Meteor Lake
Meteor Lake is the codename for Core Ultra Series 1 mobile processors, designed by Intel and officially released on December 14, 2023. It is the first generation of Intel mobile processors to use a chiplet architecture which means that the processor is a multi-chip module. Meteor Lake's design effort was led by Tim Wilson. Background In July 2021, Meteor Lake was initially announced to be coming with a 5–125W TDP range for various segments ranging from ultra low power mobile to enthusiast desktop. The initial tape-in process for Meteor Lake took place in May 2021. The CPU compute tile was confirmed to be fabricated on Intel's 7nm process (since rebranded to "Intel 4"). In October 2021, Intel said in an earnings call that it had taped out the CPU compute tile for Meteor Lake and after it was received it had powered on within 30 minutes and with expected performance levels. In April 2022, Intel announced that an assembled Meteor Lake mobile processor had been powered-on for th ... [...More Info...]       [...Related Items...]     OR:     [Wikipedia]   [Google]   [Baidu]   |
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Intel
Intel Corporation is an American multinational corporation and technology company headquartered in Santa Clara, California, and Delaware General Corporation Law, incorporated in Delaware. Intel designs, manufactures, and sells computer components such as central processing units (CPUs) and related products for business and consumer markets. It is one of the world's List of largest semiconductor chip manufacturers, largest semiconductor chip manufacturers by revenue, and ranked in the Fortune 500, ''Fortune'' 500 list of the List of largest companies in the United States by revenue, largest United States corporations by revenue for nearly a decade, from 2007 to 2016 Fiscal year, fiscal years, until it was removed from the ranking in 2018. In 2020, it was reinstated and ranked 45th, being the List of Fortune 500 computer software and information companies, 7th-largest technology company in the ranking. It was one of the first companies listed on Nasdaq. Intel supplies List of I ... [...More Info...]       [...Related Items...]     OR:     [Wikipedia]   [Google]   [Baidu]   |
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Advanced Vector Extensions
Advanced Vector Extensions (AVX, also known as Gesher New Instructions and then Sandy Bridge New Instructions) are SIMD extensions to the x86 instruction set architecture for microprocessors from Intel and Advanced Micro Devices (AMD). They were proposed by Intel in March 2008 and first supported by Intel with the Sandy Bridge microarchitecture shipping in Q1 2011 and later by AMD with the Bulldozer microarchitecture shipping in Q4 2011. AVX provides new features, new instructions, and a new coding scheme. AVX2 (also known as Haswell New Instructions) expands most integer commands to 256 bits and introduces new instructions. They were first supported by Intel with the Haswell microarchitecture, which shipped in 2013. AVX-512 expands AVX to 512-bit support using a new EVEX prefix encoding proposed by Intel in July 2013 and first supported by Intel with the Knights Landing co-processor, which shipped in 2016. In conventional processors, AVX-512 was introduced with Skylak ... [...More Info...]       [...Related Items...]     OR:     [Wikipedia]   [Google]   [Baidu]   |
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Alder Lake
Alder Lake is Intel's codename for the 12th generation of Intel Core processors based on a hybrid architecture utilizing Golden Cove performance cores and Gracemont efficient cores. It is fabricated using Intel's Intel 7 process, previously referred to as Intel 10 nm Enhanced SuperFin (10ESF). The 10ESF has a 10%-15% boost in performance over the 10SF used in the mobile Tiger Lake processors. Intel officially announced 12th Gen Intel Core CPUs on October 27, 2021, mobile CPUs and non-K series desktop CPUs on January 4, 2022, Alder Lake-P and -U series on February 23, 2022, and Alder Lake-HX series on May 10, 2022. History It was announced in November 2021 that Intel Alder Lake would use a hybrid architecture combining performance and efficiency cores, similar to ARM big.LITTLE. This was Intel's second hybrid architecture, after the mobile-only Lakefield released in June 2020. While the desktop Alder Lake processors were already on the market by January 2022, the mo ... [...More Info...]       [...Related Items...]     OR:     [Wikipedia]   [Google]   [Baidu]   |
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Intel Core
Intel Core is a line of multi-core (with the exception of Core Solo and Core 2 Solo) central processing units (CPUs) for midrange, embedded, workstation, high-end and enthusiast computer markets marketed by Intel Corporation. These processors displaced the existing mid- to high-end Pentium processors at the time of their introduction, moving the Pentium to the entry level. Identical or more capable versions of Core processors are also sold as Xeon processors for the server and workstation markets. Core was launched in January 2006 as a mobile-only series, consisting of single- and dual-core models. It was then succeeded later in July by the Core 2 series, which included both desktop and mobile processors with up to four cores, and introduced 64-bit support. Since 2008, Intel began introducing the Core i3, Core i5, Core i7 and Core i9 lineup of processors, succeeding Core 2. A new naming scheme debuted in 2023, consisting of Core 3, Core 5, and Core 7 for mainstream processo ... [...More Info...]       [...Related Items...]     OR:     [Wikipedia]   [Google]   [Baidu]   |
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LGA 1851
LGA 1851 (codename Socket V1) is a land grid array CPU socket designed by Intel for Meteor Lake#Processors for Internet of Things (IoT) devices and embedded systems (Meteor Lake-PS), Meteor Lake-PS and Arrow Lake (microprocessor), Arrow Lake-S desktop processors, released on October 24, 2024. The number of contacts has increased, from 1700 (for LGA 1700) to 1851. It uses the same dimensions and cooler mounting hole spacing as LGA 1700, ensuring continued CPU cooler compatibility. It offers 20 PCIe 5.0 lanes (x16 for the expansion cards and x4 for storage) and an additional 4 PCIe 4.0 lanes for storage. The available PCIe lanes for the expansion cards can now be bifurcated to three devices (x8, x4, x4) instead of two, in case of LGA 1700. Similar to AMD's Socket AM5, AM5 socket, it is exclusively on DDR5 SDRAM, dropping support for DDR4 unlike its predecessor (LGA 1700), marking the end of mainstream DDR4 after 10 years. Arrow Lake chipsets (800 series) Notes Referenc ... [...More Info...]       [...Related Items...]     OR:     [Wikipedia]   [Google]   [Baidu]   |
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Land Grid Array
The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket (when a socket is used) — as opposed to pins on the integrated circuit, known as a '' pin grid array'' (PGA). An LGA can be electrically connected to a printed circuit board (PCB) either by the use of a socket or by soldering directly to the board. Description The ''land grid array'' is a packaging technology with a grid of contacts, 'lands', on the underside of a package. The contacts are to be connected to a grid of contacts on the PCB. Not all rows and columns of the grid need to be used. The contacts can either be connected by using an LGA socket, or by surface-mount soldering using solder paste. The grid elements found in use can be e.g. circular, triangular or other polygonal shapes and might have even different sizes. Grids might sometimes appear like honey comb patterns. Designs are often optimized for factors like contact likelin ... [...More Info...]       [...Related Items...]     OR:     [Wikipedia]   [Google]   [Baidu]   |
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Ball Grid Array
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The traces connecting the package's leads to the wires or balls which connect the die to package are also on average shorter than with a perimeter-only type, leading to better performance at high speeds. Soldering of BGA devices requires precise control and is usually done by automated processes such as in computer-controlled automatic reflow ovens. Description The BGA is descended from the pin grid array (PGA), which is a package with one face covered (or partly covered) with pins in a grid pattern which, in operation, conduct electrical signals between the integrated circuit and the printed circuit board (PCB) ... [...More Info...]       [...Related Items...]     OR:     [Wikipedia]   [Google]   [Baidu]   |
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Intel Arc
Intel Arc is a brand of graphics processing units designed by Intel. These are discrete GPUs mostly marketed for the high-margin gaming PC market. The brand also covers Intel's consumer graphics software and services. Arc competes with Nvidia's GeForce and AMD's Radeon lines. The Arc-A series for laptops was launched on March 30, 2022, with the A750 and A770 both released in Q3 2022. Intel missed their initial Q2 2022 release target, with most discrete Arc GPUs not launching until October 2022. Intel officially launched the Arc Pro workstation GPUs on August 8, 2022. Intel officially announced the 2nd-generation Battlemage GPUs on December 3rd, 2024. The first model, the B580, was released on December 13th, 2024. Etymology According to Intel, the brand is named after the concept of story arcs found in video games. Each generation of Arc is named after character classes sorted by each letter of the Latin alphabet in ascending order. They begin with A, then B, then C, and so ... [...More Info...]       [...Related Items...]     OR:     [Wikipedia]   [Google]   [Baidu]   |
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LPDDR5X
Low-Power Double Data Rate (LPDDR), also known as LPDDR SDRAM, is a type of synchronous dynamic random-access memory (SDRAM) that consumes less power than other random access memory designs and is thus targeted for mobile computing devices such as laptop computers and smartphones. Older variants are also known as Mobile DDR, and abbreviated as mDDR. Modern LPDDR SDRAM is distinct from DDR SDRAM, with various differences that make the technology more appropriate for mobile applications. LPDDR technology standards are developed independently of DDR standards, with LPDDR4X and even LPDDR5 for example being implemented prior to DDR5 SDRAM and offering far higher data rates than DDR4 SDRAM. Bus width In contrast with standard SDRAM, used in stationary devices and laptops and usually connected over a 64-bit wide memory bus, LPDDR also permits 16- or 32-bit wide channels. The "E" and "X" versions mark enhanced versions of the specifications. They formalize overclocking the memory arra ... [...More Info...]       [...Related Items...]     OR:     [Wikipedia]   [Google]   [Baidu]   |
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DDR5
Double Data Rate 5 Synchronous Dynamic Random-Access Memory (DDR5 SDRAM) is a type of synchronous dynamic random-access memory. Compared to its predecessor DDR4 SDRAM, DDR5 was planned to reduce power consumption, while doubling bandwidth. The standard, originally targeted for 2018, was released on July 14, 2020. A new feature called Decision Feedback Equalization (DFE) enables input/output (I/O) speed scalability for higher bandwidth and performance improvement. DDR5 has about the same latency as DDR4 and DDR3. DDR5 octuples the maximum DIMM capacity from 64 GB to 512 GB. DDR5 also has higher frequencies than DDR4, up to 9600 MT/s is currently possible, 8200 MT/s translates into around 66 GB/s of bandwidth. Using liquid nitrogen 13000 MT/s speeds were achieved. Rambus announced a working DDR5 dual in-line memory module (DIMM) in September 2017. On November 15, 2018, SK Hynix announced completion of its first DDR5 RAM chip; running at 5.2 GT/s at 1.1 V. ... [...More Info...]       [...Related Items...]     OR:     [Wikipedia]   [Google]   [Baidu]   |
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VT-d
x86 virtualization is the use of hardware-assisted virtualization capabilities on an x86/x86-64 CPU. In the late 1990s x86 virtualization was achieved by complex software techniques, necessary to compensate for the processor's lack of hardware-assisted virtualization capabilities while attaining reasonable performance. In 2005 and 2006, both Intel ( VT-x) and AMD (AMD-V) introduced limited hardware virtualization support that allowed simpler virtualization software but offered very few speed benefits. Greater hardware support, which allowed substantial speed improvements, came with later processor models. Software-based virtualization The following discussion focuses only on virtualization of the x86 architecture protected mode. In protected mode the operating system kernel runs at a higher privilege such as ring 0, and applications at a lower privilege such as ring 3. In software-based virtualization, a host OS has direct access to hardware while the guest OSs have limited a ... [...More Info...]       [...Related Items...]     OR:     [Wikipedia]   [Google]   [Baidu]   |