AMD officially launched Epyc 7001 series processors, offering up to 32 cores per socket, and enabling performance that allowed Epyc to be competitive with the competing Inte ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Ryzen
Ryzen ( ) is a brand of multi-core x86-64 microprocessors, designed and marketed by AMD for desktop, mobile, server, and embedded platforms, based on the Zen microarchitecture. It consists of central processing units (CPUs) marketed for mainstream, enthusiast, server, and workstation segments, and accelerated processing units (APUs), marketed for mainstream and entry-level segments, and embedded systems applications. A majority of AMD's consumer Ryzen products use the AM4 and AM5 platforms. In August 2017, AMD launched their Ryzen Threadripper line aimed at the enthusiast and workstation markets. Ryzen Threadripper uses different, larger sockets such as TR4, sTRX4, sWRX8, and sTR5, which support additional memory channels and PCI Express lanes. AMD has moved to the new AM5 platform for consumer desktop Ryzen with the release of Zen 4 products in late 2022. History Background Ryzen uses the "Zen" CPU microarchitecture, a redesign that returned AMD to the high- ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Die (integrated Circuit)
A die, in the context of integrated circuits, is a small block of semiconducting material on which a given functional circuit is Semiconductor fabrication, fabricated. Typically, integrated circuits are produced in large batches on a single wafer (electronics), wafer of electronic-grade Monocrystalline silicon, silicon (EGS) or other semiconductor (such as Gallium arsenide, GaAs) through processes such as photolithography. The wafer is cut (wafer dicing, diced) into many pieces, each containing one copy of the circuit. Each of these pieces is called a die. There are three commonly used plural forms: ''dice'', ''dies,'' and ''die''. To simplify handling and integration onto a printed circuit board, most dies are integrated circuit packaging, packaged in List of electronic component packaging types, various forms. Manufacturing process Most dies are composed of silicon and used for integrated circuits. The process begins with the production of Single crystal, monocrystalline sili ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Multi-chip Module
A multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or Lead (electronics), "pins") where multiple integrated circuits (ICs or "chips"), semiconductor Die (integrated circuit), dies and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it can be treated as if it were a larger IC. Other terms for MCM packaging include "heterogeneous integration" or "hybrid integrated circuit". The advantage of using MCM packaging is it allows a manufacturer to use multiple components for modularity and/or to improve yields over a conventional monolithic IC approach. A Flip Chip Multi-Chip Module (FCMCM) is a multi-chip module that uses flip chip technology. A FCMCM may have one large die and several smaller dies all on the same module. Overview Multi-chip modules come in a variety of forms depending on the complexity and development philosophies of their designers. These can range from ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Las Vegas
Las Vegas, colloquially referred to as Vegas, is the most populous city in the U.S. state of Nevada and the county seat of Clark County. The Las Vegas Valley metropolitan area is the largest within the greater Mojave Desert, and second-largest in the Southwestern United States. According to the United States Census Bureau, the city had 641,903 residents in 2020, with a metropolitan population of 2,227,053, making it the 24th-most populous city in the United States. Las Vegas is an internationally renowned major resort city, known primarily for its gambling, shopping, fine dining, entertainment, and nightlife. Most of these venues are located in downtown Las Vegas or on the Las Vegas Strip, which is outside city limits in the unincorporated towns of Paradise and Winchester. The Las Vegas Valley serves as the leading financial, commercial, and cultural center in Nevada. Las Vegas was settled in 1905 and officially incorporated in 1911. At the close of the 20th cent ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Lisa Su
Lisa Tzwu-Fang Su (; pinyin: ''Sū Zīfēng''; born 1969) is an American billionaire business executive, computer scientist, and electrical engineer who is the president, chief executive officer (CEO), and chair of the semiconductor company Advanced Micro Devices (AMD). Su was born in Taiwan and moved to the United States as a child. After earning three degrees from the Massachusetts Institute of Technology (MIT), she worked at Texas Instruments, IBM, and Freescale Semiconductor in engineering and management positions.King, Ian"AMD's First Female CEO Seeks Speedy Break With Past Woes" ''Bloomberg Businessweek''. 17 October 2014. She is known for her work developing silicon-on-insulator semiconductor manufacturing technologies and more efficient semiconductor chips during her time as vice president of IBM's Semiconductor Research and Development Center. Su was appointed president and CEO of AMD in October 2014, [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Lies Of P
''Lies of P'' is a 2023 soulslike action role-playing game developed by Neowiz and Round8 Studio and published by Neowiz. Loosely based on Carlo Collodi's 1883 novel, ''The Adventures of Pinocchio'', the story follows the titular puppet traversing the fictional city of Krat, plagued by both an epidemic of petrification disease and a puppet uprising. ''Lies of P'' is played from a third-person perspective, with the player using melee weapons and a mechanical arm equipped with various tools to fight hostile puppets, factions, and citizens disfigured by the disease. Throughout the game, the player makes decisions at key plot points that affect the story. In addition to Collodi's novel, the team drew inspiration from the Belle Époque period and the Soulslike genre. The game was released for macOS, PlayStation 4, PlayStation 5, Windows, Xbox One, and Xbox Series X/S in September 2023. It received favorable critical reception, with praise directed at its visuals, sound design, and ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
PlayStation 5
The PlayStation 5 (PS5) is a home video game console developed by Sony Interactive Entertainment. It was announced as the successor to the PlayStation 4 in April 2019, was launched on November 12, 2020, in Australia, Japan, New Zealand, North America, and South Korea, and was released worldwide a week later. The PS5 is part of the ninth generation of video game consoles, along with Microsoft Gaming, Microsoft's Xbox Series X and Series S, Xbox Series X/S consoles, which were released in the same month. The base model includes an optical disc drive compatible with Ultra HD Blu-ray discs. The Digital Edition lacks this drive, as a lower-cost model for buying games only through digital distribution of video games, download. The two variants were launched simultaneously. Slimmer hardware revisions of both models replaced the original models on sale in November 2023. A PlayStation 5 Pro model was released on November 7, 2024, featuring a faster GPU, improved Ray tracing (graphics), ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Lenovo Legion Go
The Lenovo Legion Go is a handheld gaming computer developed by Lenovo and released in October 2023, as part of their Lenovo Legion line. The device ships with Windows 11 and with the Lenovo Space game launcher. Technology It has an 8.8 inch touch screen. Its CPU is an Ryzen Z1 APU chipset with RDNA integrated graphics. It has 16GB of 7500Mhz LPDDR5X RAM & 256GB - 1 TB of PCIe Gen4 SSD storage, hall effect analog sticks and a 49.2-watt-hour battery. Its starting cost is US$599.99 at launch. The display is a QHD+ screen with a 2560×1600 resolution, 16:10 ratio, 144 Hz and 500 nits. There is an accessory line-up for the product, including VR glasses, surround sound wired headphones and a backpack. It is supplied with a carrying case, a power adapter, a controller base and an Xbox Game Pass. It weighs 854 g with controllers and 650 g without them. Its cooling component features a liquid-crystal polymer 79-blade fan. Reception ''Gizmodo'' wrote that because of the Wind ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Asus ROG Ally
The Asus ROG Ally is a handheld gaming computer developed and manufactured by Asus as part of their Republic of Gamers (ROG) brand. Released on June 13, 2023, the device competes with Valve's Steam Deck. The ROG Ally runs the Windows 11 operating system and uses an AMD Zen 4 processor called the AMD Ryzen Z1 and Z1 Extreme. In addition to handheld use, the ROG Ally can be connected to a TV or monitor through a docking station or a dongle and be used like a desktop computer or home video game console. History Asus began developing a handheld gaming computer in 2018 to compete with handheld computers such as the GPD Win 2. Development slowed down over the next few years but was accelerated after Valve's 2021 announcement of the Steam Deck, which quickly led to a renewed public interest in handheld gaming computers. The device was announced on April 1, 2023, leading many to believe it was an April Fools' Day prank, with Asus clarifying its legitimacy three days later. Asus rev ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
