
In
electronics
Electronics is a scientific and engineering discipline that studies and applies the principles of physics to design, create, and operate devices that manipulate electrons and other Electric charge, electrically charged particles. It is a subfield ...
, potting is the process of filling a complete electronic assembly with a solid or gelatinous compound. This is done to exclude water, moisture, or corrosive agents, to increase resistance to shocks and vibrations, or to prevent gaseous phenomena such as
corona discharge in high-voltage assemblies. Potting has also been used to protect against
reverse engineering
Reverse engineering (also known as backwards engineering or back engineering) is a process or method through which one attempts to understand through deductive reasoning how a previously made device, process, system, or piece of software accompl ...
or to protect parts of cryptography processing cards. When such materials are used only on single components instead of entire assemblies, the process is referred to as encapsulation.
Thermosetting plastics or silicone rubber gels are often used, though
epoxy resins are also very common. When epoxy resins are used, low chloride grades are usually specified.
Many sites recommend using a potting product to protect sensitive electronic components from impact, vibration, and loose wires.
In the potting process, an electronic assembly is placed inside a mold (the "pot") which is then filled with an insulating liquid compound that hardens, permanently protecting the assembly. The mold may be part of the finished article and may provide shielding or heat dissipating functions in addition to acting as a mold. When the mold is removed the potted assembly is described as cast.
As an alternative, many circuit board assembly houses coat assemblies with a layer of transparent
conformal coating rather than potting.
Conformal coating gives most of the benefits of potting, and is lighter and easier to inspect, test, and repair. Conformal coatings can be applied as liquid or condensed from a vapor phase.
When potting a circuit board that uses
surface-mount technology, low
glass transition temperature (T
g) potting compounds such as
polyurethane
Polyurethane (; often abbreviated PUR and PU) is a class of polymers composed of organic chemistry, organic units joined by carbamate (urethane) links. In contrast to other common polymers such as polyethylene and polystyrene, polyurethane term ...
or
silicone
In Organosilicon chemistry, organosilicon and polymer chemistry, a silicone or polysiloxane is a polymer composed of repeating units of siloxane (, where R = Organyl group, organic group). They are typically colorless oils or elastomer, rubber ...
may be used. High T
g potting compounds may break solder bonds through
solder fatigue by hardening at a higher temperature because the coating then shrinks as a rigid solid over a larger part of the temperature range, thus developing greater force.
See also
*
Integrated circuit packaging
*
Resin dispensing
References
Electronic design
Electronics manufacturing
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