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List Of Intel Xeon Processors (Yonah-based)
Xeon DP, Dual Core " Sossaman" (65 nm) * Based on Enhanced Pentium M microarchitecture * All models support: '' MMX, SSE, SSE2, SSE3, Demand Based Switching (Intel's Server EIST), XD bit (an NX bit implementation), Intel VT-x x86 virtualization is the use of hardware-assisted virtualization capabilities on an x86/x86-64 CPU. In the late 1990s x86 virtualization was achieved by complex software techniques, necessary to compensate for the processor's lack of hardware-a ...'' * All models support dual-processor configurations * Die size: 90.3 mm² * Steppings: C0, D0 Sources * * {{Cite web, url=https://m.hexus.net/tech/news/cpu/4604-intel-yonah-hidden-features-exposed/, title=Intel Yonah hidden features exposed, website=HEXUS.net Intel Xeon (Pentium M) ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Sossaman (microprocessor)
Xeon ( ) is a brand of x86 microprocessors designed, manufactured, and marketed by Intel, targeted at the non-consumer workstation, server, and embedded system markets. It was introduced in June 1998. Xeon processors are based on the same architecture as regular desktop-grade CPUs, but have advanced features such as support for ECC memory, higher core counts, more PCI Express lanes, support for larger amounts of RAM, larger cache memory and extra provision for enterprise-grade reliability, availability and serviceability (RAS) features responsible for handling hardware exceptions through the Machine Check Architecture. They are often capable of safely continuing execution where a normal processor cannot due to these extra RAS features, depending on the type and severity of the machine-check exception (MCE). Some also support multi-socket systems with two, four, or eight sockets through use of the Ultra Path Interconnect (UPI) bus. Overview The ''Xeon'' brand has been maint ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Die (integrated Circuit)
A die, in the context of integrated circuits, is a small block of semiconducting material on which a given functional circuit is fabricated. Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon (EGS) or other semiconductor (such as GaAs) through processes such as photolithography. The wafer is cut ( diced) into many pieces, each containing one copy of the circuit. Each of these pieces is called a die. There are three commonly used plural forms: ''dice'', ''dies'' and ''die''. To simplify handling and integration onto a printed circuit board, most dies are packaged in various forms. Manufacturing process Most dies are composed of silicon and used for integrated circuits. The process begins with the production of monocrystalline silicon ingots. These ingots are then sliced into disks with a diameter of up to 300 mm. [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
CPU Socket
In computer hardware, a CPU socket or CPU slot contains one or more mechanical components providing mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows for placing and replacing the central processing unit (CPU) without soldering. Common sockets have retention clips that apply a constant force, which must be overcome when a device is inserted. For chips with many pins, zero insertion force (ZIF) sockets are preferred. Common sockets include Pin Grid Array (PGA) or Land Grid Array (LGA). These designs apply a compression force once either a handle (PGA type) or a surface plate (LGA type) is put into place. This provides superior mechanical retention while avoiding the risk of bending pins when inserting the chip into the socket. Certain devices use Ball Grid Array (BGA) sockets, although these require soldering and are generally not considered user replaceable. CPU sockets are used on the motherboard in desktop and ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Thermal Design Power
The thermal design power (TDP), sometimes called thermal design point, is the maximum amount of heat generated by a computer chip or component (often a CPU, GPU or system on a chip) that the cooling system in a computer is designed to dissipate under any workload. Some sources state that the peak power rating for a microprocessor is usually 1.5 times the TDP rating. Intel has introduced a new metric called ''scenario design power'' (SDP) for some Ivy Bridge Y-series processors. Calculation The ''average CPU power'' (ACP) is the power consumption of central processing units, especially server processors, under "average" daily usage as defined by Advanced Micro Devices (AMD) for use in its line of processors based on the K10 microarchitecture ( Opteron 8300 and 2300 series processors). Intel's thermal design power (TDP), used for Pentium and Core 2 processors, measures the energy consumption under high workload; it is numerically somewhat higher than the "average" AC ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
CPU Core Voltage
The CPU core voltage (''VCORE'') is the power supply voltage supplied to the CPU (which is a digital circuit), GPU, or other device containing a processing core. The amount of power a CPU uses, and thus the amount of heat it dissipates, is the product of this voltage and the current it draws. In modern CPUs, which are CMOS circuits, the current is almost proportional to the clock speed, the CPU drawing almost no current between clock cycles. (See, however, subthreshold leakage.) Power saving and clock speed To conserve power and manage heat, many laptop and desktop processors have a power management feature that software (usually the operating system) can use to adjust the clock speed and core voltage dynamically. Often a voltage regulator module converts from 5V or 12 V or some other voltage to whatever CPU core voltage is required by the CPU. The trend is towards lower core voltages, which conserve power. This presents the CMOS designer with a challenge, because ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
CPU Multiplier
In computing, the clock multiplier (or CPU multiplier or bus/core ratio) sets the ratio of an internal CPU clock rate to the externally supplied clock. A CPU with a 10x multiplier will thus see 10 internal cycles (produced by PLL-based frequency multiplier circuitry) for every external clock cycle. For example, a system with an external clock of 100 MHz and a 36x clock multiplier will have an internal CPU clock of 3.6 GHz. The external address and data buses of the CPU (often collectively termed front side bus (FSB) in PC contexts) also use the external clock as a fundamental timing base; however, they could also employ a (small) multiple of this base frequency (typically two or four) to transfer data faster. The internal frequency of microprocessors is usually based on FSB frequency. To calculate internal frequency the CPU multiplies bus frequency by a number called the clock multiplier. For calculation, the CPU uses actual bus frequency, and not effective bus frequ ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Front-side Bus
A front-side bus (FSB) is a computer communication interface (bus) that was often used in Intel-chip-based computers during the 1990s and 2000s. The EV6 bus served the same function for competing AMD CPUs. Both typically carry data between the central processing unit (CPU) and a memory controller hub, known as the northbridge. Depending on the implementation, some computers may also have a back-side bus that connects the CPU to the cache. This bus and the cache connected to it are faster than accessing the system memory (or RAM) via the front-side bus. The speed of the front side bus is often used as an important measure of the performance of a computer. The original front-side bus architecture has been replaced by HyperTransport, Intel QuickPath Interconnect or Direct Media Interface in modern volume CPUs. History The term came into use by Intel Corporation about the time the Pentium Pro and Pentium II products were announced, in the 1990s. "Front side" refers to the e ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
CPU Cache
A CPU cache is a hardware cache used by the central processing unit (CPU) of a computer to reduce the average cost (time or energy) to access data from the main memory. A cache is a smaller, faster memory, located closer to a processor core, which stores copies of the data from frequently used main memory locations. Most CPUs have a hierarchy of multiple cache levels (L1, L2, often L3, and rarely even L4), with different instruction-specific and data-specific caches at level 1. The cache memory is typically implemented with static random-access memory (SRAM), in modern CPUs by far the largest part of them by chip area, but SRAM is not always used for all levels (of I- or D-cache), or even any level, sometimes some latter or all levels are implemented with eDRAM. Other types of caches exist (that are not counted towards the "cache size" of the most important caches mentioned above), such as the translation lookaside buffer (TLB) which is part of the memory management unit ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Stepping Level
In integrated circuits, the stepping level or revision level is a version number that refers to the introduction or revision of one or more photolithographic photomasks within the set of photomasks that is used to pattern an integrated circuit. The term originated from the name of the equipment ( "steppers") that exposes the photoresist to light. Integrated circuits have two primary classes of mask sets: firstly, "base" layers that are used to build the structures, such as transistors, that comprise circuit logic and, secondly, "metal" layers that connect the circuit logic. Typically, when an integrated circuit manufacturer such as Intel or AMD produces a new stepping (i.e. a revision to the masks), it is because it has found bugs in the logic, has made improvements to the design that permit faster processing, has found a way to increase yield or improve the "bin splits" (i.e. create faster transistors and thus faster CPUs), has improved maneuverability to more easily identify m ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Intel VT-x
x86 virtualization is the use of hardware-assisted virtualization capabilities on an x86/x86-64 CPU. In the late 1990s x86 virtualization was achieved by complex software techniques, necessary to compensate for the processor's lack of hardware-assisted virtualization capabilities while attaining reasonable performance. In 2005 and 2006, both Intel ( VT-x) and AMD (AMD-V) introduced limited hardware virtualization support that allowed simpler virtualization software but offered very few speed benefits. Greater hardware support, which allowed substantial speed improvements, came with later processor models. Software-based virtualization The following discussion focuses only on virtualization of the x86 architecture protected mode. In protected mode the operating system kernel runs at a higher privilege such as ring 0, and applications at a lower privilege such as ring 3. In software-based virtualization, a host OS has direct access to hardware while the guest OSs have limited ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Enhanced Pentium M (microarchitecture)
The P6 microarchitecture is the sixth-generation Intel x86 microarchitecture, implemented by the Pentium Pro microprocessor that was introduced in November 1995. It is frequently referred to as i686. It was succeeded by the NetBurst microarchitecture in 2000, but eventually revived in the Pentium M line of microprocessors. The successor to the Pentium M variant of the P6 microarchitecture is the Core microarchitecture which in turn is also derived from P6. P6 was used within Intel's mainstream offerings from the Pentium Pro to Pentium III, and was widely known for low power consumption, excellent integer performance, and relatively high instructions per cycle (IPC). The P6 line of processing cores was succeeded by the NetBurst (P68) architecture which appeared with the introduction of Pentium 4. The P6 core was the sixth generation Intel microprocessor in the x86 line. The first implementation of the P6 core was the Pentium Pro CPU in 1995, the immediate successor to the or ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
NX Bit
The NX bit (no-execute) is a technology used in CPUs to segregate areas of memory for use by either storage of processor instructions or for storage of data, a feature normally only found in Harvard architecture processors. However, the NX bit is being increasingly used in conventional von Neumann architecture processors for security reasons. An operating system with support for the NX bit may mark certain areas of memory as non-executable. The processor will then refuse to execute any code residing in these areas of memory. The general technique, known as executable space protection, also called Write XOR Execute, is used to prevent certain types of malicious software from taking over computers by inserting their code into another program's data storage area and running their own code from within this section; one class of such attacks is known as the buffer overflow attack. The term NX bit originated with Advanced Micro Devices (AMD), as a marketing term. Intel markets the f ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
