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Via (electronics)
A via (Latin, 'path' or 'way') is an electrical connection between two or more metal layers of a printed circuit boards (PCB) or integrated circuit. Essentially a via is a small drilled hole that goes through two or more adjacent layers; the hole is plated with metal (often copper) that forms an electrical connection through the insulating layers. Vias are an important concern in PCB manufacturing. As vertical structures crossing multiple layers, they are specified differently from most of the design, which increases the chance for errors. They place the strictest demands on registration (how closely aligned different layers are). They are manufactured with different tooling from other features -- tooling that typically has looser tolerances. If either the hole or any layer is slightly out of place, the wrong electrical connections may be made; this may not be visible from the surface. After the hole is drilled, it must also be lined with conductive material, as opposed to simpl ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Via Types
Via or VIA may refer to the following: Arts and entertainment * Via (Volumes album), ''Via'' (Volumes album), 2011 * Via (Thalia Zedek album), 2013 * VIA (music), Soviet and Russian term for a music collective Businesses and organisations * Via Foundation, a Czech charitable foundation * VIA Programs (Volunteers In Asia), an American non-profit organization * VIA Technologies, a Taiwanese manufacturer of electronics * VIA University College, a Danish university college * VIA Vancouver Institute for the Americas, a Canadian education organization * Volunteers in Africa Foundation, an American non-profit organization *VIA, stock ticker for: **Viacom (1952–2006) ** Viacom (2005–2019) * Vià, a French television network Transportation * VIA Metropolitan Transit, in San Antonio, Texas, U.S. * Via Rail, rail operator in Canada * Via Transportation, a global transportation technology company * Air VIA, a former Bulgarian airline * VIA Airways, a Bulgarian airline, now Fly2Sky ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Through-silicon Via
In electronic engineering, a through-silicon via (TSV) or through-chip via is a vertical electrical connection (Via (electronics), via) that passes completely through a silicon wafer or die (integrated circuit), die. TSVs are high-performance interconnect techniques used as an alternative to wire bond, wire-bond and flip chips to create 3D packages and Three-dimensional integrated circuit, 3D integrated circuits. Compared to alternatives such as Package on package, package-on-package, the interconnect and device density is substantially higher, and the length of the connections becomes shorter. Classification Dictated by the manufacturing process, there exist three different types of TSVs: ''via-first TSVs'' are fabricated before the individual component (transistors, capacitors, resistors, etc.) are patterned (front end of line, FEOL), ''via-middle TSVs'' are fabricated after the individual component are patterned but before the metal layers (Back end of line, back-end-of-li ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Electronics Manufacturing
The electronics industry is the industry that produces electronic devices. It emerged in the 20th century and is today one of the largest global industries. Contemporary society uses a vast array of electronic devices that are built in factories operated by the industry, which are almost always partially automated. Electronic products are primarily assembled from metal–oxide–semiconductor (MOS) transistors and integrated circuits, the latter principally by photolithography and often on printed circuit boards. Circuit boards are assembled largely using surface-mount technology, which typically involves the automated placement of electronic parts on circuit boards using pick-and-place machines. Surface-mount technology and pick-and-place machines make it possible to assemble large numbers of circuit boards at high speed. The industry's size, the use of toxic materials, and the difficulty of recycling have led to a series of problems with electronic waste. International reg ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Electronic Design
''Electronic Design'' magazine, founded in 1952, is an electronics and electrical engineering trade magazine and website. History Hayden Publishing Company began publishing the bi-weekly magazine Electronic Design in December 1952, and was later published by InformaUSA, Inc. In 1986, Verenigde Nederlandse Uitgeverijen, purchased Hayden Publishing Inc. In June 1988, Verenigde Nederlandse Uitgeverijen, purchased ''Electronic Design'' from McGraw-Hill. In July 1989, Penton Media, purchased ''Electronic Design'', then in Hasbrouck, N.J., from Verenigde Nederlandse Uitgeverijen. In July 2007, Penton Media's OEM electronics publication, ''EE Product News'', merged with Penton Media's "Electronic Design" magazine. ''EE Product News'' was founded in 1941, as a monthly publication. In September 2016, Informa, purchased Penton Media, including ''Electronic Design''. In November 2019, Endeavor Business Media purchased ''Electronic Design'' from Informa. Content Section ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Altium
Altium Limited is an American multinational software company that provides electronic design automation software to engineers who design printed circuit boards. Founded as Protel Systems Pty Ltd in Australia in 1985, the company has regional headquarters in the United States, Australia, China, Europe, and Japan. Its products are designed for use in a Microsoft Windows environment and used in industries such as automotive, aerospace, defence and telecommunications. Its flagship product, Altium Designer, is a software for Electronic design automation, unified electronics design. Since August 2024, Altium is a subsidiary of Renesas Electronics. History 1985–1991: Early history The history of Altium dates to 1985 with the founding of Protel Systems Pty Ltd by electronics designer Nicholas Martin. He was working at the University of Tasmania in the 1980s. He saw an opportunity to make the design of electronics product affordable, by marrying the techniques of electronics design ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Altera Corporation
Altera Corporation is a manufacturer of programmable logic devices (PLDs) headquartered in San Jose, California. It was founded in 1983 and acquired by Intel in 2015 before becoming independent once again in 2025 as a company focused on development of Field-Programmable Gate Array (FPGA) technology and system on a chip FPGAs. Early history The company was founded in 1983 by semiconductor veterans Robert Hartmann, Paul Newhagen, James Sansbury, and Michael Magranet with $1,300,000 in seed money. The name of the company was a play on "alterable", the type of chips the company created. The founders selected Rodney Smith to be the company's first CEO. In 1988, Altera became a public company via an initial public offering (IPO). Products FPGAs The main product lines from Altera are the Agilex FPGA product lines, and their predecessors: the high-end Stratix series, mid-range Arria series, and lower-cost Cyclone series; as well as the MAX series non-volatile FPGAs. Semiconduct ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
WE Online
In Modern English, ''we'' is a plural, first-person pronoun. Morphology In Standard Modern English, ''we'' has six distinct shapes for five word forms: * ''we'': the nominative (subjective) form * ''us'' and ': the accusative (objective; also called the 'oblique'.) form * ''our:'' the dependent genitive (possessive) form *''ours:'' the independent genitive (possessive) form * ''ourselves'': the reflexive form There is also a distinct determiner ''we'' as in ''we humans aren't perfect'', which some people consider to be just an extended use of the pronoun. History ''We'' has been part of English since Old English, having come from Proto-Germanic *''wejes'', from PIE *''we''-. Similarly, ''us'' was used in Old English as the accusative and dative plural of ''we'', from PIE *''nes''-. The following table shows the old English first-person plural and dual pronouns: By late Middle English, the dual form was lost, and the dative and accusative had merged. The ''ours'' geniti ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Würth Elektronik GmbH & Co
The Würth Group (, ) is a worldwide wholesaler of fasteners, screws and screw accessories. Würth expanded its range and today offers a full range of business equipment for craft businesses in a kind of supermarket of its own. Würth offers dowels, chemicals, electronic and electromechanical components, furniture and construction fittings, tools, machines, installation material, automotive hardware, inventory management, storage and retrieval systems. The group of over 400 companies across 80+ countries has been servicing the automotive, woodworking, metalworking, industrial and construction industries. Würth was founded in 1945 by Adolf Würth in Künzelsau, Germany. The company is family owned and has been run by his son Reinhold Würth since 1954. History Würth was founded by Adolf Würth (1909–1954), for the purpose of selling screws in 1945 in Künzelsau (hence the company logo, which consists of the family name and a W of two screw heads with cylindrical and round ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Feedthrough
A feedthrough is a Conductor (material), conductor used to carry a signal through an enclosure or printed circuit board. Like any conductor, it has a small amount of capacitance. A "feedthrough capacitor" has a guaranteed minimum value of built in it and is used for bypass purposes in ultra-high-frequency applications. Feedthroughs can be divided into power and instrumentation categories. Power feedthroughs are used to carry either high current or high voltage. Instrumentation feedthroughs are used to carry electrical signals (including thermocouples) which are normally low current or voltage. Another special type is what is commonly known as RF-feedthrough, specifically designed to carry very high frequency Radio frequency, RF or microwave electrical signals. A feedthrough electrical connection may have to withstand considerable pressure difference across its length. Systems that operate under high vacuum, such as electron microscopes, require electrical connections through t ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Via Fence
Via or VIA may refer to the following: Arts and entertainment * ''Via'' (Volumes album), 2011 * Via (Thalia Zedek album), 2013 * VIA (music), Soviet and Russian term for a music collective Businesses and organisations * Via Foundation, a Czech charitable foundation * VIA Programs (Volunteers In Asia), an American non-profit organization * VIA Technologies, a Taiwanese manufacturer of electronics * VIA University College, a Danish university college * VIA Vancouver Institute for the Americas, a Canadian education organization * Volunteers in Africa Foundation, an American non-profit organization *VIA, stock ticker for: ** Viacom (1952–2006) ** Viacom (2005–2019) * Vià, a French television network Transportation * VIA Metropolitan Transit, in San Antonio, Texas, U.S. * Via Rail, rail operator in Canada * Via Transportation, a global transportation technology company * Air VIA, a former Bulgarian airline * VIA Airways, a Bulgarian airline, now Fly2Sky Airl ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Through-silicon Via
In electronic engineering, a through-silicon via (TSV) or through-chip via is a vertical electrical connection (Via (electronics), via) that passes completely through a silicon wafer or die (integrated circuit), die. TSVs are high-performance interconnect techniques used as an alternative to wire bond, wire-bond and flip chips to create 3D packages and Three-dimensional integrated circuit, 3D integrated circuits. Compared to alternatives such as Package on package, package-on-package, the interconnect and device density is substantially higher, and the length of the connections becomes shorter. Classification Dictated by the manufacturing process, there exist three different types of TSVs: ''via-first TSVs'' are fabricated before the individual component (transistors, capacitors, resistors, etc.) are patterned (front end of line, FEOL), ''via-middle TSVs'' are fabricated after the individual component are patterned but before the metal layers (Back end of line, back-end-of-li ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Surface-mount Technology
Surface-mount technology (SMT), originally called planar mounting, is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). An electrical component mounted in this manner is referred to as a surface-mount device (SMD). In industry, this approach has largely replaced through-hole technology construction method of fitting components, in large part because SMT allows for increased manufacturing automation which reduces cost and improves quality. It also allows for more components to fit on a given area of substrate. Both technologies can be used on the same board, with the through-hole technology often used for components not suitable for surface mounting such as large transformers and heat-sinked power semiconductors. An SMT component is usually smaller than its through-hole counterpart because it has either smaller leads or no leads at all. It may have short pins or leads of various styles, flat contacts, a matrix of ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
