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Qseven
Qseven, a computer-on-module (COM) form factor, is a small, highly integrated computer module that can be used in a design application much like an integrated circuit component. It is smaller than other computer-on-module standards such as COM Express, ETX or XTX and is limited to very low power consuming CPUs. The maximum power consumption should be no more than 12 watts. Specification The name comes from the word "quadratic" due to the square shape of the original module, 70mm on a side. It was first proposed in 2008 by Congatec. Other companies based in Europe such as Kontron adopted the standard, but after a few years it had not yet been popular in the USA. The Qseven specification is hosted by the Standardization Group for Embedded Technologies (SGET), which took over from the original Qseven consortium in 2013.. The revision 2.0 was released September 9, 2012, and 2.1 on February 25, 2016. The Qseven design guide provides information for designing a custom system carri ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Computer-on-module
A computer-on-module (COM) is a type of single-board computer (SBC), a subtype of an embedded computer system. An extension of the concept of system on chip (SoC) and system in package (SiP), COM lies between a full-up computer and a microcontroller in nature. It is very similar to a system on module (SOM). Design COMs are complete embedded computers built on a single circuit board. The design is centered on a microprocessor with RAM, input/output controllers and all other features needed to be a functional computer on the one board. However, unlike a single-board computer, the COM usually lacks the standard connectors for any input/output peripherals to be attached directly to the board. The module usually needs to be mounted on a carrier board (or "baseboard") which breaks the bus out to standard peripheral connectors. Some COMs also include peripheral connectors. Some can be used without a carrier. A COM solution offers a dense package computer system for use in small o ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
COM Express
COM Express, a computer-on-module (COM) form factor, is a highly integrated and compact computer that can be used in a design application much like an integrated circuit component. Each module integrates core CPU and memory functionality, the common I/O of a PC/AT, USB, audio, graphics ( PEG), and Ethernet. All I/O signals are mapped to two high density, low profile connectors on the bottom side of the module. COM Express employs a mezzanine-based approach. The COM modules plug into a baseboard that is typically customized to the application. Over time, the COM Express mezzanine modules can be upgraded to newer, backwards-compatible versions. COM Express is commonly used in Industrial, military, aerospace, gaming, medical, transportation, Internet of things, and general computing embedded applications. History The COM Express standard was first released in 2005 by the PCI Industrial Computer Manufacturers Group (PICMG). It defined five module types, each implementing differ ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Smart Mobility Architecture
Smart Mobility Architecture (SMARC) is a computer hardware standard for computer-on-modules (COMs). SMARC modules are specifically designed for the development of extremely compact low-power systems, such as mobile devices. Specification The SMARC hardware specification V1.0 was published by the Standardization Group for Embedded Technologies (SGET). SGET had its first meeting in 2012, headed by Engelbert Hörmannsdorfer. The specification is freely available as a download on the SGET website. Generally, SMARC modules are based on ARM architecture processors, they can, however, also be fitted with other low-power system on a chip (SoC) architectures, like, for example, ones based on x86 processors. Typically, SMARC modules’ power requirement is in the range of a few watts. Computer-on-modules integrate the core function of a bootable computer, as well as additional circuitry, including DRAM, boot-flash, voltage distribution, Ethernet and display transmitter. The modules are ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Mobile PCI Express Module
A Mobile PCI Express Module (MXM) is an interconnect standard for GPUs (MXM Graphics Modules) in laptops using PCI Express created by MXM-SIG. The goal was to create a non-proprietary, industry standard socket, so one could easily upgrade the graphics processor in a laptop, without having to buy a whole new system or relying on proprietary vendor upgrades. 1st generation configurations Smaller graphics modules can be inserted into larger slots, but type I and II heatsinks will not fit type III and above or vice versa. The Alienware m5700 platform uses a heatsink that will fit Type I, II, & III cards without modification. 2nd generation configurations (MXM 3) Smaller graphics modules can be inserted into larger slots. Heatsink mounting remains the same for type A and B modules. MXM 3.1 was released in March 2012 and added PCIe 3.0 support. Module compatibility First generation modules are ''not'' compatible with second generation modules and vice versa. First generation m ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
VIA QSM-8Q90 Module - Module Angle (6856346650)
Via or VIA may refer to the following: Science and technology * MOS Technology 6522, Versatile Interface Adapter * ''Via'' (moth), a genus of moths in the family Noctuidae * Via (electronics), a through-connection * VIA Technologies, a Taiwanese manufacturer of electronics * Virtual Interface Adapter, a network protocol * Virtual Interface Architecture, a networking standard used in high-performance computing Education * VIA Vancouver Institute for the Americas, an organization dedicated to education for sustainable development, since 1998 operating in Canada * VIA University College, a university college (Danish: professionshøjskole), since 2008 established in Denmark * VIA, Association of Information Sciences (Dutch: VIA Vereniging Informatiewetenschappen Amsterdam), at the University of Amsterdam, in the Netherlands Transportation * The name for a Roman road, e.g., ''Via Appia'' * VIA was the ICAO airline designator for Venezuelan airline Viasa (1960-1977) * VIA ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Low-voltage Differential Signaling
Low-voltage differential signaling (LVDS), also known as TIA/EIA-644, is a technical standard that specifies electrical characteristics of a differential, serial signaling standard. LVDS operates at low power and can run at very high speeds using inexpensive twisted-pair copper cables. LVDS is a physical layer specification only; many data communication standards and applications use it and add a data link layer as defined in the OSI model on top of it. LVDS was introduced in 1994, and has become popular in products such as LCD-TVs, in-car entertainment systems, industrial cameras and machine vision, notebook and tablet computers, and communications systems. The typical applications are high-speed video, graphics, video camera data transfers, and general purpose computer buses. Early on, the notebook computer and LCD display vendors commonly used the term LVDS instead of FPD-Link when referring to their protocol, and the term ''LVDS'' has mistakenly become synonymous with ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Serial Peripheral Interface
The Serial Peripheral Interface (SPI) is a synchronous serial communication interface specification used for short-distance communication, primarily in embedded systems. The interface was developed by Motorola in the mid-1980s and has become a ''de facto'' standard. Typical applications include Secure Digital cards and liquid crystal displays. SPI devices communicate in full duplex mode using a master-slave architecture usually with a single master (though some Atmel and Silabs devices support changing roles on the fly depending on an external (SS) pin). The master (controller) device originates the frame for reading and writing. Multiple slave-devices may be supported through selection with individual chip select (CS), sometimes called slave select (SS) lines. Sometimes SPI is called a ''four-wire'' serial bus, contrasting with three-, two-, and one-wire serial buses. The SPI may be accurately described as a synchronous serial interface, but it is different from the Sync ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
CAN Bus
A Controller Area Network (CAN bus) is a robust vehicle bus standard designed to allow microcontrollers and devices to communicate with each other's applications without a host computer. It is a message-based protocol, designed originally for multiplex electrical wiring within automobiles to save on copper, but it can also be used in many other contexts. For each device, the data in a frame is transmitted serially but in such a way that if more than one device transmits at the same time, the highest priority device can continue while the others back off. Frames are received by all devices, including by the transmitting device. History Development of the CAN bus started in 1983 at Robert Bosch GmbH. The protocol was officially released in 1986 at the Society of Automotive Engineers (SAE) conference in Detroit, Michigan. The first CAN controller chips were introduced by Intel in 1987, and shortly thereafter by Philips. Released in 1991, the Mercedes-Benz W140 was the first produ ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Low Pin Count
The Low Pin Count (LPC) bus is a computer bus used on IBM-compatible personal computers to connect low-bandwidth devices to the CPU, such as the BIOS ROM (BIOS ROM was moved to the Serial Peripheral Interface (SPI) bus in 2006), "legacy" I/O devices (integrated into Super I/O, Embedded Controller or IPMI chip), and Trusted Platform Module (TPM). "Legacy" I/O devices usually include serial and parallel ports, PS/2 keyboard, PS/2 mouse, and floppy disk controller. Most PC motherboards with an LPC bus have either a Platform Controller Hub (PCH) or a southbridge chip, which acts as the host and controls the LPC bus. All other devices connected to the physical wires of the LPC bus are peripherals. Overview The LPC bus was introduced by Intel in 1998 as a software-compatible substitute for the Industry Standard Architecture (ISA) bus. It resembles ISA to software, although physically it is quite different. The ISA bus has a 16-bit data bus and a 24-bit address bus that can ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
I²C
I2C (Inter-Integrated Circuit, ), alternatively known as I2C or IIC, is a synchronous, multi-controller/multi-target (master/slave), packet switched, single-ended, serial communication bus invented in 1982 by Philips Semiconductors. It is widely used for attaching lower-speed peripheral ICs to processors and microcontrollers in short-distance, intra-board communication. Several competitors, such as Siemens, NEC, Texas Instruments, STMicroelectronics, Motorola, Nordic Semiconductor and Intersil, have introduced compatible I2C products to the market since the mid-1990s. System Management Bus (SMBus), defined by Intel in 1995, is a subset of I2C, defining a stricter usage. One purpose of SMBus is to promote robustness and interoperability. Accordingly, modern I2C systems incorporate some policies and rules from SMBus, sometimes supporting both I2C and SMBus, requiring only minimal reconfiguration either by commanding or output pin use. Applications I2C is appropriate f ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Intel High Definition Audio
Intel High Definition Audio (IHDA) (also called HD Audio or development codename Azalia) is a specification for the audio sub-system of personal computers. It was released by Intel in 2004 as the successor to their AC'97 PC audio standard. Features The Intel High Definition Audio specification includes the following features: * Up to 15 input and 15 output streams * Up to 16 PCM audio channels per stream * Sample resolutions of 8–32 bits * Sample rates of 6–192 kHz * Support for audio codecs (e.g., ADC, DAC), modem codecs, and vendor-defined codecs * Discoverable codec architecture * Fine-grained codec power-control * Audio jack detection, sensing, and retasking Motherboards typically do not have any more than eight built-in output channels (7.1 surround sound) and four input channels (back and front panel microphone inputs, and a back-panel stereo line-in). Users requiring more audio I/Os will typically opt for a sound card or an external audio interface, as these ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
DisplayPort
DisplayPort (DP) is a digital display interface developed by a consortium of PC and chip manufacturers and standardized by the Video Electronics Standards Association (VESA). It is primarily used to connect a video source to a display device such as a computer monitor. It can also carry audio, USB, and other forms of data. DisplayPort was designed to replace VGA, FPD-Link, and Digital Visual Interface (DVI). It is backward compatible with other interfaces, such as HDMI and DVI, through the use of either active or passive adapters. It is the first display interface to rely on packetized data transmission, a form of digital communication found in technologies such as Ethernet, USB, and PCI Express. It permits the use of internal and external display connections. Unlike legacy standards that transmit a clock signal with each output, its protocol is based on small data packets known as ''micro packets'', which can embed the clock signal in the data stream, allowing higher resoluti ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
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