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List Of Semiconductor Fabrication Plants
This is a list of semiconductor fabrication plants: A semiconductor fabrication plant is where integrated circuits (ICs), also known as microchips, are made. They are either operated by Integrated Device Manufacturers (IDMs) who design and manufacture ICs in-house and may also manufacture designs from design only firms(fabless companies), or by Pure Play foundries, who only manufacture designs from fabless companies but do not design their own ICs. Notes:Plant location is where the plant is located, Started production is when the plant officially started volume(or mass) production, Wafer size is the largest wafer size that the facility is capable of processing, Process Technology Node is the size of the smallest features that the facility is capable of etching onto the wafers, Wafer capacity per month is the plant's Nameplate capacity. It does not mean that the facility is working at that capacity
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Winbond
Winbond
Winbond
Electronics Corporation (Chinese: 華邦電子公司; pinyin: Huábāng Diànzǐ Gōngsī) is a Taiwan-based corporation founded in 1987 that produces semiconductors and several types of integrated circuits, most notably Dynamic RAM, Static RAM, microcontrollers, and personal computer ICs
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Toshiba
Toshiba
Toshiba
Corporation (株式会社東芝, Kabushiki-gaisha Tōshiba, English: /təˈʃiːbə, tɒ-, toʊ-/[2]), commonly known as Toshiba and stylized as TOSHIBA, is a Japanese multinational conglomerate headquartered in Tokyo, Japan. Its diversified products and services include information technology and communications equipment and systems, electronic components and materials, power systems, industrial and social infrastructure systems, consumer electronics, household appliances, medical equipment, office equipment, as well as lighting and logistics. Toshiba
Toshiba
was founded in 1939 as Tokyo
Tokyo
Shibaura
Shibaura
Denki K.K. through the merger of Shibaura
Shibaura
Seisaku-sho (founded in 1875) and Tokyo
Tokyo
Denki (founded in 1890). The company name was officially changed to Toshiba Corporation in 1978
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Voronezh
Voronezh
Voronezh
(Russian: Воро́неж, IPA: [vɐˈronʲɪʂ]) is a city and the administrative center of Voronezh
Voronezh
Oblast, Russia, straddling the Voronezh River
Voronezh River
and located 12 kilometers (7.5 mi) from where it flows into the Don. The city sits on the Southeastern Railway, which connects European Russia
Russia
with the Urals and Siberia, the Caucasus
Caucasus
and Ukraine, and the M4 highway (Moscow–Voronezh–Rostov-on-Don–Novorossiysk)
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NXP Semiconductors
NXP Semiconductors
Semiconductors
N.V. is a Dutch global semiconductor manufacturer headquartered in Eindhoven, Netherlands
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East Fishkill, New York
East Fishkill is a town on the southern border of Dutchess County, New York, United States. The population was 29,029 at the 2010 census.[3] The town was once the eastern portion of the town of Fishkill. Hudson Valley Research Park (formerly known as IBM
IBM
East Fishkill) is located in the town, and housed 27 divisions and 4,700 regular employees for IBM
IBM
Microelectronics, which GlobalFoundries bought. While IBM
IBM
produced microchips they owned the advanced, automated processor fabrication facility where IBM's "Cell" processor was co-developed.Contents1 History 2 Geography 3 Demographics 4 Communities and locations in East Fishkill 5 See also 6 References 7 External linksHistory[edit]The Storm-Adriance-Brinckerhoff House, built in 1759One early settler arrived around 1759. The town of East Fishkill was established in 1849 from the eastern part of the town of Fishkill
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40 Nanometer
The term die shrink (sometimes optical shrink or process shrink) refers to a simple semiconductor scaling of semiconductor devices, mainly transistors. The act of shrinking a die is to create a somewhat identical circuit using a more advanced fabrication process, usually involving an advance of lithographic node. This reduces overall costs for a chip company, as the absence of major architectural changes to the processor lowers research and development costs, while at the same time allowing more processor dies to be manufactured on the same piece of silicon wafer, resulting in less cost per product sold.Contents1 Details 2 Half-shrink 3 See also 4 References 5 External linksDetails[edit] Die shrinks are the key to improving price/performance at semiconductor companies such as Intel, AMD (including the former ATI), NVIDIA, and Samsung
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130 Nanometer
The 130 nanometer
130 nanometer
(130 nm) process refers to the level of semiconductor process technology that was reached in the 2000–2001 timeframe, by most leading semiconductor companies, like Intel, Texas Instruments, IBM, and TSMC. The origin of the 130 nm value is historical, as it reflects a trend of 70% scaling every 2–3 years
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28 Nanometer
The 32 nanometer
32 nanometer
(32 nm) node is the step following the 45 nanometer process in CMOS
CMOS
semiconductor device fabrication. "32 nanometer" refers to the average half-pitch (i.e., half the distance between identical features) of a memory cell at this technology level. Intel and AMD both produced commercial microchips using the 32 nanometer process in the early 2010s
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350 Nanometer
The 350 nanometer
350 nanometer
(350 nm) process refers to the level of semiconductor process technology that was reached in the 1995–1996 timeframe, by most leading semiconductor companies, like Intel
Intel
and IBM. Products featuring 350 nm manufacturing process[edit] Intel
Intel
Pentium Pro
Pentium Pro
(1995), Pentium (P54CS, 1995), and initial Pentium II CPUs (Klamath, 1997). AMD K5
AMD K5
(1996) and original AMD K6
AMD K6
(Model 6, 1997) CPUs. NEC VR4300, used in the Nintendo 64
Nintendo 64
game console. Parallax Propeller, 8 core microcontroller[1]References[edit]^ "Propeller I semiconductor process technology? Is it 350nm or 180nm? - Parallax Forums". Forums.parallax.com
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180 Nanometer
The 180 nanometer
180 nanometer
(180 nm) process refers to the level of semiconductor process technology that was reached in the 1999-2000 timeframe by most leading semiconductor companies, like Intel, Texas Instruments, IBM, and TSMC. The origin of the 180 nm value is historical, as it reflects a trend of 70% scaling every 2–3 years. The naming is formally determined by the International Technology Roadmap for Semiconductors (ITRS). Some of the first CPUs manufactured with this process include Intel Coppermine family of Pentium III
Pentium III
processors. This was the first technology using a gate length shorter than that of light used for lithography (which has a minimum of 193 nm). Some more recent microprocessors and microcontrollers (e.g
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110 Nanometer
The term die shrink (sometimes optical shrink or process shrink) refers to a simple semiconductor scaling of semiconductor devices, mainly transistors. The act of shrinking a die is to create a somewhat identical circuit using a more advanced fabrication process, usually involving an advance of lithographic node. This reduces overall costs for a chip company, as the absence of major architectural changes to the processor lowers research and development costs, while at the same time allowing more processor dies to be manufactured on the same piece of silicon wafer, resulting in less cost per product sold.Contents1 Details 2 Half-shrink 3 See also 4 References 5 External linksDetails[edit] Die shrinks are the key to improving price/performance at semiconductor companies such as Intel, AMD (including the former ATI), NVIDIA, and Samsung
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Sandisk
SanDisk
SanDisk
is a manufacturer of flash memory products, including memory cards and readers, USB flash drives, and solid state drives
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Mikron Group
Mikron Group
Mikron Group
(Russian: ОАО «НИИМЭ и Микрон»), headed by JSC Mikron, is one of the largest manufacturers and exporters of microelectronics in Russia
Russia
and the CIS.[1][2] Its facilities
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Hitachi
Hitachi, Ltd. (株式会社日立製作所, Kabushiki-gaisha Hitachi Seisakusho) (Japanese pronunciation: [çiꜜtatɕi]) is a Japanese multinational conglomerate company headquartered in Chiyoda, Tokyo, Japan. It is the parent company of the Hitachi
Hitachi
Group (Hitachi Gurūpu) and forms part of the DKB Group of companies
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TSMC
Taiwan
Taiwan
Semiconductor
Semiconductor
Manufacturing Company, Limited (TSMC; Chinese: 台灣積體電路製造公司; pinyin: Táiwān Jī Tǐ Diànlù Zhìzào Gōngsī), also known as
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