Anisotropic

Microfabrication

Anisotropic etching techniques (such as deep reactive-ion etching) are used in microfabrication processes to create well defined microscopic features with a high aspect ratio. These features are commonly used in MEMS (microelectromechanical systems) and microfluidic devices, where the anisotropy of the features is needed to impart desired optical, electrical, or physical properties to the device. Anisotropic etching can also refer to certain chemical etchants used to etch a certain material preferentially over certain crystallographic planes (e.g., KOH etching of silicon [100] produces pyramid-like structures)