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Outline Of Information Technology
The following outline is provided as an overview of and topical guide to information technology: Information technology (IT) – microelectronics based combination of computing and telecommunications technology to treat information, including in the acquisition, processing, storage and dissemination of vocal, pictorial, textual and numerical information. It is defined by the Information Technology Association of America (ITAA) as "the study, design, development, implementation, support or management of computer-based information systems, particularly toward software applications and computer hardware." Different names There are different names for this at different periods or through fields. Some of these names are: * ICT – Information and communication technologies * IT – Information technology * DCT – Data Communication & technology * CDT – Creative digital technology * DT – Design & technology * Communication technology * Hacker Underlyi ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
PMOS Logic
PMOS or pMOS logic, from p-channel metal–oxide–semiconductor, is a family of digital circuits based on p-channel, enhancement mode metal–oxide–semiconductor field-effect transistors (MOSFETs). In the late 1960s and early 1970s, PMOS logic was the dominant semiconductor technology for large-scale integrated circuits before being superseded by NMOS and CMOS devices. History and application Mohamed Atalla and Dawon Kahng manufactured the first working MOSFET at Bell Labs in 1959. They fabricated both PMOS and NMOS devices but only the PMOS devices were working. It would be more than a decade before contaminants in the manufacturing process (particularly sodium) could be managed well enough to manufacture practical NMOS devices. Compared to the bipolar junction transistor, the only other device available at the time for use in an integrated circuit, the MOSFET offers a number of advantages: *Given semiconductor device fabrication processes of similar precision ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Three-dimensional Integrated Circuit
A three-dimensional integrated circuit (3D IC) is a MOSFET, MOS (metal-oxide semiconductor) integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. The 3D IC is one of several 3D integration schemes that exploit the z-direction to achieve electrical performance benefits in microelectronics and nanoelectronics. 3D integrated circuits can be classified by their level of interconnect hierarchy at the global (Integrated circuit packaging, package), intermediate (bond pad) and local (transistor) level. In general, 3D integration is a broad term that includes such technologies as 3D wafer-level packaging (3DWLP); 2.5D and 3D interposer-based integration; 3D stacked ICs (3D-SICs); 3D heterogeneous integr ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Planar Process
The planar process is a semiconductor device fabrication, manufacturing process used in the semiconductor industry to build individual components of a transistor, and in turn, connect those transistors together. It is the primary process by which silicon integrated circuit chips are built, and it is the most commonly used method of producing Junction (electricity), junctions during the manufacture of semiconductor devices. The process utilizes the surface passivation and thermal oxidation methods. The planar process was developed at Fairchild Semiconductor in 1959 and process proved to be one of the most important single advances in semiconductor technology. Overview The key concept is to view a circuit in its two-dimensional projection (a plane), thus allowing the use of photographic processing concepts such as film negatives to mask the projection of light exposed chemicals. This allows the use of a series of exposures on a substrate (silicon) to create silicon oxide (insulators ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Monolithic Integrated Circuit
An integrated circuit (IC), also known as a microchip or simply chip, is a set of electronic circuits, consisting of various electronic components (such as transistors, resistors, and capacitors) and their interconnections. These components are etched onto a small, flat piece ("chip") of semiconductor material, usually silicon. Integrated circuits are used in a wide range of electronic devices, including computers, smartphones, and televisions, to perform various functions such as processing and storing information. They have greatly impacted the field of electronics by enabling device miniaturization and enhanced functionality. Integrated circuits are orders of magnitude smaller, faster, and less expensive than those constructed of discrete components, allowing a large transistor count. The IC's mass production capability, reliability, and building-block approach to integrated circuit design have ensured the rapid adoption of standardized ICs in place of designs using discre ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Hybrid Integrated Circuit
A hybrid integrated circuit (HIC), hybrid microcircuit, hybrid circuit or simply hybrid is a miniaturized electronic circuit constructed of individual devices, such as semiconductor devices (e.g. transistors, diodes or Integrated circuits, monolithic ICs) and passive components (e.g. resistors, inductors, transformers, and capacitors), bonded to a substrate or printed circuit board (PCB). A PCB having components on a Printed wiring board (PWB) is not considered a true hybrid circuit according to the definition of MIL-PRF-38534. Overview "Integrated circuit", as the term is currently used, usually refers to a monolithic IC which differs notably from a HIC in that a HIC is fabricated by inter-connecting a number of components on a substrate whereas an IC's (monolithic) components are fabricated in a series of steps entirely on a single wafer which is then diced into chips. Some hybrid circuits may contain monolithic ICs, particularly Multi-chip module (MCM) hybrid circuits. Hyb ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Integrated Circuit
An integrated circuit (IC), also known as a microchip or simply chip, is a set of electronic circuits, consisting of various electronic components (such as transistors, resistors, and capacitors) and their interconnections. These components are etched onto a small, flat piece ("chip") of semiconductor material, usually silicon. Integrated circuits are used in a wide range of electronic devices, including computers, smartphones, and televisions, to perform various functions such as processing and storing information. They have greatly impacted the field of electronics by enabling device miniaturization and enhanced functionality. Integrated circuits are orders of magnitude smaller, faster, and less expensive than those constructed of discrete components, allowing a large transistor count. The IC's mass production capability, reliability, and building-block approach to integrated circuit design have ensured the rapid adoption of standardized ICs in place of designs using discre ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Thin-film Transistor
A thin-film transistor (TFT) is a special type of field-effect transistor (FET) where the transistor is made by thin film deposition. TFTs are grown on a supporting (but non-conducting) substrate, such as glass. This differs from the conventional bulk metal-oxide-semiconductor field-effect transistor (MOSFET), where the semiconductor material typically ''is'' the substrate, such as a silicon wafer. The traditional application of TFTs is in TFT liquid-crystal displays. Design and manufacture TFTs can be fabricated with a wide variety of semiconductor materials. Because it is naturally abundant and well understood, amorphous or polycrystalline silicon were (and still are) used as the semiconductor layer. However, because of the low mobility of amorphous silicon and the large device-to-device variations found in polycrystalline silicon, other materials have been studied for use in TFTs. These include cadmium selenide, metal oxides such as indium gallium zinc oxide (IGZO) or ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
FinFET
A fin field-effect transistor (FinFET) is a multigate device, a MOSFET (metal–oxide–semiconductor field-effect transistor) built on a substrate where the gate is placed on two, three, or four sides of the channel or wrapped around the channel (gate all around), forming a double or even multi gate structure. These devices have been given the generic name "FinFETs" because the source/drain region forms fins on the silicon surface. The FinFET devices exhibit significantly faster switching times and higher current density than planar CMOS (complementary metal–oxide–semiconductor) technology, resulting in enhanced performance and power efficienc FinFET is a type of non-planar transistor, or "3D" transistor. It is the basis for modern nanoelectronic semiconductor device fabrication. Microchips utilizing FinFET gates first became commercialized in the first half of the 2010s, and became the dominant gate design at 14 nm, 10 nm and 7 nm process nodes. It is common for a ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Multi-gate Field-effect Transistor
A multigate device, multi-gate MOSFET or multi-gate field-effect transistor (MuGFET) refers to a metal–oxide–semiconductor field-effect transistor (MOSFET) that has more than one gate on a single transistor. The multiple gates may be controlled by a single gate electrode, wherein the multiple gate surfaces act electrically as a single gate, or by independent gate electrodes. A multigate device employing independent gate electrodes is sometimes called a multiple-independent-gate field-effect transistor (MIGFET). The most widely used multi-gate devices are the FinFET (fin field-effect transistor) and the GAAFET (gate-all-around field-effect transistor), which are non-planar transistors, or 3D transistors. Multi-gate transistors are one of the several strategies being developed by MOS semiconductor manufacturers to create ever-smaller microprocessors and memory cells, colloquially referred to as extending Moore's law (in its narrow, specific version concerning density scaling ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Power MOSFET
A power MOSFET is a specific type of metal–oxide–semiconductor field-effect transistor (MOSFET) designed to handle significant power levels. Compared to the other power semiconductor devices, such as an insulated-gate bipolar transistor (IGBT) or a thyristor, its main advantages are high switching speed and good efficiency at low voltages. It shares with the IGBT an isolated gate that makes it easy to drive. They can be subject to low gain, sometimes to a degree that the gate voltage needs to be higher than the voltage under control. The design of power MOSFETs was made possible by the evolution of MOSFET and CMOS technology, used for manufacturing integrated circuits since the 1960s. The power MOSFET shares its operating principle with its low-power counterpart, the lateral MOSFET. The power MOSFET, which is commonly used in power electronics, was adapted from the standard MOSFET and commercially introduced in the 1970s. The power MOSFET is the most common power semicond ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Silicon-gate
In semiconductor electronics fabrication technology, a self-aligned gate is a transistor manufacturing approach whereby the gate electrode of a MOSFET (metal–oxide–semiconductor field-effect transistor) is used as a mask for the doping of the source and drain regions. This technique ensures that the gate is naturally and precisely aligned to the edges of the source and drain. The use of self-aligned gates in MOS transistors is one of the key innovations that led to the large increase in computing power in the 1970s. Self-aligned gates are still used in most modern integrated circuit processes. Introduction IC construction Integrated circuits (ICs, or "chips") are produced in a multi-step process that builds up multiple layers on the surface of a disk of silicon known as a " wafer". Each layer is patterned by coating the wafer in photoresist and then exposing it to ultraviolet light being shone through a stencil-like "mask". Depending on the process, the photoresist that ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
