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Low-κ Dielectric
In semiconductor manufacturing, a low-κ is a material with a small relative dielectric constant (κ, kappa) relative to silicon dioxide. Low-κ dielectric material implementation is one of several strategies used to allow continued scaling of microelectronic devices, colloquially referred to as extending Moore's law. In digital circuits, insulating dielectrics separate the conducting parts (wire interconnects and transistors) from one another. As components have scaled and transistors have gotten closer together, the insulating dielectrics have thinned to the point where charge build up and crosstalk adversely affect the performance of the device. Replacing the silicon dioxide with a low-κ dielectric of the same thickness reduces parasitic capacitance, enabling faster switching speeds (in case of synchronous circuits) and lower heat dissipation. In conversation such materials may be referred to as "low-k" (spoken "low-kay") rather than "low-κ" (low-kappa). Low-κ materials ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Semiconductor
A semiconductor is a material with electrical conductivity between that of a conductor and an insulator. Its conductivity can be modified by adding impurities (" doping") to its crystal structure. When two regions with different doping levels are present in the same crystal, they form a semiconductor junction. The behavior of charge carriers, which include electrons, ions, and electron holes, at these junctions is the basis of diodes, transistors, and most modern electronics. Some examples of semiconductors are silicon, germanium, gallium arsenide, and elements near the so-called " metalloid staircase" on the periodic table. After silicon, gallium arsenide is the second-most common semiconductor and is used in laser diodes, solar cells, microwave-frequency integrated circuits, and others. Silicon is a critical element for fabricating most electronic circuits. Semiconductor devices can display a range of different useful properties, such as passing current more easil ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Permittivity
In electromagnetism, the absolute permittivity, often simply called permittivity and denoted by the Greek letter (epsilon), is a measure of the electric polarizability of a dielectric material. A material with high permittivity polarizes more in response to an applied electric field than a material with low permittivity, thereby storing more energy in the material. In electrostatics, the permittivity plays an important role in determining the capacitance of a capacitor. In the simplest case, the electric displacement field resulting from an applied electric field E is \mathbf = \varepsilon\ \mathbf ~. More generally, the permittivity is a thermodynamic State function, function of state. It can depend on the Dispersion (optics), frequency, Nonlinear optics, magnitude, and Anisotropy, direction of the applied field. The International System of Units, SI unit for permittivity is farad per meter (F/m). The permittivity is often represented by the relative permittivity which is ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Benzocyclobutene
Benzocyclobutene (BCB) is a benzene ring fused to a cyclobutane ring. It has chemical formula . BCB is frequently used to create photosensitive polymers. BCB-based polymer dielectrics may be spun on or applied to various substrates for use in Micro Electro-Mechanical Systems (MEMS) and microelectronics processing. Applications include wafer bonding, optical interconnects, low-κ dielectrics, or even intracortical neural implants. Reactions Benzocyclobutene is a strained system which, upon heating to approximately 180 °C, causes the cyclobutene to undergo a conrotatory ring-opening reaction, forming ''o''-xylylene. Since this process destroys the aromaticity of the benzene ring, the reverse reaction is highly favored. ''o''-Xylylenes generated in this way have been used prolifically in cycloaddition reactions, which restore the aromaticity to the benzene ring, while forming a new annulated species. Uses The benzocyclobutene moiety has also appeared in a number of chemi ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Polyimide
Polyimide (sometimes abbreviated PI) is a monomer containing imide groups belonging to the class of high-performance plastics. With their high heat-resistance, polyimides enjoy diverse applications in roles demanding rugged organic materials, such as high temperature fuel cells, displays, and various military roles. A classic polyimide is Kapton, which is produced by condensation of pyromellitic dianhydride and 4,4'-oxydianiline.Wright, Walter W. and Hallden-Abberton, Michael (2002) "Polyimides" in ''Ullmann's Encyclopedia of Industrial Chemistry'', Wiley-VCH, Weinheim. History The first polyimide was discovered in 1908 by Bogart and Renshaw. They found that 4-amino phthalic anhydride does not melt when heated but does release water upon the formation of a high molecular weight polyimide. The first semialiphatic polyimide was prepared by Edward and Robinson by melt fusion of diamines and tetra acids or diamines and diacids/diester. However, the first polyimide of significant co ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Coefficient Of Thermal Expansion
Thermal expansion is the tendency of matter to increase in length, area, or volume, changing its size and density, in response to an increase in temperature (usually excluding phase transitions). Substances usually contract with decreasing temperature (thermal contraction), with rare exceptions within limited temperature ranges ('' negative thermal expansion''). Temperature is a monotonic function of the average molecular kinetic energy of a substance. As energy in particles increases, they start moving faster and faster, weakening the intermolecular forces between them and therefore expanding the substance. When a substance is heated, molecules begin to vibrate and move more, usually creating more distance between themselves. The relative expansion (also called strain) divided by the change in temperature is called the material's coefficient of linear thermal expansion and generally varies with temperature. Prediction If an equation of state is available, it can be used t ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Photoresist
A photoresist (also known simply as a resist) is a light-sensitive material used in several processes, such as photolithography and photoengraving, to form a patterned coating on a surface. This process is crucial in the electronics industry. The process begins by coating a substrate with a light-sensitive organic material. A patterned mask is then applied to the surface to block light, so that only unmasked regions of the material will be exposed to light. A solvent, called a developer, is then applied to the surface. In the case of a positive photoresist, the photo-sensitive material is degraded by light and the developer will dissolve away the regions that were exposed to light, leaving behind a coating where the mask was placed. In the case of a negative photoresist, the photosensitive material is strengthened (either polymerized or cross-linked) by light, and the developer will dissolve away only the regions that were not exposed to light, leaving behind a coating in areas w ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
45 Nanometer
Per the International Technology Roadmap for Semiconductors, the 45 nm process is a MOSFET technology node referring to the average half-pitch of a memory cell manufactured at around the 2007–2008 time frame. Matsushita and Intel started mass-producing 45 nm chips in late 2007, and AMD started production of 45 nm chips in late 2008, while IBM, Infineon, Samsung, and Chartered Semiconductor have already completed a common 45 nm process platform. At the end of 2008, SMIC was the first China-based semiconductor company to move to 45 nm, having licensed the bulk 45 nm process from IBM. In 2008, TSMC moved on to a 40nm process. Many critical feature sizes are smaller than the wavelength of light used for lithography (i.e., 193 nm and 248 nm). A variety of techniques, such as larger lenses, are used to make sub-wavelength features. Double patterning has also been introduced to assist in shrinking distances between features, especially if dry li ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Annealing (metallurgy)
In metallurgy and materials science, annealing is a heat treatment that alters the physical and sometimes chemical properties of a material to increase its ductility and reduce its hardness, making it more workable. It involves heating a material above its recrystallization temperature, maintaining a suitable temperature for an appropriate amount of time and then cooling. In annealing, atoms migrate in the crystal lattice and the number of dislocations decreases, leading to a change in ductility and hardness. As the material cools it recrystallizes. For many alloys, including carbon steel, the crystal grain size and phase composition, which ultimately determine the material properties, are dependent on the heating rate and cooling rate. Hot working or cold working after the annealing process alters the metal structure, so further heat treatments may be used to achieve the properties required. With knowledge of the composition and phase diagram, heat treatment can be used t ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
UV Curing
UV curing (ultraviolet curing) is the process by which ultraviolet light initiates a photochemical reaction that generates a crosslinked network of polymers through radical polymerization or cationic polymerization. UV curing is adaptable to inkjet printing, printing, coating, decorating, stereolithography, and in the assembly of a variety of products and materials. UV curing is a low-temperature, high speed, and solventless process as curing occurs via polymerization. Originally introduced in the 1960s, this technology has streamlined and increased automation in many industries in the manufacturing sector. Applications UV curing is used for converting or curing Ink, inks, Adhesive, adhesives, and Coating, coatings. UV-cured adhesive has become a high speed replacement for two-part adhesives, eliminating the need for solvent removal, ratio mixing, and potential life concern. It is used in flexography, flexographic, offset printing, offset, pad printing, pad, and screen printin ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Hybrid Material
Hybrid materials are Composite material, composites consisting of two constituents at the nanometer or molecule, molecular level. Commonly one of these compounds is inorganic and the other one Organic compound, organic in nature. Thus, they differ from traditional composites where the constituents are at the macroscopic (micrometre, micrometer to millimeter) level. Mixing at the microscopic scale leads to a more homogeneous material that either show characteristics in between the two original Phase (matter), phases or even new properties. Introduction Hybrid materials in nature Many natural materials consist of inorganic and organic building blocks distributed on the nanoscale. In most cases the inorganic part provides mechanical strength and an overall structure to the natural objects while the organic part delivers bonding between the inorganic building blocks and/or the rest of the tissue (biology), tissue. Typical examples include bone and nacre. Development of hybrid mater ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
90 Nanometer
The 90 nm process refers to the technology used in semiconductor manufacturing to create integrated circuits with a minimum feature size of 90 nanometers. It was an advancement over the previous 130 nm process. Eventually, it was succeeded by smaller process nodes, such as the 65 nm, 45 nm, and 32 nm processes. It was commercialized by the 2003–2005 timeframe, by semiconductor companies including Toshiba, Sony, Samsung, IBM, Intel, Fujitsu, TSMC, Elpida, AMD, Infineon, Texas Instruments and Micron Technology. The origin of the 90 nm value is historical; it reflects a trend of 70% scaling every 2–3 years. The naming is formally determined by the International Technology Roadmap for Semiconductors (ITRS). The 300 mm wafer size became mainstream at the 90 nm node. The previous wafer size was 200 mm diameter. The 193 nm wavelength was introduced by many (but not all) companies for lithography of critical layers mainly during the 90 nm nod ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
