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Chip Carrier
In electronics, a chip carrier is one of several kinds of surface mount technology packages for integrated circuits (commonly called "chips"). Connections are made on all four edges of a square package; Compared to the internal cavity for mounting the integrated circuit, the package overall size is large.[1]Contents1 Types 2 Plastic
Plastic
leaded chip carrier 3 Leadless 4 See also 5 ReferencesTypes[edit] Chip carriers may have either J-shaped metal leads for connections by solder or by a socket, or may be lead-less with metal pads for connections. If the leads extend beyond the package, the preferred description is "flat pack".[1] Chip carriers are smaller than dual in-line packages and since they use all four edges of the package can have a larger pin count. Chip carriers may be made of ceramic or plastic. Some forms of chip carrier package are standardized in dimensions and registered with trade industry associations such as JEDEC
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Microcontroller
A microcontroller (or MCU for microcontroller unit) is a small computer on a single integrated circuit. In modern terminology, it is similar to, but less sophisticated than, a system on a chip or SoC; an SoC may include a microcontroller as one of its components. A microcontroller contains one or more CPUs (processor cores) along with memory and programmable input/output peripherals. Program memory in the form of ferroelectric RAM, NOR flash
NOR flash
or OTP ROM is also often included on chip, as well as a small amount of RAM. Microcontrollers are designed for embedded applications, in contrast to the microprocessors used in personal computers or other general purpose applications consisting of various discrete chips. Microcontrollers are used in automatically controlled products and devices, such as automobile engine control systems, implantable medical devices, remote controls, office machines, appliances, power tools, toys and other embedded systems
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Plastic
Note 1: The use of this term instead of polymer is a source of confusion and thus is not recommended. Note 2: This term is used in polymer engineering for materials often compounded that can be processed by flow.[1] Plastic
Plastic
is material consisting of any of a wide range of synthetic or semi-synthetic organic compounds that are malleable and so can be molded into solid objects. Plasticity is the general property of all materials which can deform irreversibly without breaking but, in the class of moldable polymers, this occurs to such a degree that their actual name derives from this specific ability. Plastics are typically organic polymers of high molecular mass and often contain other substances
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Wafer (electronics)
A wafer, also called a slice or substrate,[1] is a thin slice of semiconductor material, such as a crystalline silicon, used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells. The wafer serves as the substrate for microelectronic devices built in and over the wafer and undergoes many microfabrication process steps such as doping or ion implantation, etching, deposition of various materials, and photolithographic patterning
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TO-263
The D2PAK or DDPAK, standardized as TO-263, refers to a semiconductor package type intended for surface mounting on circuit boards. They are similar to the earlier TO-220-style packages intended for high power dissipation but lack the extended metal tab and mounting hole, and also represent a larger version of the DPAK SMT package
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TO-252
TO-252, also known as DPAK[1] or Decawat Package, is a semiconductor package for surface mounting on circuit boards[2]. It represents a surface-mount[3] variant of TO-251 package, and smaller variant of the D2PAK package. It is often used for high power MOSFETs and voltage regulators.Contents1 Variants 2 See also 3 References 4 External linksVariants[edit] Package can have 3 pins with 90 mils pitch, or 5 pins with 45 mils pitch. See also[edit]TO-251 TO-263References[edit]^ Prasad, Ray (2013-11-27). Surface Mount Technology: Principles and Practice. Springer Science & Business Media. pp. 113–. ISBN 9781461540847. Retrieved 23 June 2017.  ^ "DPAK - Discrete or Decawatt Package". eesemi.com. Retrieved 15 May 2017.  ^ Hinch, Stephen W. (1988-01-01). Handbook of Surface Mount Technology. Longman Scientific & Technical. ISBN 9780470210949
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TO-66
TO-66
TO-66
is a type of semiconductor package for devices with three pins, such as transistors
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TO-5
In electronics, TO-5
TO-5
is a designation for a standardized metal semiconductor package used for transistors and some integrated circuits. The TO element stands for "transistor outline" and refers to a series of technical drawings produced by JEDEC.[1] The typical TO-5
TO-5
package has a base diameter of 8.9 mm (0.35 in), a cap diameter of 8.1 mm (0.32 in), a cap height of 6.3 mm (0.25 in)[2]. There exist variants with from 2 up to 10 pins. The pins are isolated from the package by individual glass-metal seals, or by a single resin potting. Sometimes one pin is connected directly to the metal case. There are multiple variants that differ from the regular 3-pin configuration. The H06C variant with 6 pins has its marker between pin 1 and 6, and H08A has 8 pins with the marker on the last one
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Small-outline Transistor
A small outline transistor (SOT) is a small footprint, discrete surface mount transistor commonly used in consumer electronics
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Electronics
[1] Electronics
Electronics
is the science of dealing with the development and application of devices and systems involving the flow of electrons in a vacuum, in gaseous media, and in semiconductors. Electronics
Electronics
deals with electrical circuits that involve active electrical components such as vacuum tubes, transistors, diodes, integrated circuits, optoelectronics, and sensors, associated passive electrical components, and interconnection technologies
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DO-214
DO-214
DO-214
is a standard that specifies a group of semiconductor packages for surface mounted diodes. Overview[edit] The standard[2] includes multiple package variants:[3][4]DO-214AA, also known as SMB,[5] is the middle size. DO-214AB, also known as SMC,[6] is the largest size. DO-214AC, also known as SMA,[7] is the smallest size. DO-214BA, also known as GF1See also[edit]SMA connector SMB connector SMC connectorReferences[edit]^ M7 general purpose diode; Kingtonics. ^ DO-214-D; JEDEC ^ PDD Marking (PDF), Vishay General
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Metal Electrode Leadless Face
Metal electrode leadless face
Metal electrode leadless face
(MELF) is a type of leadless cylindrical electronic surface mount device that is metallized at its ends. MELF devices are usually diodes and resistors.[1] The EN 140401-803 and DO-213 standards describe multiple MELF components.[2]MELF (MMB) 0207 L: 5.8 mm, Ø: 2.2 mm 1.0 W, 500 V MiniMELF (MMA) 0204 L: 3.6 mm, Ø: 1.4 mm 0.25 W, 200 V MicroMELF (MMU) 0102 L: 2.2 mm, Ø: 1.1 mm 0.2 W, 100 VContents1 Handling difficulties 2 Technical advantages 3 References 4 External linksHandling difficulties[edit]Zener diode for high-reliability applications in QuadroMELF package.Because of their cylindrical shape and small size, in some cases these components can easily roll off the workbench or circuit board before they have been soldered into place
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DO-204
DO-204
DO-204
is a family of diode semiconductor packages defined by JEDEC. This family comprises lead-mounted axial devices with round leads. Generally a diode will have a line painted near the cathode end.Contents1 Dimensions 2 Common variants2.1 DO-7 2.2 DO-35 2.3 DO-413 References 4 External linksDimensions[edit]Variants included in DO-204[1]Variant Other standards[2]Dimensions (mm)ABCDEmin max min max min max min max min maxAA DO-7 [3] 25.40 38.10 5.85 7.65 0.46 0.55 2.16 2.71 — 1.27AB DO-14 [4] 25.
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Diode
A diode is a two-terminal electronic component that conducts current primarily in one direction (asymmetric conductance); it has low (ideally zero) resistance in one direction, and high (ideally infinite) resistance in the other. A semiconductor diode, the most common type today, is a crystalline piece of semiconductor material with a p–n junction connected to two electrical terminals.[5] A vacuum tube diode has two electrodes, a plate (anode) and a heated cathode. Semiconductor
Semiconductor
diodes were the first semiconductor electronic devices. The discovery of crystals' rectifying abilities was made by German physicist Ferdinand Braun
Ferdinand Braun
in 1874. The first semiconductor diodes, called cat's whisker diodes, developed around 1906, were made of mineral crystals such as galena
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Special
Special
Special
or specials may refer to:Contents1 Music 2 Film and television 3 Other uses 4 See alsoMusic[edit] Special
Special
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International Standard Book Number
"ISBN" redirects here. For other uses, see ISBN (other).International Standard Book
Book
NumberA 13-digit ISBN, 978-3-16-148410-0, as represented by an EAN-13 bar codeAcronym ISBNIntroduced 1970; 48 years ago (1970)Managing organisation International ISBN AgencyNo. of digits 13 (formerly 10)Check digit Weighted sumExample 978-3-16-148410-0Website www.isbn-international.orgThe International Standard Book
Book
Number (ISBN) is a unique[a][b] numeric commercial book identifier. Publishers purchase ISBNs from an affiliate of the International ISBN Agency.[1] An ISBN is assigned to each edition and variation (except reprintings) of a book. For example, an e-book, a paperback and a hardcover edition of the same book would each have a different ISBN. The ISBN is 13 digits long if assigned on or after 1 January 2007, and 10 digits long if assigned before 2007
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