semiconductor manufacturing Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as microprocessors, microcontrollers, and memories (such as Random-access memory, RAM and flash memory). It is a ...

, isotropic etching is a method commonly used to remove material from a

substrate Substrate may refer to: Physical layers *Substrate (biology), the natural environment in which an organism lives, or the surface or medium on which an organism grows or is attached ** Substrate (aquatic environment), the earthy material that exi ...

via a chemical process using an

etchant Etching is a printmaking technique in art. Etching may also refer to: * Etching (microfabrication), a process in producing microelectronics * Glass etching, a glass decoration technique * Chemical milling, or industrial etching * Photochemical ma ...

substance. The etchant may be in liquid-, gas- or plasma-phase, although liquid etchants such as buffered hydrofluoric acid (BHF) for

silicon dioxide Silicon dioxide, also known as silica, is an oxide of silicon with the chemical formula , commonly found in nature as quartz. In many parts of the world, silica is the major constituent of sand. Silica is one of the most complex and abundan ...

etching are more often used. Unlike

anisotropic Anisotropy () is the structural property of non-uniformity in different directions, as opposed to isotropy. An anisotropic object or pattern has properties that differ according to direction of measurement. For example, many materials exhibit ver ...

etching,

isotropic In physics and geometry, isotropy () is uniformity in all orientations. Precise definitions depend on the subject area. Exceptions, or inequalities, are frequently indicated by the prefix ' or ', hence '' anisotropy''. ''Anisotropy'' is also ...

etching does not etch in a single direction, but rather etches in multiple directions within the substrate. Any horizontal component of the etch direction may therefore result in undercutting of patterned areas, and significant changes to device characteristics. Isotropic etching may occur unavoidably, or it may be desirable for process reasons.

References

{{DEFAULTSORT:Isotropic Etching Semiconductors