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Multi-Chip Module
A multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it can be treated as if it were a larger IC. Other terms for MCM packaging include "heterogeneous integration" or "hybrid integrated circuit". The advantage of using MCM packaging is it allows a manufacturer to use multiple components for modularity and/or to improve yields over a conventional monolithic IC approach. Overview Multi-chip modules come in a variety of forms depending on the complexity and development philosophies of their designers. These can range from using pre-packaged ICs on a small printed circuit board (PCB) meant to mimic the package footprint of an existing chip package to fully custom chip packages integrating many chip dies on a high density interconnectio ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Network On A Chip
A network on a chip or network-on-chip (NoC or )This article uses the convention that "NoC" is pronounced . Therefore, it uses the convention "a" for the indefinite article corresponding to NoC ("a NoC"). Other sources may pronounce it as and therefore use "an NoC". is a network-based communications subsystem on an integrated circuit (" microchip"), most typically between modules in a system on a chip ( SoC). The modules on the IC are typically semiconductor IP cores schematizing various functions of the computer system, and are designed to be modular in the sense of network science. The network on chip is a router-based packet switching network between SoC modules. NoC technology applies the theory and methods of computer networking to on-chip communication and brings notable improvements over conventional bus and crossbar communication architectures. Networks-on-chip come in many network topologies, many of which are still experimental as of 2018. In 2000s r ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Sony
, commonly stylized as SONY, is a Japanese multinational conglomerate corporation headquartered in Minato, Tokyo, Japan. As a major technology company, it operates as one of the world's largest manufacturers of consumer and professional electronic products, the largest video game console company and the largest video game publisher. Through Sony Entertainment Inc, it is one of the largest music companies (largest music publisher and second largest record label) and the third largest film studio, making it one of the most comprehensive media companies. It is the largest technology and media conglomerate in Japan. It is also recognized as the most cash-rich Japanese company, with net cash reserves of ¥2 trillion. Sony, with its 55 percent market share in the image sensor market, is the largest manufacturer of image sensors, the second largest camera manufacturer, and is among the semiconductor sales leaders. It is the world's largest player in the premium TV marke ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
SD Card
Secure Digital, officially abbreviated as SD, is a proprietary non-volatile flash memory card format developed by the SD Association (SDA) for use in portable devices. The standard was introduced in August 1999 by joint efforts between SanDisk, Panasonic (Matsushita) and Toshiba as an improvement over MultiMediaCards (MMCs), and has become the industry standard. The three companies formed SD-3C, LLC, a company that licenses and enforces intellectual property rights associated with SD memory cards and SD host and ancillary products. The companies also formed the SD Association (SDA), a non-profit organization, in January 2000 to promote and create SD Card standards. SDA today has about 1,000 member companies. The SDA uses several trademarked logos owned and licensed by SD-3C to enforce compliance with its specifications and assure users of compatibility. History 1999–2003: Creation In 1999, SanDisk, Panasonic (Matsushita), and Toshiba agreed to develop and market the S ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Crystalwell
Intel Graphics Technology (GT) is the collective name for a series of integrated graphics processors (IGPs) produced by Intel that are manufactured on the same package or die as the central processing unit (CPU). It was first introduced in 2010 as Intel HD Graphics and renamed in 2017 as Intel UHD Graphics. Intel Iris Graphics and Intel Iris Pro Graphics are the IGP series introduced in 2013 with some models of Haswell processors as the high-performance versions of HD Graphics. Iris Pro Graphics was the first in the series to incorporate embedded DRAM. Since 2016 Intel refers to the technology as Intel Iris Plus Graphics with the release of Kaby Lake. In the fourth quarter of 2013, Intel integrated graphics represented, in units, 65% of all PC graphics processor shipments. However, this percentage does not represent actual adoption as a number of these shipped units end up in systems with discrete graphics cards. History Before the introduction of Intel HD Graphics, Inte ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Kaby Lake-G
Kaby Lake is Intel's codename for its seventh generation Core microprocessor family announced on August 30, 2016. Like the preceding Skylake, Kaby Lake is produced using a 14 nanometer manufacturing process technology. Breaking with Intel's previous " tick–tock" manufacturing and design model, Kaby Lake represents the optimized step of the newer process–architecture–optimization model. Kaby Lake began shipping to manufacturers and OEMs in the second quarter of 2016, and mobile chips have started shipping while Kaby Lake (desktop) chips were officially launched in January 2017. In August 2017, Intel announced Kaby Lake Refresh ( Kaby Lake R) marketed as the 8th generation mobile CPUs, breaking the long cycle where architectures matched the corresponding generations of CPUs. Skylake was anticipated to be succeeded by the 10 nanometer Cannon Lake, but it was announced in July 2015 that Cannon Lake had been delayed until the second half of 2017. In the meantime, Intel re ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Arrandale
Arrandale is the code name for a family of mobile Intel processors, sold as mobile Intel Core i3, i5 and i7 as well as Celeron and Pentium. It is closely related to the desktop Clarkdale processor; both use dual-core dies based on the '' Westmere'' 32 nm die shrink of the Nehalem microarchitecture, and have integrated Graphics as well as PCI Express and DMI links. Arrandale is the successor of the 45 nm Core-microarchitecture-based Penryn processor that is used in many of the mobile Intel Core 2, Celeron and Pentium Dual-Core processors. While Penryn typically used both a north bridge and a south bridge, Arrandale already contains the major northbridge components, which are the memory controller, PCI Express bus for external graphics, integrated graphics, and the DMI interface, making it possible to build more compact systems. The Arrandale processor package contains two dies: the 32 nm processor die with the I/O connections, and the 45 nm Intel HD G ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Clarkdale (microprocessor)
Clarkdale is the codename for Intel's first-generation Core i5, i3 and Pentium dual-core desktop processors. It is closely related to the mobile Arrandale processor; both use dual-core dies based on the 32 nm Westmere microarchitecture and have integrated Graphics, PCI Express and DMI links built-in. Clarkdale is the successor of the Wolfdale used in desktop Intel Core 2, Celeron and Pentium Dual-Core processors. Unlike its predecessor, Clarkdale already contains the major north bridge components, such as memory controller, PCI Express for external graphics, integrated graphics and the DMI connector, making it possible to build more compact systems without a separate north bridge or discrete graphics like Lynnfield. The Clarkdale processor package contains two dies: the 32 nm processor die with the I/O connections, and the 45 nm graphics and integrated memory controller die. Physical separation of the processor die and memory controller die resulted in increased me ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Xeon
Xeon ( ) is a brand of x86 microprocessors designed, manufactured, and marketed by Intel, targeted at the non-consumer workstation, server, and embedded system markets. It was introduced in June 1998. Xeon processors are based on the same architecture as regular desktop-grade CPUs, but have advanced features such as support for ECC memory, higher core counts, more PCI Express lanes, support for larger amounts of RAM, larger cache memory and extra provision for enterprise-grade reliability, availability and serviceability (RAS) features responsible for handling hardware exceptions through the Machine Check Architecture. They are often capable of safely continuing execution where a normal processor cannot due to these extra RAS features, depending on the type and severity of the machine-check exception (MCE). Some also support multi-socket systems with two, four, or eight sockets through use of the Ultra Path Interconnect (UPI) bus. Overview The ''Xeon'' brand has been m ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Pentium D
Pentium D is a range of desktop 64-bit x86-64 processors based on the NetBurst microarchitecture, which is the dual-core variant of the Pentium 4 manufactured by Intel. Each CPU comprised two dies, each containing a single core, residing next to each other on a multi-chip module package. The brand's first processor, codenamed ''Smithfield'' and manufactured on the 90 nm process, was released on May 25, 2005, followed by the 65 nm ''Presler'' nine months later. By 2004, the NetBurst processors reached a clock speed barrier at 3.8 GHz due to a thermal (and power) limit exemplified by the ''Presler's'' 130 watt thermal design power (a higher TDP requires additional cooling that can be prohibitively noisy or expensive). The future belonged to more energy efficient and slower clocked dual-core CPUs on a single die instead of two. However, the Pentium D did not offer significant upgrades in design, still resulting in relatively high power consumption. The final shipment date of ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Pentium II OverDrive
The Pentium OverDrive was a microprocessor marketing brand name used by Intel, to cover a variety of consumer upgrade products sold in the mid-1990s. It was originally released for 486 motherboards, and later some Pentium sockets. Intel dropped the brand, as it failed to appeal to corporate buyers, and discouraged new system sales. 486 sockets The Pentium OverDrive is a heavily modified, 3.3 volt Pentium P54 core manufactured on 0.6 micrometer technology. It is fitted with a 486-compatible bus unit (though with an increased pin-count), an integrated heatsink and fan, and 32 kB of level 1 cache, double the 16 kB offered on regular P54C chips. As the data bus was effectively reduced to 32-bit width, per-clock performance was much lower than that of a 'regular' Pentium, though still substantially faster compared to a similarly clocked 486 owing to the Pentium's architectural improvements, such as the much improved FPU. It was also equipped with an integrated 3.3 volt power regulato ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Pentium Pro
The Pentium Pro is a sixth-generation x86 microprocessor developed and manufactured by Intel and introduced on November 1, 1995. It introduced the P6 microarchitecture (sometimes termed i686) and was originally intended to replace the original Pentium in a full range of applications. While the Pentium and Pentium MMX had 3.1 and 4.5 million transistors, respectively, the Pentium Pro contained 5.5 million transistors. Later, it was reduced to a more narrow role as a server and high-end desktop processor and was used in supercomputers like ASCI Red, the first computer to reach the trillion ''floating point operations per second'' (teraFLOPS) performance mark. The Pentium Pro was capable of both dual- and quad-processor configurations. It only came in one form factor, the relatively large rectangular Socket 8. The Pentium Pro was succeeded by the Pentium II Xeon in 1998. Microarchitecture The lead architect of Pentium Pro was Fred Pollack who was specialized in sup ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
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