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Electrochemical Migration
Electrochemical migration (ECM) is the dissolution and movement of metal ions in presence of electric potential, which results in the growth of dendritic structures between anode and cathode. The process is most commonly observed in printed circuit board A printed circuit board (PCB), also called printed wiring board (PWB), is a Lamination, laminated sandwich structure of electrical conduction, conductive and Insulator (electricity), insulating layers, each with a pattern of traces, planes ...s where it may significantly decrease the insulation between conductors. The main factor facilitating the ECM is humidity. In the presence of water, ECM can go very quickly. Usually the process involves several stages: water adsorption, anode metal dissolution, ion accumulation, ion migration to cathode, and dendritic growth. The growth of the dendrite takes fraction of a second, during which time the resistance between anode and cathode drops almost to zero. Characteristics In a ...
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Dendrite (metal)
A dendrite in metallurgy is a characteristic tree-like structure of crystals growing as molten metal solidifies, the shape produced by faster growth along energetically favourable crystallographic directions. This dendritic growth has large consequences in regard to material properties. Formation Dendrites form in unary (one-component) systems as well as multi-component systems. The requirement is that the liquid (the molten material) be undercooled, aka supercooled, below the freezing point of the solid. Initially, a spherical solid nucleus grows in the undercooled melt. As the sphere grows, the spherical morphology becomes unstable and its shape becomes perturbed. The solid shape begins to express the preferred growth directions of the crystal. This growth direction may be due to anisotropy in the surface energy of the solid–liquid interface, or to the ease of attachment of atoms to the interface on different crystallographic planes, or both (for an example of the ...
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Anode
An anode usually is an electrode of a polarized electrical device through which conventional current enters the device. This contrasts with a cathode, which is usually an electrode of the device through which conventional current leaves the device. A common mnemonic is ACID, for "anode current into device". The direction of conventional current (the flow of positive charges) in a circuit is opposite to the direction of electron flow, so (negatively charged) electrons flow from the anode of a galvanic cell, into an outside or external circuit connected to the cell. For example, the end of a household battery marked with a "+" is the cathode (while discharging). In both a galvanic cell and an electrolytic cell, the anode is the electrode at which the oxidation reaction occurs. In a galvanic cell the anode is the wire or plate having excess negative charge as a result of the oxidation reaction. In an electrolytic cell, the anode is the wire or plate upon which excess positive charge ...
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Cathode
A cathode is the electrode from which a conventional current leaves a polarized electrical device such as a lead-acid battery. This definition can be recalled by using the mnemonic ''CCD'' for ''Cathode Current Departs''. Conventional current describes the direction in which positive charges move. Electrons, which are the carriers of current in most electrical systems, have a negative electrical charge, so the movement of electrons is ''opposite'' to that of the conventional current flow: this means that electrons flow ''into'' the device's cathode from the external circuit. For example, the end of a household battery marked with a + (plus) is the cathode. The electrode through which conventional current flows the other way, into the device, is termed an anode. Charge flow Conventional current flows from cathode to anode outside the cell or device (with electrons moving in the opposite direction), regardless of the cell or device type and operating mode. Cathode polarity ...
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Printed Circuit Board
A printed circuit board (PCB), also called printed wiring board (PWB), is a Lamination, laminated sandwich structure of electrical conduction, conductive and Insulator (electricity), insulating layers, each with a pattern of traces, planes and other features (similar to wires on a flat surface) Chemical milling, etched from one or more sheet layers of copper laminated onto or between sheet layers of a non-conductive substrate. PCBs are used to connect or Electrical wiring, "wire" Electronic component, components to one another in an electronic circuit. Electrical components may be fixed to conductive pads on the outer layers, generally by soldering, which both electrically connects and mechanically fastens the components to the board. Another manufacturing process adds Via (electronics), vias, metal-lined drilled holes that enable electrical interconnections between conductive layers, to boards with more than a single side. Printed circuit boards are used in nearly all e ...
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Electrical Resistance
The electrical resistance of an object is a measure of its opposition to the flow of electric current. Its reciprocal quantity is , measuring the ease with which an electric current passes. Electrical resistance shares some conceptual parallels with mechanical friction. The SI unit of electrical resistance is the ohm (), while electrical conductance is measured in siemens (S) (formerly called the 'mho' and then represented by ). The resistance of an object depends in large part on the material it is made of. Objects made of electrical insulators like rubber tend to have very high resistance and low conductance, while objects made of electrical conductors like metals tend to have very low resistance and high conductance. This relationship is quantified by resistivity or conductivity. The nature of a material is not the only factor in resistance and conductance, however; it also depends on the size and shape of an object because these properties are extensive rather tha ...
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Whisker (metallurgy)
Metal whiskering is a phenomenon that occurs in electrical devices when metals form long whisker-like projections over time. Tin whiskers were noticed and documented in the vacuum tube era of electronics early in the 20th century in equipment that used pure, or almost pure, tin solder in their production. It was noticed that small metal hairs or tendrils grew between metal solder pads, causing short circuits. Metal whiskers form in the presence of compressive stress. Germanium, zinc, cadmium, and even lead whiskers have been documented. Many techniques are used to mitigate the problem, including changes to the annealing (metallurgy), annealing process (heating and cooling), the addition of elements like copper and nickel, and the inclusion of conformal coatings. Traditionally, lead has been added to slow down whisker growth in tin-based solders. Following the RoHS, Restriction of Hazardous Substances Directive (RoHS), the European Union banned the use of lead in most consumer elec ...
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