HASL or HAL (for hot air (solder) leveling) is a type of finish used on
printed circuit board
A printed circuit board (PCB), also called printed wiring board (PWB), is a Lamination, laminated sandwich structure of electrical conduction, conductive and Insulator (electricity), insulating layers, each with a pattern of traces, planes ...
s (PCBs).
The PCB is typically dipped into a bath of molten
solder
Solder (; North American English, NA: ) is a fusible alloy, fusible metal alloy used to create a permanent bond between metal workpieces. Solder is melted in order to wet the parts of the joint, where it adheres to and connects the pieces aft ...
so that all exposed
copper
Copper is a chemical element; it has symbol Cu (from Latin ) and atomic number 29. It is a soft, malleable, and ductile metal with very high thermal and electrical conductivity. A freshly exposed surface of pure copper has a pinkish-orang ...
surfaces are covered by solder. Excess solder is removed by passing the PCB between
hot air knives.
HASL can be applied with or without
lead
Lead () is a chemical element; it has Chemical symbol, symbol Pb (from Latin ) and atomic number 82. It is a Heavy metal (elements), heavy metal that is density, denser than most common materials. Lead is Mohs scale, soft and Ductility, malleabl ...
(Pb), but only
lead-free
The Restriction of Hazardous Substances Directive 2002/95/EC (RoHS 1), short for Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment, was adopted in February 2003 by the European Uni ...
HASL is
RoHS
The Restriction of Hazardous Substances Directive 2002/95/EC (RoHS 1), short for Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment, was adopted in February 2003 by the European Uni ...
compliant.
Advantages of HASL
* Excellent
wetting
Wetting is the ability of a liquid to displace gas to maintain contact with a solid surface, resulting from intermolecular interactions when the two are brought together. These interactions occur in the presence of either a gaseous phase or ...
during component soldering.
* Avoids copper corrosion.
Disadvantages of HASL
* Low planarity on vertical levelers may make this surface finish unsuitable for use with fine pitch components. Improved planarity can be achieved using a horizontal leveler.
* High thermal stress during the process may introduce defects into PCB.
See also
*
Electroless Nickel Immersion Gold (ENIG)
*
Immersion Silver (IAg)
*
Organic Solderability Preservative (OSP)
*
Reflow soldering
Reflow soldering is a process in which a solder paste (a sticky mixture of powdered solder and flux (metallurgy), flux) is used to temporarily attach anywhere from one to thousands of tiny electrical components to their contact pads, after wh ...
*
Wave soldering
Wave soldering is a bulk soldering process used in printed circuit board manufacturing. The circuit board is passed over a pan of molten solder in which a pump produces an upwelling of solder that looks like a standing wave. As the circuit bo ...
References
{{Reflist
Printed circuit board manufacturing
Soldering