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LGA 1200
LGA 1200, also known as Socket H5, is a zero insertion force flip-chip land grid array (LGA) CPU socket, socket, compatible with Intel desktop Central processing unit, processors Comet Lake (10th gen) and Rocket Lake (11th-gen) desktop CPUs, which was released in April 2020. LGA 1200 is designed as a replacement for the LGA 1151 (known as ''Socket H4''). LGA 1200 is a land grid array mount with 1200 protruding pins to make contact with the pads on the processor. It uses a modified design of LGA 1151, with 49 more pins on it, improving power delivery and offering support for future incremental I/O features. Pin 1 position remains the same as it was in previous generation processors, but it has shifted socket keying to left (previously it was right), making Comet Lake processors incompatible both electrically and mechanically with previous chips. ASRock, Asus, Biostar, Gigabyte Technology, Gigabyte and Micro-Star International, MSI have confirmed their motherboards based on the Int ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] [Amazon] |
Intel
Intel Corporation is an American multinational corporation and technology company headquartered in Santa Clara, California, and Delaware General Corporation Law, incorporated in Delaware. Intel designs, manufactures, and sells computer components such as central processing units (CPUs) and related products for business and consumer markets. It is one of the world's List of largest semiconductor chip manufacturers, largest semiconductor chip manufacturers by revenue, and ranked in the Fortune 500, ''Fortune'' 500 list of the List of largest companies in the United States by revenue, largest United States corporations by revenue for nearly a decade, from 2007 to 2016 Fiscal year, fiscal years, until it was removed from the ranking in 2018. In 2020, it was reinstated and ranked 45th, being the List of Fortune 500 computer software and information companies, 7th-largest technology company in the ranking. It was one of the first companies listed on Nasdaq. Intel supplies List of I ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] [Amazon] |
Asus
ASUSTeK Computer Inc. (, , , ; stylized as ASUSTeK or ASUS) is a Taiwanese Multinational corporation, multinational computer, phone hardware and electronics manufacturer headquartered in Beitou District, Taipei, Taiwan. Its products include desktop computers, laptops, netbooks, mobile phones, networking equipment, monitors, wireless router, Wi-Fi routers, projectors, motherboards, graphics cards, optical storage, multimedia products, peripherals, wearables, server (computing), servers, workstations and tablet PCs. The company is also an original equipment manufacturer (OEM). Asus is the Market share of personal computer vendors, world's fifth-largest personal computer vendor by unit sales. Asus has a primary listing on the Taiwan Stock Exchange under the ticker code ''2357'' and formerly had a secondary listing on the London Stock Exchange under the ticker code ''ASKD''. Name The company is usually referred to as ''ASUS'' or ''Huáshuò'' in Chinese language, Chinese ( zh , t = ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] [Amazon] |
SATA
SATA (Serial AT Attachment) is a computer bus interface that connects host bus adapters to mass storage devices such as hard disk drives, optical drives, and solid-state drives. Serial ATA succeeded the earlier Parallel ATA (PATA) standard to become the predominant interface for storage devices. Serial ATA industry compatibility specifications originate from the Serial ATA International Organization (SATA-IO) which are then released by the INCITS Technical Committee T13, AT Attachment (INCITS T13). History SATA was announced in 2000 in order to provide several advantages over the earlier PATA interface such as reduced cable size and cost (seven conductors instead of 40 or 80), native hot swapping, faster data transfer through higher signaling rates, and more efficient transfer through an (optional) I/O queuing protocol. Revision 1.0 of the specification was released in January 2003. Serial ATA industry compatibility specifications originate from the Serial ATA Inte ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] [Amazon] |
USB 3
Universal Serial Bus 3.0 (USB 3.0), marketed as SuperSpeed USB, is the third major version of the Universal Serial Bus (USB) standard for interfacing computers and electronic devices. It was released in November 2008. The USB 3.0 specification defined a new architecture and protocol, named SuperSpeed, which included a new lane for providing full-duplex data transfers that physically required five additional wires and pins, while also adding a new signal coding scheme (8b/10b symbols, 5 Gbit/s; also known later as ''Gen 1''), and preserving the USB 2.0 architecture and protocols and therefore keeping the original four pins and wires for the USB 2.0 backward-compatibility, resulting in nine wires in total and nine or ten pins at connector interfaces (ID-pin is not wired). The new transfer rate, marketed as ''SuperSpeed USB'' (SS), can transfer signals at up to 5 Gbit/s (with raw data rate of 500 MB/s after encoding overhead), which is about 10 times faster than ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] [Amazon] |
DIMM
A DIMM (Dual In-line Memory Module) is a popular type of memory module used in computers. It is a printed circuit board with one or both sides (front and back) holding DRAM chips and pins. The vast majority of DIMMs are manufactured in compliance with JEDEC memory standards, although there are proprietary DIMMs. DIMMs come in a variety of speeds and capacities, and are generally one of two lengths: PC, which are , and laptop (SO-DIMM), which are about half the length at . History DIMMs (Dual In-line Memory Module) were a 1990s upgrade for SIMMs (Single In-line Memory Modules) as Intel P5-based Pentium processors began to gain market share. The Pentium had a 64-bit bus width, which would require SIMMs installed in matched pairs in order to populate the data bus. The processor would then access the two SIMMs in parallel. DIMMs were introduced to eliminate this disadvantage. The contacts on SIMMs on both sides are redundant, while DIMMs have separate electrical contacts o ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] [Amazon] |
Comet Lake
Comet Lake is Intel's codename for its 10th generation Core processors. They are manufactured using Intel's third 14 nm Skylake process revision, succeeding the Whiskey Lake U-series mobile processor and Coffee Lake desktop processor families. Intel announced low-power mobile Comet Lake-U CPUs on August 21, 2019, H-series mobile CPUs on April 2, 2020, desktop Comet Lake-S CPUs April 30, 2020, and Xeon W-1200 series workstation CPUs on May 13, 2020. Comet Lake processors and Ice Lake 10 nm processors are together branded as the Intel "10th Generation Core" family. In March 2021, Intel officially launched Comet Lake-Refresh Core i3 and Pentium CPUs on the same day as the 11th Gen Core Rocket Lake launch. The low-power mobile Comet Lake-U Core and Celeron 5205U CPUs were discontinued on July 7, 2021. Generational changes All Comet Lake CPUs feature an updated Platform Controller Hub with CNVio2 controller with Wi-Fi 6 and external AX201 CRF module support. Comet Lake-S ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] [Amazon] |
Overclocking
In computing, overclocking is the practice of increasing the clock rate of a computer to exceed that certified by the manufacturer. Commonly, operating voltage is also increased to maintain a component's operational stability at accelerated speeds. Semiconductor devices operated at higher frequencies and voltages increase power consumption and heat. An overclocked device may be unreliable or fail completely if the additional heat load is not removed or power delivery components cannot meet increased power demands. Many device warranties state that overclocking or over-specification voids any warranty, but some manufacturers allow overclocking as long as it is done (relatively) safely. Overview The purpose of overclocking is to increase the operating speed of a given component. Normally, on modern systems, the target of overclocking is increasing the performance of a major chip or subsystem, such as the main processor or graphics controller, but other components, such as sys ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] [Amazon] |
LGA 1155
LGA 1155, also called Socket H2, is a zero insertion force flip-chip land grid array (LGA) CPU socket designed by Intel for their CPUs based on the Sandy Bridge (second generation core) and Ivy Bridge (third generation) microarchitectures. Introduced in 2011, it is the successor of LGA 1156 (known as ''Socket H'') and was itself succeeded by LGA 1150 in 2013. Along with selected variations of LGA 2011 socket, it was the last Intel socket to fully support Windows XP, Windows Server 2003, Windows Vista, and Windows Server 2008. LGA 1155 has 1155 protruding pins to make contact with the pads on the processor. The pins are arranged in a 40×40 array with a 24×16 central void and additional 61 omitted pins (two adjoining the central void, six in each of the four corners, and 35 in groups around the perimeter), yielding the 1600 − 384 − 61 = 1155 pin count. Processors for LGA 1155 and LGA 1156 sockets are not compatible with each other since they ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] [Amazon] |
LGA 1156
LGA 1156 (land grid array 1156), also known as Socket H or H1, is an Intel desktop CPU socket. The last processors supporting the LGA 1156 ceased production in 2011. It was succeeded by the mutually incompatible socket LGA 1155. LGA 1156, along with LGA 1366, were designed to replace LGA 775. Whereas LGA 775 processors connect to a northbridge using the Front Side Bus, LGA 1156 processors integrate the features traditionally located on a northbridge within the processor itself. The LGA 1156 socket allows the following connections to be made from the processor to the rest of the system: * PCI-Express 2.0 ×16 for communication with a graphics card. Some processors allow this connection to be divided into two ×8 lanes to connect two graphics cards. Some motherboard manufacturers use Nvidia's NF200 chip to allow even more graphics cards to be used. * DMI for communication with the Platform Controller Hub (PCH). This consists of a PCI-Express 2.0 ×4 connection. * FDI for c ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] [Amazon] |
Intel Core I9-10900K LGA 1200 Pins
Intel Corporation is an American multinational corporation and technology company headquartered in Santa Clara, California, and incorporated in Delaware. Intel designs, manufactures, and sells computer components such as central processing units (CPUs) and related products for business and consumer markets. It is one of the world's largest semiconductor chip manufacturers by revenue, and ranked in the ''Fortune'' 500 list of the largest United States corporations by revenue for nearly a decade, from 2007 to 2016 fiscal years, until it was removed from the ranking in 2018. In 2020, it was reinstated and ranked 45th, being the 7th-largest technology company in the ranking. It was one of the first companies listed on Nasdaq. Intel supplies microprocessors for most manufacturers of computer systems, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). It also manufactures chipsets, network interface controllers, flash mem ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] [Amazon] |
NVMe
NVM Express (NVMe) or Non-Volatile Memory Host Controller Interface Specification (NVMHCIS) is an open, logical-device interface specification for accessing a computer's non-volatile storage media usually attached via the PCI Express bus. The initial ''NVM'' stands for '' non-volatile memory'', which is often NAND flash memory that comes in several physical form factors, including solid-state drives (SSDs), PCIe add-in cards, and M.2 cards, the successor to mSATA cards. NVM Express, as a logical-device interface, has been designed to capitalize on the low latency and internal parallelism of solid-state storage devices. Architecturally, the logic for NVMe is physically stored within and executed by the NVMe controller chip that is physically co-located with the storage media, usually an SSD. Version changes for NVMe, e.g., 1.3 to 1.4, are incorporated within the storage media, and do not affect PCIe-compatible components such as motherboards and CPUs. By its design, NVM Expre ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] [Amazon] |
