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Plating
Plating is a surface covering in which a metal is deposited on a conductive surface. Plating has been done for hundreds of years; it is also critical for modern technology. Plating is used to decorate objects, for corrosion inhibition, to improve solderability, to harden, to improve wearability, to reduce friction, to improve paint adhesion, to alter conductivity, to improve IR reflectivity, for radiation shielding, and for other purposes. Jewelry typically uses plating to give a silver or gold finish. Thin-film deposition has plated objects as small as an atom, therefore plating finds uses in nanotechnology. There are several plating methods, and many variations. In one method, a solid surface is covered with a metal sheet, and then heat and pressure are applied to fuse them (a version of this is Sheffield plate). Other plating techniques include electroplating, vapor deposition under vacuum and sputter deposition. Recently, plating often refers to using liquids. Metallizing ...
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Electroless Nickel Plating
Electroless nickel-phosphorus plating is a chemical process that deposits an even layer of nickel-phosphorus alloy on the surface of a solid substrate, like metal or plastic. The process involves dipping the substrate in a water solution containing nickel salt and a phosphorus-containing reducing agent, usually a hypophosphite salt. It is the most common version of electroless nickel plating (EN plating) and is often referred by that name. A similar process uses a borohydride reducing agent, yielding a nickel-boron coating instead. Unlike electroplating, electroless plating processes in general do not require passing an electric current through the bath and the substrate; the reduction of the metal cations in solution to metallic is achieved by purely chemical means, through an autocatalytic reaction. Thus electroless plating creates an even layer of metal regardless of the geometry of the surface – in contrast to electroplating which suffers from uneven current density du ...
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Electroplating
Electroplating, also known as electrochemical deposition or electrodeposition, is a process for producing a metal coating on a solid substrate through the reduction of cations of that metal by means of a direct electric current. The part to be coated acts as the cathode (negative electrode) of an electrolytic cell; the electrolyte is a solution of a salt of the metal to be coated; and the anode (positive electrode) is usually either a block of that metal, or of some inert conductive material. The current is provided by an external power supply. Electroplating is widely used in industry and decorative arts to improve the surface qualities of objects—such as resistance to abrasion and corrosion, lubricity, reflectivity, electrical conductivity, or appearance. It is used to build up thickness on undersized or worn-out parts, or to manufacture metal plates with complex shape, a process called electroforming. It is used to deposit copper and other conductors in forming pr ...
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Sheffield Plate
Sheffield plate is a layered combination of silver and copper that was used for many years to produce a wide range of household articles. Almost every article made in sterling silver was also crafted by Sheffield makers, who used this manufacturing process to produce nearly identical wares at far less cost. History The material was accidentally invented by Thomas Boulsover, of Sheffield's Cutlers Company, in 1743. While trying to repair the handle of a customer's decorative knife, he heated it too much and the silver started to melt. When he examined the damaged handle, he noticed that the silver and copper had fused together very strongly. Experiments showed that the two metals behaved as one when he tried to reshape them, even though he could clearly see the two different layers. Boulsover set up in business, funded by Strelley Pegge of Beauchief, and carried out further experiments in which he put a thin sheet of silver on a thick ingot of copper and heated the two toge ...
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Corrosion
Corrosion is a natural process that converts a refined metal into a more chemically stable oxide. It is the gradual deterioration of materials (usually a metal) by chemical or electrochemical reaction with their environment. Corrosion engineering is the field dedicated to controlling and preventing corrosion. In the most common use of the word, this means electrochemical oxidation of metal in reaction with an oxidant such as oxygen, hydrogen or hydroxide. Rusting, the formation of iron oxides, is a well-known example of electrochemical corrosion. This type of damage typically produces oxide(s) or salt(s) of the original metal and results in a distinctive orange colouration. Corrosion can also occur in materials other than metals, such as ceramics or polymers, although in this context, the term "degradation" is more common. Corrosion degrades the useful properties of materials and structures including strength, appearance and permeability to liquids and gases. Many str ...
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Metallizing
Metallizing is the general name for the technique of coating metal on the surface of objects. Metallic coatings may be decorative, protective or functional. Techniques for metallization started as early as mirror making. In 1835, Justus von Liebig discovered the process of coating a glass surface with metallic silver, making the glass mirror one of the earliest items being metallized. Plating other non-metallic objects grew rapidly with introduction of ABS plastic. Because a non-metallic object tends to be a poor electrical conductor, the object's surface must be made conductive before plating can be performed. The plastic part is first etched chemically by a suitable process, such as dipping in a hot chromic acid- sulfuric acid mixture. The etched surface is sensitised and activated by first dipping in tin(II) chloride solution, then palladium chloride solution. The processed surface is then coated with electroless copper or nickel before further plating. This process giv ...
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Gold Plating
Gold plating is a method of depositing a thin layer of gold onto the surface of another metal, most often copper or silver (to make silver-gilt), by chemical or electrochemical plating. This article covers plating methods used in the modern electronics industry; for more traditional methods, often used for much larger objects, see gilding. Types There are several types of gold plating used in the electronics industry: * ''Soft, pure gold plating'' is used in the semiconductor industry. The gold layer is easily soldered and wire bonded. Its Knoop hardness ranges between 60 and 85. The plating baths have to be kept free of contamination. * ''Soft, pure gold'' is deposited from special electrolytes. Entire printed circuit boards can be plated. This technology can be used for depositing layers suitable for wire bonding. * ''Bright hard gold on contacts'', with Knoop hardness between 120–300 and purity of 99.7–99.9% gold. Often contains a small amount of nickel and/or cobalt ...
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Sodium Hypophosphite
Sodium hypophosphite (NaPO2H2, also known as sodium phosphinate) is the sodium salt of hypophosphorous acid and is often encountered as the monohydrate, NaPO2H2·H2O. It is a solid at room temperature, appearing as odorless white crystals. It is soluble in water, and easily absorbs moisture from the air. Sodium hypophosphite should be kept in a cool, dry place, isolated from oxidizing materials. It decomposes into phosphine which is irritating to the respiratory tract and disodium phosphate. :2 NaH2PO2 → PH3 + Na2HPO4 Uses Like other hypophosphites, sodium hypophosphite can reduce metal ions back into base metal. This forms the basis for electroless nickel plating (Ni-P), which is its main industrial application. With this method, a durable nickel-phosphorus film can coat objects with irregular surfaces, such as in avionics, aviation and the petroleum field. Sodium hypophosphite is capable of reducing nickel ions in solution to metallic nickel on metal substrates as well as ...
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Printed Circuit Board
A printed circuit board (PCB; also printed wiring board or PWB) is a medium used in electrical and electronic engineering to connect electronic components to one another in a controlled manner. It takes the form of a laminated sandwich structure of conductive and insulating layers: each of the conductive layers is designed with an artwork pattern of traces, planes and other features (similar to wires on a flat surface) etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate. Electrical components may be fixed to conductive pads on the outer layers in the shape designed to accept the component's terminals, generally by means of soldering, to both electrically connect and mechanically fasten them to it. Another manufacturing process adds vias: plated-through holes that allow interconnections between layers. Printed circuit boards are used in nearly all electronic products. Alternatives to PCBs include wire ...
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Thin-film Deposition
A thin film is a layer of material ranging from fractions of a nanometer (monolayer) to several micrometers in thickness. The controlled synthesis of materials as thin films (a process referred to as deposition) is a fundamental step in many applications. A familiar example is the household mirror, which typically has a thin metal coating on the back of a sheet of glass to form a reflective interface. The process of silvering was once commonly used to produce mirrors, while more recently the metal layer is deposited using techniques such as sputtering. Advances in thin film deposition techniques during the 20th century have enabled a wide range of technological breakthroughs in areas such as magnetic recording media, electronic semiconductor devices, integrated passive devices, LEDs, optical coatings (such as antireflective coatings), hard coatings on cutting tools, and for both energy generation (e.g. thin-film solar cells) and storage ( thin-film batteries). It is also bein ...
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Catalytic
Catalysis () is the process of increasing the rate of a chemical reaction by adding a substance known as a catalyst (). Catalysts are not consumed in the reaction and remain unchanged after it. If the reaction is rapid and the catalyst recycles quickly, very small amounts of catalyst often suffice; mixing, surface area, and temperature are important factors in reaction rate. Catalysts generally react with one or more reactants to form intermediates that subsequently give the final reaction product, in the process of regenerating the catalyst. Catalysis may be classified as either homogeneous, whose components are dispersed in the same phase (usually gaseous or liquid) as the reactant, or heterogeneous, whose components are not in the same phase. Enzymes and other biocatalysts are often considered as a third category. Catalysis is ubiquitous in chemical industry of all kinds. Estimates are that 90% of all commercially produced chemical products involve catalysts at some stag ...
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Angel Gilding
Angel gilding is gilding glass or gold plating by electroless chemical deposition. Gold chloride is dissolved in water, mixed with other chemicals and poured on clean glass that has been treated with stannous chloride. The gold layer is delicate and usually translucent. To make an opaque, affordable and adherent mirror, a layer of silver is deposited over the gold. Glass gilders use the term ''angel gilding'' to distinguish the chemical process from gold leaf gilding also known as '' verre églomisé''. History Justus von Liebig, widely credited with inventing the modern process for silvering glass, also worked on gilding glass with gold chloride. James Pratt, a British glass worker, was the first to realize that he could make affordable gold mirrors by depositing a layer of silver on top of the gold. He was granted a British patent in 1885. Gold mirrors and gold mirrored signs were very popular in English public houses (pubs) in the late Victorian era and many wonderful exam ...
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Thiourea
Thiourea () is an organosulfur compound with the formula and the structure . It is structurally similar to urea (), except that the oxygen atom is replaced by a sulfur atom (as implied by the ''thio-'' prefix); however, the properties of urea and thiourea differ significantly. Thiourea is a reagent in organic synthesis. " Thioureas" refer to a broad class of compounds with the general structure . Thioureas are related to thioamides, e.g. , where R is methyl, ethyl, etc. Structure and bonding Thiourea is a planar molecule. The C=S bond distance is 1.71 Å. The C-N distances average 1.33 Å. The weakening of the C-S bond by C-N pi-bonding is indicated by the short C=S bond in thiobenzophenone, which is 1.63 Å. Thiourea occurs in two tautomeric forms, of which the thione form predominates in aqueous solutions. The equilibrium constant has been calculated as ''K''eq is . The thiol form, which is also known as an isothiourea, can be encountered in substituted compounds such a ...
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