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The Thin Shrink Small Outline Package (TSSOP) is a rectangular
surface mount Surface-mount technology (SMT), originally called planar mounting, is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). An electrical component mounted in this manner is referred ...
plastic integrated circuit (IC) package with gull-wing leads.


Application

They are suited for applications requiring 1 mm or less mounted height and are commonly used in analog and operation amplifiers, controllers and Drivers, Logic, Memory, and RF/Wireless, Disk drives, video/audio and
consumer electronics Consumer electronics or home electronics are Electronics, electronic (Analogue electronics, analog or digital electronics, digital) equipment intended for everyday use, typically in private homes. Consumer electronics include devices used for ...
.


Physical properties

The Thin shrink small outline package has a smaller body and smaller lead pitch than the standard SOIC package. It is also smaller and thinner than a TSOP with the same lead count. Body widths are 3.0 mm, 4.4 mm and 6.1 mm. The lead counts range from 8 to 80 pins. The lead pitches are 0.5 or 0.65 mm.


Exposed Pad

Some TSSOP packages have an exposed pad. This is a rectangular metal pad on the bottom side of the package. The
exposed pad Expose, exposé, or exposed may refer to: News sources * Exposé (journalism), a form of investigative journalism * ''The Exposé'', a British conspiracist website Film and TV Film * ''Exposé'' (film), a 1976 thriller film * ''Exposed'' (1932 ...
will be soldered on the
pcb PCB may refer to: Science and technology * Polychlorinated biphenyl, an organic chlorine compound, now recognized as an environmental toxin and classified as a persistent organic pollutant * Printed circuit board, a board used in electronics * ...
to transfer heat from the package to the pcb. In most applications, the exposed pad is connected to ground.


HTSSOP

The Heat sink thin shrink small outline package (HTSSOP) is
Texas Instruments Texas Instruments Incorporated (TI) is an American technology company headquartered in Dallas, Texas, that designs and manufactures semiconductors and various integrated circuits, which it sells to electronics designers and manufacturers globa ...
name for a TSSOP with an exposed pad on the bottom side. There are some other manufacturers who uses the same name.


See also

*
List of integrated circuit packaging types Integrated circuits are put into protective packages to allow easy handling and assembly onto printed circuit boards and to protect the devices from damage. A very large number of different types of package exist. Some package types have stan ...
*
Small outline integrated circuit A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. They are generall ...


Similar package types

* Shrink Small Outline Package * Mini Small Outline Package *
Small outline integrated circuit A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. They are generall ...


References


External links


Soldering a TSSOP chip by hand
{{Semiconductor packages Semiconductor packages