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LGA 1700
LGA 1700 (Socket V) is a zero insertion force flip-chip land grid array (LGA) socket, compatible with Intel Intel Corporation is an American multinational corporation and technology company headquartered in Santa Clara, California, and Delaware General Corporation Law, incorporated in Delaware. Intel designs, manufactures, and sells computer compo ... desktop processors Alder Lake and Raptor Lake, which was first released in November 2021. LGA 1700 is designed as a replacement for LGA 1200 (known as ''Socket H5'') and it has 1700 protruding pins to make contact with the pads on the processor. Compared to its predecessor, it has 500 more pins, which required a major change in socket and processor sizes; it is 7.5 mm longer. It is the first major change in Intel's LGA desktop CPU socket size since the introduction of LGA 775 in 2004, especially for consumer-grade CPU sockets. The larger size also required a change in the heatsink fastening holes configuration ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] [Amazon] |
Intel
Intel Corporation is an American multinational corporation and technology company headquartered in Santa Clara, California, and Delaware General Corporation Law, incorporated in Delaware. Intel designs, manufactures, and sells computer components such as central processing units (CPUs) and related products for business and consumer markets. It is one of the world's List of largest semiconductor chip manufacturers, largest semiconductor chip manufacturers by revenue, and ranked in the Fortune 500, ''Fortune'' 500 list of the List of largest companies in the United States by revenue, largest United States corporations by revenue for nearly a decade, from 2007 to 2016 Fiscal year, fiscal years, until it was removed from the ranking in 2018. In 2020, it was reinstated and ranked 45th, being the List of Fortune 500 computer software and information companies, 7th-largest technology company in the ranking. It was one of the first companies listed on Nasdaq. Intel supplies List of I ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] [Amazon] |
Alder Lake (microprocessor)
Alder Lake is Intel's List of Intel codenames, codename for the 12th generation of Intel Core processors based on a Heterogeneous computing, hybrid architecture utilizing Golden Cove performance cores and Gracemont (microarchitecture), Gracemont efficient cores. It is fabricated using Intel's 7 nm process, Intel 7 process, previously referred to as Intel 10 nm Enhanced SuperFin (10ESF). The 10ESF has a 10%-15% boost in performance over the 10SF used in the mobile Tiger Lake processors. Intel officially announced 12th Gen Intel Core CPUs on October 27, 2021, mobile CPUs and non-K series desktop CPUs on January 4, 2022, Alder Lake-P and -U series on February 23, 2022, and Alder Lake-HX series on May 10, 2022. History It was announced in November 2021 that Intel Alder Lake would use a hybrid architecture combining performance and efficiency cores, similar to ARM big.LITTLE. This was Intel's second hybrid architecture, after the mobile-only Intel Lakefield, Lakefield release ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] [Amazon] |
Platform Controller Hub
The Platform Controller Hub (PCH) is a family of Intel's single-chip chipsets, first introduced in 2009. It is the successor to the Intel Hub Architecture, which used two chipsa northbridge and southbridge, and first appeared in the Intel 5 Series. The PCH controls certain data paths and support functions used in conjunction with Intel CPUs. These include clocking (the system clock), Flexible Display Interface (FDI) and Direct Media Interface (DMI), although FDI is used only when the chipset is required to support a processor with integrated graphics. As such, I/O functions are reassigned between this new central hub and the CPU compared to the previous architecture: some northbridge functions, the memory controller and PCIe lanes, were integrated into the CPU while the PCH took over the remaining functions in addition to the traditional roles of the southbridge. AMD has its equivalent for the PCH, known simply as a chipset since the release of the Zen architecture in 2017. ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] [Amazon] |
SATA
SATA (Serial AT Attachment) is a computer bus interface that connects host bus adapters to mass storage devices such as hard disk drives, optical drives, and solid-state drives. Serial ATA succeeded the earlier Parallel ATA (PATA) standard to become the predominant interface for storage devices. Serial ATA industry compatibility specifications originate from the Serial ATA International Organization (SATA-IO) which are then released by the INCITS Technical Committee T13, AT Attachment (INCITS T13). History SATA was announced in 2000 in order to provide several advantages over the earlier PATA interface such as reduced cable size and cost (seven conductors instead of 40 or 80), native hot swapping, faster data transfer through higher signaling rates, and more efficient transfer through an (optional) I/O queuing protocol. Revision 1.0 of the specification was released in January 2003. Serial ATA industry compatibility specifications originate from the Serial ATA Inte ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] [Amazon] |
USB 3
Universal Serial Bus 3.0 (USB 3.0), marketed as SuperSpeed USB, is the third major version of the Universal Serial Bus (USB) standard for interfacing computers and electronic devices. It was released in November 2008. The USB 3.0 specification defined a new architecture and protocol, named SuperSpeed, which included a new lane for providing full-duplex data transfers that physically required five additional wires and pins, while also adding a new signal coding scheme (8b/10b symbols, 5 Gbit/s; also known later as ''Gen 1''), and preserving the USB 2.0 architecture and protocols and therefore keeping the original four pins and wires for the USB 2.0 backward-compatibility, resulting in nine wires in total and nine or ten pins at connector interfaces (ID-pin is not wired). The new transfer rate, marketed as ''SuperSpeed USB'' (SS), can transfer signals at up to 5 Gbit/s (with raw data rate of 500 MB/s after encoding overhead), which is about 10 times faster than ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] [Amazon] |
DIMM
A DIMM (Dual In-line Memory Module) is a popular type of memory module used in computers. It is a printed circuit board with one or both sides (front and back) holding DRAM chips and pins. The vast majority of DIMMs are manufactured in compliance with JEDEC memory standards, although there are proprietary DIMMs. DIMMs come in a variety of speeds and capacities, and are generally one of two lengths: PC, which are , and laptop (SO-DIMM), which are about half the length at . History DIMMs (Dual In-line Memory Module) were a 1990s upgrade for SIMMs (Single In-line Memory Modules) as Intel P5-based Pentium processors began to gain market share. The Pentium had a 64-bit bus width, which would require SIMMs installed in matched pairs in order to populate the data bus. The processor would then access the two SIMMs in parallel. DIMMs were introduced to eliminate this disadvantage. The contacts on SIMMs on both sides are redundant, while DIMMs have separate electrical contacts o ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] [Amazon] |
Random-access Memory
Random-access memory (RAM; ) is a form of Computer memory, electronic computer memory that can be read and changed in any order, typically used to store working Data (computing), data and machine code. A random-access memory device allows data items to be read (computer), read or written in almost the same amount of time irrespective of the physical location of data inside the memory, in contrast with other direct-access data storage media (such as hard disks and Magnetic tape data storage, magnetic tape), where the time required to read and write data items varies significantly depending on their physical locations on the recording medium, due to mechanical limitations such as media rotation speeds and arm movement. In today's technology, random-access memory takes the form of integrated circuit (IC) chips with MOSFET, MOS (metal–oxide–semiconductor) Memory cell (computing), memory cells. RAM is normally associated with Volatile memory, volatile types of memory where s ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] [Amazon] |
Overclocking
In computing, overclocking is the practice of increasing the clock rate of a computer to exceed that certified by the manufacturer. Commonly, operating voltage is also increased to maintain a component's operational stability at accelerated speeds. Semiconductor devices operated at higher frequencies and voltages increase power consumption and heat. An overclocked device may be unreliable or fail completely if the additional heat load is not removed or power delivery components cannot meet increased power demands. Many device warranties state that overclocking or over-specification voids any warranty, but some manufacturers allow overclocking as long as it is done (relatively) safely. Overview The purpose of overclocking is to increase the operating speed of a given component. Normally, on modern systems, the target of overclocking is increasing the performance of a major chip or subsystem, such as the main processor or graphics controller, but other components, such as sys ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] [Amazon] |
UEFI
Unified Extensible Firmware Interface (UEFI, as an acronym) is a Specification (technical standard), specification for the firmware Software architecture, architecture of a computing platform. When a computer booting, is powered on, the UEFI implementation is typically the first that runs, before starting the operating system. Examples include AMI Aptio, Phoenix Technologies, Phoenix SecureCore, TianoCore EDK II, and InsydeH2O. UEFI replaces the BIOS that was present in the boot ROM of all personal computers that are IBM PC compatible, although it can provide Backward compatibility, backwards compatibility with the BIOS using #CSM booting, CSM booting. Unlike its predecessor, BIOS, which is a de facto standard originally created by IBM as proprietary software, UEFI is an open standard maintained by an industry consortium. Like BIOS, most UEFI implementations are proprietary. Intel developed the original ''Extensible Firmware Interface'' (''EFI'') specification. The last Inte ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] [Amazon] |
Integrated Heat Spreader
A heat spreader transfers energy as heat from a hotter source to a colder heat sink or heat exchanger. There are two thermodynamic types, passive and active. The most common sort of passive heat spreader is a plate or block of material having high thermal conductivity, such as copper, aluminum, or diamond. An active heat spreader speeds up heat transfer with expenditure of energy as work supplied by an external source. A heat pipe uses fluids inside a sealed case. The fluids circulate either passively, by spontaneous convection, triggered when a threshold temperature difference occurs; or actively, because of an impeller driven by an external source of work. Without sealed circulation, energy can be carried by transfer of fluid matter, for example externally supplied colder air, driven by an external source of work, from a hotter body to another external body, though this is not exactly heat transfer as defined in physics. Exemplifying increase of Entropy (energy dispersal), ent ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] [Amazon] |
LGA 1151
LGA 1151, also known as Socket H4, is a type of zero insertion force flip-chip land grid array (LGA) socket for Intel desktop processors which comes in two distinct versions: the first revision which supports both Intel's Skylake and Kaby Lake CPUs, and the second revision which supports Coffee Lake CPUs exclusively. LGA 1151 is designed as a replacement for the LGA 1150 (known as ''Socket H3''). LGA 1151 has 1151 protruding pins to make contact with the pads on the processor. The Fully Integrated Voltage Regulator, i.e. a voltage regulator which integrated on the CPU's die, introduced with Haswell and Broadwell, has again been moved to the motherboard. Most motherboards for the first revision of the socket support solely DDR4 memory, a lesser number support DDR3(L) memory, and the least number have slots for both DDR4 or DDR3(L) but only one memory type can be installed. Some have UniDIMM support, enabling either type of memory to be placed in the same DIMM, rather than ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] [Amazon] |
LGA 1150
LGA 1150, also known as Socket H3, is a zero insertion force flip-chip land grid array (LGA) CPU socket designed by Intel for CPUs built on the Haswell microarchitecture. This socket is also used by the Haswell's successor, Broadwell microarchitecture. It is the successor of LGA 1155 and was itself succeeded by LGA 1151 in 2015. Most motherboards with the LGA 1150 socket support varying video outputs (VGA, DVI or HDMI depending on the model) and Intel Clear Video Technology. Full support of Windows on LGA 1150 platform starts on Windows 7. Official Windows XP support is limited to selected CPUs, chipsets and only for embedded and industrial systems. Intel's Platform Controller Hub (PCH) for the LGA 1150 CPUs is codenamed Lynx Point. Intel Xeon processors for socket LGA 1150 use the Intel C222, C224, and C226 chipsets. Heatsink The 4 holes for fastening the heatsink to the motherboard are placed in a square with a lateral length of 75 ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] [Amazon] |
