Wedge bonding is a kind of
wire bonding
Wire bonding is a method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Wire bonding can also be used to connect an IC to other electronics ...
which relies on the application of
ultrasonic power and
force
In physics, a force is an influence that can cause an Physical object, object to change its velocity unless counterbalanced by other forces. In mechanics, force makes ideas like 'pushing' or 'pulling' mathematically precise. Because the Magnitu ...
to form
bonds. It is a popular method and is commonly used in the
semiconductor industry
The semiconductor industry is the aggregate of companies engaged in the design and fabrication of semiconductors and semiconductor devices, such as transistors and integrated circuits. Its roots can be traced to the invention of the transistor ...
. Wedge bonding is directional, so the bonding head rotates to accommodate the different angles for bonding. Due to this rotation, wedge bonding is slower than ball bonding. The advantage of wedge bonding is a finer pitch is possible. Wedge bonding also accommodates the use of metal ribbon instead of wire for bonding.
* ''Thermocompression Bonding (TCB):'' The technique uses heat and pressure to create a bond between a thin wire (typically aluminum or gold) and the bonding pads. As heat softens the wire, pressure is applied to form the bond.
* ''Ultrasonic Wedge Bonding (UWB):'' Ultrasonic energy is used in conjunction with pressure to create a bond between the wire and the bonding pads. This method is similar to thermos-sonic ball bonding but uses a wedge tool instead of a ball.
* ''Non-Ultrasonic Wedge Bonding:'' In this variation, wedge bonding is created without the use of ultrasonic energy.
References
# An In-depth Look at Wire Bonding Options (pcb-technologies.com). 2024
# Processes > Wire Bonding > Wedge Bonding (palomartechnologies.com). 2024
{{wafer bonding
Semiconductor device fabrication
Packaging (microfabrication)
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