XDR2 DRAM
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XDR2 DRAM
XDR2 DRAM was a proposed type of dynamic random-access memory that was offered by Rambus. It was announced on July 7, 2005 and the specification for which was released on March 26, 2008. Rambus has designed XDR2 as an evolution of, and the successor to, XDR DRAM. XDR2 DRAM is intended for use in high-end graphics cards and networking equipment. As a fabless semiconductor company, Rambus only produces a design; it must make deals with memory manufacturers to produce XDR2 DRAM chips, and there has been a notable lack of interest in doing so. Changes from XDR DRAM Signaling In addition to a higher clock rate (up to 800 MHz), the XDR2 differential data lines transfer data at 16 times the system clock rate, transferring 16 bits per pin per clock cycle. This "Hexadecimal Data Rate" is twice XDR's 8× multiplier. The basic burst size has also doubled. Unlike XDR, memory commands are also transmitted over differential point-to-point links at this high data rate. The command bus ...
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Dynamic Random-access Memory
Dynamic random-access memory (dynamic RAM or DRAM) is a type of random-access semiconductor memory that stores each bit of data in a memory cell, usually consisting of a tiny capacitor and a transistor, both typically based on metal-oxide-semiconductor (MOS) technology. While most DRAM memory cell designs use a capacitor and transistor, some only use two transistors. In the designs where a capacitor is used, the capacitor can either be charged or discharged; these two states are taken to represent the two values of a bit, conventionally called 0 and 1. The electric charge on the capacitors gradually leaks away; without intervention the data on the capacitor would soon be lost. To prevent this, DRAM requires an external '' memory refresh'' circuit which periodically rewrites the data in the capacitors, restoring them to their original charge. This refresh process is the defining characteristic of dynamic random-access memory, in contrast to static random-access memory ...
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