The IEEE Electronics Packaging Award, formerly called the IEEE Components, Packaging, and Manufacturing Technologies Award, is a Technical Field Award established by the

IEEE The Institute of Electrical and Electronics Engineers (IEEE) is an American 501(c)(3) organization, 501(c)(3) public charity professional organization for electrical engineering, electronics engineering, and other related disciplines. The IEEE ...

Board of Directors in 2002. It is awarded for meritorious contribution to the advancement of

components Component may refer to: In engineering, science, and technology Generic systems *System components, an entity with discrete structure, such as an assembly or software module, within a system considered at a particular level of analysis * Lumped e ...

electronic packaging Electronic packaging is the design and production of enclosures for electronic devices ranging from individual semiconductor devices up to complete systems such as a mainframe computer. Packaging of an electronic system must consider protection ...

manufacturing Manufacturing is the creation or production of goods with the help of equipment, labor, machines, tools, and chemical or biological processing or formulation. It is the essence of the secondary sector of the economy. The term may refer ...

technologies. The award may be presented to an individual or a team of up to three recipients. Recipients of this award receive a bronze medal, certificate and an

honorarium An honorarium is an '' ex gratia'' payment, i.e., a payment made, without the giver recognizing themself as having any liability or legal obligation to the recipient for their volunteered services, or for services for which fees are not tradition ...

Recipients

Recipients of the award for each year include: * 2021: Chin C. Lee * 2020: Mitsumasa Koyanagi and Peter Ramm * 2019: Ephraim Suhir * 2018: William Chen * 2017: Paul S. Ho and King-Ning Tu * 2016: Michael Pecht * 2015: Nasser Borozorg-Grayeli * 2014: Avram Bar-Cohen * 2013: John Lau * 2012: Mauro Walker * 2011: Rao R. Tummala * 2010: Herbert Reichl * 2009: George G. Harman * 2008: Karl Puttlitz and Paul A. Totta * 2007: Dimitry Grabbe * 2006: C. P. WongC. P. Wong, Regent's Professor
Georgia Inst. Technology * 2005: Yutaka Tsukada * 2004: John W. Balde

References

External links

Electronics Packaging Award Awards established in 2002 {{sci-award-stub