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A pin grid array (PGA) is a type of
integrated circuit packaging Integrated circuit packaging is the final stage of fabrication (semiconductor), semiconductor device fabrication, in which the die (integrated circuit), die is encapsulated in a supporting case that prevents physical damage and corrosion. The ...
. In a PGA, the package is square or rectangular, and the pins are arranged in a regular array on the underside of the package. The pins are commonly spaced 2.54 mm (0.1") apart, and may or may not cover the entire underside of the package. PGAs are often mounted on
printed circuit board A printed circuit board (PCB), also called printed wiring board (PWB), is a Lamination, laminated sandwich structure of electrical conduction, conductive and Insulator (electricity), insulating layers, each with a pattern of traces, planes ...
s using the through hole method or inserted into a
socket Socket may refer to: Mechanics * Socket wrench, a type of wrench that uses separate, removable sockets to fit different sizes of nuts and bolts * Socket head screw, a screw (or bolt) with a cylindrical head containing a socket into which the hexag ...
. PGAs allow for more pins per integrated circuit than older packages, such as
dual in-line package In microelectronics, a dual in-line package (DIP or DIL) is an Semiconductor package, electronic component package with a rectangular housing and two parallel rows of electrical connecting pins. The package may be through-hole technology, throu ...
(DIP).


Chip mounting

The chip can be mounted either on the top or the bottom (the pinned side). Connections can be made either by
wire bonding Wire bonding is a method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Wire bonding can also be used to connect an IC to other electronics ...
or through
flip chip Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, is a method for interconnecting dies such as semiconductor devices, IC chips, integrated passive devices and microelectromechanical systems (MEMS), to exter ...
mounting. Typically, PGA packages use wire bonding when the chip is mounted on the pinned side, and flip chip construction when the chip is on the top side. Some PGA packages contain multiple dies, for example
Zen 2 Zen 2 is a computer processor microarchitecture by AMD. It is the successor of AMD's Zen and Zen+ microarchitectures, and is fabricated on the 7 nm MOSFET node from TSMC. The microarchitecture powers the third generation of Ryzen processors, kn ...
and
Zen 3 Zen 3 is the name for a CPU microarchitecture by AMD, released on November 5, 2020. It is the successor to Zen 2 and uses TSMC's 7 nm process, 7 nm process for the chiplets and GlobalFoundries's 14 nm process, 14 nm process for the I/O die on th ...
Ryzen CPUs for the AM4 socket.


Flip chip

A flip-chip pin grid array (FC-PGA or FCPGA) is a form of pin grid array in which the die faces downwards on the top of the substrate with the back of the die exposed. This allows the die to have a more direct contact with the
heatsink A heat sink (also commonly spelled heatsink) is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, ...
or other cooling mechanism. FC-PGA CPUs were introduced by
Intel Intel Corporation is an American multinational corporation and technology company headquartered in Santa Clara, California, and Delaware General Corporation Law, incorporated in Delaware. Intel designs, manufactures, and sells computer compo ...
in 1999, for Coppermine core
Pentium III The Pentium III (marketed as Intel Pentium III Processor, informally PIII or P3) brand refers to Intel's 32-bit x86 desktop and mobile CPUs based on the sixth-generation P6 (microarchitecture), P6 microarchitecture introduced on February 28, 1999 ...
and
Celeron Celeron is a series of IA-32 and x86-64 computer microprocessor, microprocessors targeted at low-cost Personal computer, personal computers, manufactured by Intel from 1998 until 2023. The first Celeron-branded CPU was introduced on April 15, ...
processors based on
Socket 370 Socket 370, also known as PGA370, is a CPU socket first used by Intel for Pentium III and Celeron processors to first complement and later replace the older Slot 1 CPU interface on personal computers. The "370" refers to the number of pin holes i ...
, and were produced until Socket G3 in 2013. FC-PGA processors fit into
zero insertion force Zero insertion force (ZIF) is a type of IC socket or electrical connector that requires very little (but not literally zero) force for insertion. With a ZIF socket, before the IC is inserted, a lever or slider on the side of the socket is m ...
(ZIF) motherboard sockets; similar packages were also used by AMD.


Material


Ceramic

A ceramic pin grid array (CPGA) is a type of packaging used by
integrated circuits An integrated circuit (IC), also known as a microchip or simply chip, is a set of electronic circuits, consisting of various electronic components (such as transistors, resistors, and capacitors) and their interconnections. These components a ...
. This type of packaging uses a ceramic substrate with pins arranged in a pin grid array. Some CPUs that use CPGA packaging are the AMD
Socket A Socket A (also known as Socket 462) is a zero insertion force pin grid array (PGA) CPU socket used for AMD processors ranging from the Athlon Thunderbird to the Athlon XP/MP 3200+, and AMD budget processors including the Duron and Sempron. ...
Athlon AMD Athlon is the brand name applied to a series of x86, x86-compatible microprocessors designed and manufactured by AMD, Advanced Micro Devices. The original Athlon (now called Athlon Classic) was the first seventh-generation x86 processor a ...
s and the
Duron Duron is a line of budget x86-compatible microprocessors manufactured by Advanced Micro Devices, AMD and released on June 19, 2000. Duron was intended to be a lower-cost offering to complement AMD's then mainstream performance Athlon process ...
. A CPGA was used by AMD for Athlon and Duron processors based on Socket A, as well as some AMD processors based on
Socket AM2 The Socket AM2, renamed from Socket M2 (to prevent using the same name as Cyrix MII processors), is a CPU socket designed by AMD for desktop processors, including the performance, mainstream and value segments. It was released on May 23, 2006, a ...
and
Socket AM2+ Socket AM2+ is a CPU socket, which is the immediate successor to Socket AM2 that is used by several AMD processors such as Athlon 64 X2. Socket AM2+ is a mid-migration from Socket AM2 to Socket AM3 and both AM2+ and AM2 socket CPUs and motherboa ...
. While similar form factors have been used by other manufacturers, they are not officially referred to as CPGA. This type of packaging uses a
ceramic A ceramic is any of the various hard, brittle, heat-resistant, and corrosion-resistant materials made by shaping and then firing an inorganic, nonmetallic material, such as clay, at a high temperature. Common examples are earthenware, porcela ...
substrate with pins arranged in an array. File:VIA C3 C5XL CPGA.jpg, A 1.2 GHz VIA C3 microprocessor in a ceramic package File:Pentium P54 Socket7 PGA.jpg, 133 MHz Pentium chip in a ceramic package


Organic

An organic pin grid array (OPGA) is a type of connection for
integrated circuit An integrated circuit (IC), also known as a microchip or simply chip, is a set of electronic circuits, consisting of various electronic components (such as transistors, resistors, and capacitors) and their interconnections. These components a ...
s, and especially
CPUs A central processing unit (CPU), also called a central processor, main processor, or just processor, is the primary Processor (computing), processor in a given computer. Its electronic circuitry executes Instruction (computing), instructions ...
, where the
silicon Silicon is a chemical element; it has symbol Si and atomic number 14. It is a hard, brittle crystalline solid with a blue-grey metallic lustre, and is a tetravalent metalloid (sometimes considered a non-metal) and semiconductor. It is a membe ...
die is attached to a plate made out of an organic
plastic Plastics are a wide range of synthetic polymers, synthetic or Semisynthesis, semisynthetic materials composed primarily of Polymer, polymers. Their defining characteristic, Plasticity (physics), plasticity, allows them to be Injection moulding ...
which is pierced by an array of pins which make the requisite connections to the
socket Socket may refer to: Mechanics * Socket wrench, a type of wrench that uses separate, removable sockets to fit different sizes of nuts and bolts * Socket head screw, a screw (or bolt) with a cylindrical head containing a socket into which the hexag ...
. File:SL3A2down.JPG, The underside of a
Celeron Celeron is a series of IA-32 and x86-64 computer microprocessor, microprocessors targeted at low-cost Personal computer, personal computers, manufactured by Intel from 1998 until 2023. The first Celeron-branded CPU was introduced on April 15, ...
-400 in a PPGA File:AMD Athlon XP 2000 - Socket A - OPGA.jpg, An OPGA CPU. Note the brown color – many OPGA parts are colored green. The die is in the center of the device, and the four gray circles are foam spacers to relieve pressure from the die, caused by the heat sink.


Plastic

Plastic pin grid array (PPGA) packaging was used by Intel for late-model Mendocino core
Celeron Celeron is a series of IA-32 and x86-64 computer microprocessor, microprocessors targeted at low-cost Personal computer, personal computers, manufactured by Intel from 1998 until 2023. The first Celeron-branded CPU was introduced on April 15, ...
processors based on
Socket 370 Socket 370, also known as PGA370, is a CPU socket first used by Intel for Pentium III and Celeron processors to first complement and later replace the older Slot 1 CPU interface on personal computers. The "370" refers to the number of pin holes i ...
. Some pre-Socket 8 processors also used a similar form factor, although they were not officially referred to as PPGA.


Pin layout


Staggered pin

The staggered pin grid array (SPGA) is used by Intel processors based on
Socket 5 Socket 5 was created for the second generation of Intel P5 (microarchitecture), P5 Pentium (brand), Pentium processors operating at speeds from 75 to 133 MHz as well as certain Pentium OverDrive and Pentium MMX processors with core voltage 3. ...
and
Socket 7 Socket 7 is a physical and electrical specification for an x86-style CPU socket on a personal computer motherboard. It was released in June 1995. The socket supersedes the earlier Socket 5, and accepts P5 Pentium microprocessors manufactured by ...
.
Socket 8 The Socket 8 CPU socket was used exclusively with the Intel Pentium Pro and Pentium II Overdrive computer processors. Intel discontinued Socket 8 in favor of Slot 1 with the introduction of the Pentium II and Slot 2 with the release ...
used a partial SPGA layout on half the processor. It consists of two square arrays of pins, offset in both directions by half the minimum distance between pins in one of the arrays. Put differently: within a square boundary the pins form a diagonal square lattice. There is generally a section in the center of the package without any pins. SPGA packages are usually used by devices that require a higher pin density than what a PGA can provide, such as
microprocessor A microprocessor is a computer processor (computing), processor for which the data processing logic and control is included on a single integrated circuit (IC), or a small number of ICs. The microprocessor contains the arithmetic, logic, a ...
s.


Stud

A stud grid array (SGA) is a short-pinned pin grid array chip scale package for use in
surface-mount technology Surface-mount technology (SMT), originally called planar mounting, is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). An electrical component mounted in this manner is referred ...
. The polymer stud grid array or plastic stud grid array was developed jointly by the
Interuniversity Microelectronics Centre Interuniversity Microelectronics Centre (IMEC; officially stylised as imec) is an international Research and development, research & development organization, active in the fields of nanoelectronics and Digital electronics, digital technologies ...
(IMEC) and Laboratory for Production Technology,
Siemens AG Siemens AG ( ) is a German multinational technology conglomerate. It is focused on industrial automation, building automation, rail transport and health technology. Siemens is the largest engineering company in Europe, and holds the posit ...
.


rPGA

The reduced pin grid array was used by the socketed mobile variants of Intel's Core i3/5/7 processors and features a reduced pin pitch of 1mm, as opposed to the 1.27mm pin pitch used by contemporary AMD processors and older Intel processors. It is used in the G1, G2, and G3 sockets.


See also

*
Ball grid array A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be pu ...
(BGA) *
Centered square number In elementary number theory, a centered square number is a Centered polygonal number, centered figurate number that gives the number of dots in a Square (geometry), square with a dot in the center and all other dots surrounding the center dot i ...
*
Chip carrier In electronics, a chip carrier is one of several kinds of surface-mount technology packages for integrated circuits (commonly called "chips"). Connections are made on all four edges of a square package; compared to the internal cavity for mount ...
- chip packaging and package types list *
Dual in-line package In microelectronics, a dual in-line package (DIP or DIL) is an Semiconductor package, electronic component package with a rectangular housing and two parallel rows of electrical connecting pins. The package may be through-hole technology, throu ...
(DIP) *
Land grid array The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket (when a socket is used) — as opposed to pins on the integrated circuit, known as a '' pin grid array' ...
(LGA) * Single in-line package (SIP) * Zig-zag in-line package (ZIP)


References


Sources

* * *


External links


Intel CPU Processor Identification

Ball Grid Arrays: the High-Pincount Workhorses
John Baliga, associate editor, '' Semiconductor International'', 9/1/1999
Spot on component packaging
08/1998, '' Elektronik, Produktion & Prüftechnik''
Terminology
{{Semiconductor packages Chip carriers