LGA 3647 is an

Intel Intel Corporation is an American multinational corporation and technology company headquartered in Santa Clara, California. It is the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 ser ...

microprocessor A microprocessor is a computer processor where the data processing logic and control is included on a single integrated circuit, or a small number of integrated circuits. The microprocessor contains the arithmetic, logic, and control circ ...

compatible

socket Socket may refer to: Mechanics * Socket wrench, a type of wrench that uses separate, removable sockets to fit different sizes of nuts and bolts * Socket head screw, a screw (or bolt) with a cylindrical head containing a socket into which the hexag ...

used by Xeon Phi x200 ("Knights Landing"), Xeon Phi 72x5 ("Knights Mill"),

Skylake-SP Skylake is the codename used by Intel for a processor microarchitecture that was launched in August 2015 succeeding the Broadwell microarchitecture. Skylake is a microarchitecture redesign using the same 14 nm manufacturing process techn ...

, Cascade Lake-SP/AP, and Cascade Lake-W microprocessors. The socket supports a 6-channel memory controller, non-volatile

3D XPoint 3D XPoint (pronounced ''three-D cross point'') is a discontinued non-volatile memory (NVM) technology developed jointly by Intel and Micron Technology. It was announced in July 2015 and is available on the open market under the brand name Optan ...

memory DIMMs,

Intel Ultra Path Interconnect The Intel Ultra Path Interconnect (UPI) is a point-to-point processor interconnect developed by Intel which replaced the Intel QuickPath Interconnect (QPI) in Xeon Skylake-SP platforms starting in 2017. Interconnect UPI is a low-latency coherent ...

(UPI), as a replacement for

QPI The Intel QuickPath Interconnect (QPI) is a point-to-point processor interconnect developed by Intel which replaced the front-side bus (FSB) in Xeon, Itanium, and certain desktop platforms starting in 2008. It increased the scalability and avai ...

, and 100G

Omni-Path Omni-Path Architecture (OPA) was a high-performance communication architecture owned by Intel. It aims for low communication latency, low power consumption and a high throughput. Intel planned to develop technology based on this architecture for e ...

interconnect and also has a new mounting mechanism which does not use a lever to secure it in place but the CPU cooler's pressure and its screws to secure it in place.

Variants

There are two sub-versions of this socket with differences also in the ILM ( Independent Loading Mechanism, pitch of center screws changed slightly and a more visible one being that the guiding pins are in other corners). The processor socket and the matching notches on the processor are at different location, preventing insertion of an incompatible processor and preventing use of the wrong heatsink in a system. The more common P0 variant has two sub-options for heatsink mounting - designated as square ILM and narrow ILM, choice of which depends on the server and mainboard design (likely based on space constraints). * LGA3647-0 (socket P0) used for

and Cascade Lake-SP/AP processors * LGA3647-1 (socket P1) used for Xeon Phi x200 processors

References

Intel CPU sockets {{computer-stub